GB2425897B - Retention module with EMI suppression - Google Patents

Retention module with EMI suppression

Info

Publication number
GB2425897B
GB2425897B GB0521526A GB0521526A GB2425897B GB 2425897 B GB2425897 B GB 2425897B GB 0521526 A GB0521526 A GB 0521526A GB 0521526 A GB0521526 A GB 0521526A GB 2425897 B GB2425897 B GB 2425897B
Authority
GB
United Kingdom
Prior art keywords
retention module
emi suppression
emi
suppression
retention
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0521526A
Other versions
GB0521526D0 (en
GB2425897A (en
Inventor
Chih-Ming Lai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giga Byte Technology Co Ltd
Original Assignee
Giga Byte Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giga Byte Technology Co Ltd filed Critical Giga Byte Technology Co Ltd
Priority to GB0521526A priority Critical patent/GB2425897B/en
Publication of GB0521526D0 publication Critical patent/GB0521526D0/en
Publication of GB2425897A publication Critical patent/GB2425897A/en
Application granted granted Critical
Publication of GB2425897B publication Critical patent/GB2425897B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
GB0521526A 2005-10-21 2005-10-21 Retention module with EMI suppression Expired - Fee Related GB2425897B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0521526A GB2425897B (en) 2005-10-21 2005-10-21 Retention module with EMI suppression

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0521526A GB2425897B (en) 2005-10-21 2005-10-21 Retention module with EMI suppression

Publications (3)

Publication Number Publication Date
GB0521526D0 GB0521526D0 (en) 2005-11-30
GB2425897A GB2425897A (en) 2006-11-08
GB2425897B true GB2425897B (en) 2007-06-13

Family

ID=35458500

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0521526A Expired - Fee Related GB2425897B (en) 2005-10-21 2005-10-21 Retention module with EMI suppression

Country Status (1)

Country Link
GB (1) GB2425897B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140153192A1 (en) * 2012-12-05 2014-06-05 Molex Incorporated Module cage with integrated emi aspect

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6205026B1 (en) * 2000-01-31 2001-03-20 Intel Corporation Heat sink retention components and system
US6346672B1 (en) * 2000-07-03 2002-02-12 Chin Fu Horng Structure for preventing electromagnetic interference of central processing unit
US20030133248A1 (en) * 2002-01-08 2003-07-17 Asia Vital Components Co., Ltd. Structure for eliminating electromagnetic interference caused by central processing unit
US20040132331A1 (en) * 2003-01-07 2004-07-08 Osborn Jay Kevin Support and grounding structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6205026B1 (en) * 2000-01-31 2001-03-20 Intel Corporation Heat sink retention components and system
US6346672B1 (en) * 2000-07-03 2002-02-12 Chin Fu Horng Structure for preventing electromagnetic interference of central processing unit
US20030133248A1 (en) * 2002-01-08 2003-07-17 Asia Vital Components Co., Ltd. Structure for eliminating electromagnetic interference caused by central processing unit
US20040132331A1 (en) * 2003-01-07 2004-07-08 Osborn Jay Kevin Support and grounding structure

Also Published As

Publication number Publication date
GB0521526D0 (en) 2005-11-30
GB2425897A (en) 2006-11-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20151021