GB2423633B - Methods and apparatus for processing wafers - Google Patents

Methods and apparatus for processing wafers

Info

Publication number
GB2423633B
GB2423633B GB0503688A GB0503688A GB2423633B GB 2423633 B GB2423633 B GB 2423633B GB 0503688 A GB0503688 A GB 0503688A GB 0503688 A GB0503688 A GB 0503688A GB 2423633 B GB2423633 B GB 2423633B
Authority
GB
United Kingdom
Prior art keywords
methods
processing wafers
wafers
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB0503688A
Other versions
GB2423633A (en
GB0503688D0 (en
Inventor
Nicholas John
Kevin Powell
David Andrew Tossell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trikon Technologies Ltd
Aviza Europe Ltd
SPP Process Technology Systems UK Ltd
Original Assignee
Trikon Technologies Ltd
Aviza Europe Ltd
SPP Process Technology Systems UK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trikon Technologies Ltd, Aviza Europe Ltd, SPP Process Technology Systems UK Ltd filed Critical Trikon Technologies Ltd
Priority to GB0503688A priority Critical patent/GB2423633B/en
Publication of GB0503688D0 publication Critical patent/GB0503688D0/en
Publication of GB2423633A publication Critical patent/GB2423633A/en
Application granted granted Critical
Publication of GB2423633B publication Critical patent/GB2423633B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Drying Of Semiconductors (AREA)
GB0503688A 2005-02-23 2005-02-23 Methods and apparatus for processing wafers Active GB2423633B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0503688A GB2423633B (en) 2005-02-23 2005-02-23 Methods and apparatus for processing wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0503688A GB2423633B (en) 2005-02-23 2005-02-23 Methods and apparatus for processing wafers

Publications (3)

Publication Number Publication Date
GB0503688D0 GB0503688D0 (en) 2005-03-30
GB2423633A GB2423633A (en) 2006-08-30
GB2423633B true GB2423633B (en) 2010-09-22

Family

ID=34401156

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0503688A Active GB2423633B (en) 2005-02-23 2005-02-23 Methods and apparatus for processing wafers

Country Status (1)

Country Link
GB (1) GB2423633B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5911833A (en) * 1997-01-15 1999-06-15 Lam Research Corporation Method of in-situ cleaning of a chuck within a plasma chamber
US6060397A (en) * 1995-07-14 2000-05-09 Applied Materials, Inc. Gas chemistry for improved in-situ cleaning of residue for a CVD apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6060397A (en) * 1995-07-14 2000-05-09 Applied Materials, Inc. Gas chemistry for improved in-situ cleaning of residue for a CVD apparatus
US5911833A (en) * 1997-01-15 1999-06-15 Lam Research Corporation Method of in-situ cleaning of a chuck within a plasma chamber

Also Published As

Publication number Publication date
GB2423633A (en) 2006-08-30
GB0503688D0 (en) 2005-03-30

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Legal Events

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732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20150716 AND 20150722