GB2417221A - A device for re-positioning the legs of semi conductors whilst they are still in their packaging - Google Patents

A device for re-positioning the legs of semi conductors whilst they are still in their packaging Download PDF

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Publication number
GB2417221A
GB2417221A GB0418615A GB0418615A GB2417221A GB 2417221 A GB2417221 A GB 2417221A GB 0418615 A GB0418615 A GB 0418615A GB 0418615 A GB0418615 A GB 0418615A GB 2417221 A GB2417221 A GB 2417221A
Authority
GB
United Kingdom
Prior art keywords
packaging
legs
semi conductors
semi
roller bearings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0418615A
Other versions
GB0418615D0 (en
Inventor
Glenn Brazier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB0418615A priority Critical patent/GB2417221A/en
Publication of GB0418615D0 publication Critical patent/GB0418615D0/en
Publication of GB2417221A publication Critical patent/GB2417221A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Attitude Control For Articles On Conveyors (AREA)

Abstract

A device that is designed to re-position the legs of semi conductors without the need to remove them from their packaging. The semi conductors, complete with packaging, are placed between metal guides (3) and the user slides the the packaging between roller bearings (1). The guides (3) ensure that the packaging remains correctly aligned as it passes between the roller bearings (3). The act of sliding the packaging between the roller bearings (1) re-positions the legs of the semi conductors within.

Description

DESCRIPTION
A DEVISE FOR RE-POSITIONING THE LEGS OF SEMI CONDUCTORS
WHILST THEY ARE STILL IN THERE PACKAGING.
A devise for re-positioning the legs of a semi conductor, whilst they are still in there packaging; Comprising of (1) Roller bearings, these are used to straighten the legs as the packaging tube is passed through them. (2) Is the base plate made from a metal. (3) are metal guides to keep the packaging tube in line whilst they are being pushed through the roller bearings(l)

Claims (4)

1. A device to re-position the legs of semi conductors whilst they are still in their packaging, comprising roller bearings a metal base plate and metal guides.
2. A device to re-position the legs of semi conductors as claimed in claim 1 wherein the roller bearings are fixed to the metal base and straighten the legs of the semi conductors as they are passed between them in their packaging.
3. A device to re-position the legs of semi conductors as claimed in claim I wherein the metal guides are fixed to the metal base and ensure that the semi conductor packaging is passed between the roller bearings in the correct position.
4. A device to re-position the legs of semi conductors as described herein with reference to all aspects of the accompanying drawing.
GB0418615A 2004-08-20 2004-08-20 A device for re-positioning the legs of semi conductors whilst they are still in their packaging Withdrawn GB2417221A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0418615A GB2417221A (en) 2004-08-20 2004-08-20 A device for re-positioning the legs of semi conductors whilst they are still in their packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0418615A GB2417221A (en) 2004-08-20 2004-08-20 A device for re-positioning the legs of semi conductors whilst they are still in their packaging

Publications (2)

Publication Number Publication Date
GB0418615D0 GB0418615D0 (en) 2004-09-22
GB2417221A true GB2417221A (en) 2006-02-22

Family

ID=33042394

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0418615A Withdrawn GB2417221A (en) 2004-08-20 2004-08-20 A device for re-positioning the legs of semi conductors whilst they are still in their packaging

Country Status (1)

Country Link
GB (1) GB2417221A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0414647A2 (en) * 1989-07-18 1991-02-27 STMicroelectronics S.r.l. Method for the fabrication of a lead frame
US20010041385A1 (en) * 1998-03-23 2001-11-15 Stmicroelectronics S.R.I. Plated leadframes with cantilevered leads
US6376283B1 (en) * 2000-04-19 2002-04-23 Power Digital Card Co., Ltd. Mono-chip multimediacard fabrication method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0414647A2 (en) * 1989-07-18 1991-02-27 STMicroelectronics S.r.l. Method for the fabrication of a lead frame
US20010041385A1 (en) * 1998-03-23 2001-11-15 Stmicroelectronics S.R.I. Plated leadframes with cantilevered leads
US6376283B1 (en) * 2000-04-19 2002-04-23 Power Digital Card Co., Ltd. Mono-chip multimediacard fabrication method

Also Published As

Publication number Publication date
GB0418615D0 (en) 2004-09-22

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)