GB2409072B - Memory module - Google Patents

Memory module

Info

Publication number
GB2409072B
GB2409072B GB0427039A GB0427039A GB2409072B GB 2409072 B GB2409072 B GB 2409072B GB 0427039 A GB0427039 A GB 0427039A GB 0427039 A GB0427039 A GB 0427039A GB 2409072 B GB2409072 B GB 2409072B
Authority
GB
United Kingdom
Prior art keywords
memory module
module
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB0427039A
Other versions
GB2409072A (en
GB0427039D0 (en
GB2409072A8 (en
Inventor
Shih-Hsiung Lien
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Optimum Care International Tech Inc
Original Assignee
Optimum Care International Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW092221731U external-priority patent/TWM256570U/en
Priority claimed from TW092221729U external-priority patent/TWM256569U/en
Application filed by Optimum Care International Tech Inc filed Critical Optimum Care International Tech Inc
Publication of GB0427039D0 publication Critical patent/GB0427039D0/en
Publication of GB2409072A publication Critical patent/GB2409072A/en
Publication of GB2409072A8 publication Critical patent/GB2409072A8/en
Application granted granted Critical
Publication of GB2409072B publication Critical patent/GB2409072B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184—Mounting of motherboards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09963—Programming circuit by using small elements, e.g. small PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)
GB0427039A 2003-12-09 2004-12-09 Memory module Active GB2409072B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW092221731U TWM256570U (en) 2003-12-09 2003-12-09 Memory module device
TW092221729U TWM256569U (en) 2003-12-09 2003-12-09 Memory module device

Publications (4)

Publication Number Publication Date
GB0427039D0 GB0427039D0 (en) 2005-01-12
GB2409072A GB2409072A (en) 2005-06-15
GB2409072A8 GB2409072A8 (en) 2005-09-14
GB2409072B true GB2409072B (en) 2005-11-23

Family

ID=34082503

Family Applications (2)

Application Number Title Priority Date Filing Date
GB0426943A Ceased GB0426943D0 (en) 2003-12-09 2004-12-09 Memory module
GB0427039A Active GB2409072B (en) 2003-12-09 2004-12-09 Memory module

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB0426943A Ceased GB0426943D0 (en) 2003-12-09 2004-12-09 Memory module

Country Status (1)

Country Link
GB (2) GB0426943D0 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035345A (en) * 2009-08-06 2011-02-17 Fujitsu Ltd Semiconductor device module, electronic circuit unit, electronic device, and method of manufacturing semiconductor device module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0798619A (en) * 1993-09-29 1995-04-11 Toshiba Corp Memory card system
US5834843A (en) * 1994-06-20 1998-11-10 Fujitsu Limited Multi-chip semiconductor chip module
US5941714A (en) * 1997-09-23 1999-08-24 Massachusetts Institute Of Technology Digital communication, programmable functioning and data transfer using modular, hinged processor elements
JP2000260931A (en) * 1999-03-05 2000-09-22 Hitachi Ltd Semiconductor device and its manufacture
WO2001099189A1 (en) * 2000-06-19 2001-12-27 Advantest Corporation Method and apparatus for edge connection between elements of an integrated circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0798619A (en) * 1993-09-29 1995-04-11 Toshiba Corp Memory card system
US5834843A (en) * 1994-06-20 1998-11-10 Fujitsu Limited Multi-chip semiconductor chip module
US5941714A (en) * 1997-09-23 1999-08-24 Massachusetts Institute Of Technology Digital communication, programmable functioning and data transfer using modular, hinged processor elements
JP2000260931A (en) * 1999-03-05 2000-09-22 Hitachi Ltd Semiconductor device and its manufacture
WO2001099189A1 (en) * 2000-06-19 2001-12-27 Advantest Corporation Method and apparatus for edge connection between elements of an integrated circuit

Also Published As

Publication number Publication date
GB2409072A (en) 2005-06-15
GB0427039D0 (en) 2005-01-12
GB2409072A8 (en) 2005-09-14
GB0426943D0 (en) 2005-01-12

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