GB2423633B - Methods and apparatus for processing wafers - Google Patents
Methods and apparatus for processing wafersInfo
- Publication number
- GB2423633B GB2423633B GB0503688A GB0503688A GB2423633B GB 2423633 B GB2423633 B GB 2423633B GB 0503688 A GB0503688 A GB 0503688A GB 0503688 A GB0503688 A GB 0503688A GB 2423633 B GB2423633 B GB 2423633B
- Authority
- GB
- United Kingdom
- Prior art keywords
- methods
- processing wafers
- wafers
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0503688A GB2423633B (en) | 2005-02-23 | 2005-02-23 | Methods and apparatus for processing wafers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0503688A GB2423633B (en) | 2005-02-23 | 2005-02-23 | Methods and apparatus for processing wafers |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0503688D0 GB0503688D0 (en) | 2005-03-30 |
GB2423633A GB2423633A (en) | 2006-08-30 |
GB2423633B true GB2423633B (en) | 2010-09-22 |
Family
ID=34401156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0503688A Active GB2423633B (en) | 2005-02-23 | 2005-02-23 | Methods and apparatus for processing wafers |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2423633B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5911833A (en) * | 1997-01-15 | 1999-06-15 | Lam Research Corporation | Method of in-situ cleaning of a chuck within a plasma chamber |
US6060397A (en) * | 1995-07-14 | 2000-05-09 | Applied Materials, Inc. | Gas chemistry for improved in-situ cleaning of residue for a CVD apparatus |
-
2005
- 2005-02-23 GB GB0503688A patent/GB2423633B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6060397A (en) * | 1995-07-14 | 2000-05-09 | Applied Materials, Inc. | Gas chemistry for improved in-situ cleaning of residue for a CVD apparatus |
US5911833A (en) * | 1997-01-15 | 1999-06-15 | Lam Research Corporation | Method of in-situ cleaning of a chuck within a plasma chamber |
Also Published As
Publication number | Publication date |
---|---|
GB2423633A (en) | 2006-08-30 |
GB0503688D0 (en) | 2005-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20150716 AND 20150722 |