GB2399089A - Curable polysiloxane compositions containing silicone mold release agents - Google Patents
Curable polysiloxane compositions containing silicone mold release agents Download PDFInfo
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- GB2399089A GB2399089A GB0401793A GB0401793A GB2399089A GB 2399089 A GB2399089 A GB 2399089A GB 0401793 A GB0401793 A GB 0401793A GB 0401793 A GB0401793 A GB 0401793A GB 2399089 A GB2399089 A GB 2399089A
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- polysiloxane
- mold release
- release agent
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- curable polysiloxane
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A curable polysiloxane composition including (i) a polysiloxane containing alkenyl radicals, (ii) a polysiloxane containing silicon-bonded hydrogen atoms, (iii) a platinum group metal catalyst, (iv) a treated inorganic filler, and (v) an improved mold release agent consisting of a polysiloxane that is free of silanol groups. The curable polysiloxane composition containing the improved mold release agent should be free of any other polysiloxane containing silanol functionality. Preferred mold release agents are trimethylsiloxy terminated polydimethylsiloxanes having a viscosity of about 100 centistoke (mm<2>/s) and less. The use of an organic peroxide in place of the polysiloxane (ii) and the platinum group catalyst (iii) is also referred to.
Description
1 2399089 Curable Polysiloxane Compositions Containing Improved Silicone
Mold Release Agents
FIELD OF THE INVENTION
100011 This invention relates to curable polysiloxane compositions which have improved mold release properties. The improvement eliminates many of the frequently encountered problems associated with resinous residues that gradually build up on a mold's surfaces, requiring that the molding device be taken out of service for cleaning. These curable polysiloxane compositions contain a certain mold release agent, which is capable of migrating to the mold's surface to act as a release agent without causing any resinous precipitate or build-up on the surface of the mold.
BACKGROUND OF THE INVENTION
10002] There are many polysiloxane compositions which are readily curable to give elastomeric rubbers. There are also many cure systems for such polysiloxane compositions, and a lengthy discussion of such systems is not required because they are well known to those skilled in the art.
100031 Some examples of the better-known techniques are for instance, exposing an acyloxy end-blocked polydimethylsiloxane to moisture, or contacting a hydroxy end-blocked, linear polydimethylsiloxane with ethylpolysilicate or alkyltrialkoxysilanes as crosslinking agents.
10004] Cures can also be effected by heating polysiloxanes containing unsaturated organic groups, in the presence of peroxides. Also, cured rubbers can be obtained by contacting polysiloxanes containing unsaturated organic groups, i.e., alkenyl radicals, with polysiloxanes containing silicon-bonded hydrogen, in the presence of a platinum or rhodium catalyst. A representative example of such a cure system can be found in US Patent $,789,084-(August 4, 1998), i.e., the '084 patent. Typically, such compositions inched an (i) polysiloxane containing alkenyl radicals, (ii) a crosslinking component which ifs apotisiloxane containing silicon-bonded hydrogen atoms, (iii) a platinum group catalyst, ( v) a treated inorganic 'tiller such as silica, and (v) various other additives for improving the properties' of the compositions or for facilitate their processing such as solvents,' inhibitors for the catalyst to prevent any pre-mature curing of the composition, flame retardants, heat stabilizers, pigments, and mold release agents.
100051 It is believed that the use of polysiloxane components containing silanol functionality, i.e., -Si-OH, in curable polysiloxane compositions can be a cause of the resinous structures referred to above to form and adhere to the mold. Therefore, the unique feature of the present invention resides in the features that (i) the curable polysiloxane composition is free of silanol groups, i.e., -Si-OH, and (ii) the mold release agent present in the curable polysiloxane composition is a trimethylsiloxy terminated polydimethylsiloxane which is also free of-Si- OH groups.
SUMMARY OF THE INVENTION
6] This invention is directed to a curable polysiloxane composition including (A) a polysiloxane containing alkenyl radicals, (B) a polysiloxane containing silicon-bonded hydrogen atoms, (C) a platinum group metal catalyst, (D) a treated inorganic filler, and (E) an additive for improving the properties of the curable polysiloxane composition. Alternatively (A) may comprise a polysiloxane optionally comprising alkenyl groups and the cross-linking agent (the combination of (B) and (C) above) may be replaced by (F) one or more organic peroxides which are capable of generating free radicals when heated to form crosslinks by reacting with the methyl and alkenyl (typically vinyl) groups on the linear high molecular weight silicone polymer. The improvement, according to the invention, resides in an additive which is a mold release agent consisting of a polysiloxane that is free of silanol groups. The invention includes the further provision that the curable polysiloxane composition containing the improved mold release agent, be free of any other polysiloxanes containing silanol functionality.
[00071 The most preferred of mold release agents are polydimethylsiloxanes having a viscosity measured at 25 C of about 100 centistoke (mm2/s) and less. The mold release agent can be used in the curable polysiloxane composition in amounts of 0. 1-2.0 weight percent, based on the total weight of the curable polysiloxane composition.
[00081 The invention is also directed to methods of making articles of manufacture in which the curable polysiloxane composition is fed into an injection molding device having a stationary molding surface and a movable molding surface, and the movable molding surface is separated from the stationary molding surface to obtain articles of manufacture.
10009] These and other features of the invention will become apparent from a consideration
of the detailed description.
DETAILED DESCRIPTION OF THE INVENTION
l0010l While reference may be had to the '084 patent, as well as other patents such as US Patent 5,859,094 (January 12, 1999), a brief description of the major components of curable polysiloxane compositions capable of being used in the present invention follows.
A. The Polysiloxane Containing Alkenyl Radicals 1 5 10011] The polysiloxane containing alkenyl radicals should have at least two lower alkenyl groups bonded to silicon atoms. It may be a linear or branched polysiloxane containing primarily monofunctional and difunctional units, but it may contain other types of units such as trifunctional and tetrafunctional units. Preferred are linear homopolymers or copolymers having a degree of polymerization (DP) of from 100 to 10,000. The lower alkenyl group can be, for example, vinyl, allyl, 1-propenyl, isopropenyl, or hexenyl groups, and the preferred group is vinyl. It is preferred that that there be at least two lower alkenyl groups in each molecule of the polysiloxane. While the position of the lower alkenyl groups on the silicone molecule is not critical, it is preferred that the lower alkenyl groups be separated as far as possible on the molecule. The amount of Component (A) is generally 35-75 percent by weight, based on the total weight of the curable polysiloxane composition.
(B) The Crosslinking Component - A Polysiloxane Containing Silicon-Bonded Hydrogen Atoms 10012] The polysiloxane containing silicon-bonded hydrogen atoms should have at least two hydrogen atoms bonded to silicon atoms in the same molecule. It may be a linear, cyclic, or branched polysiloxane containing primarily monofunctional and difunctional units, but it may contain other types of units such as trifunctional and tetratunctional units. Preferred are linear homopolymers or copolymers having a DP of from 500 to 2,000. Other groups which can be present include monovalent unsubstituted hydrocarbon groups such as methyl, ethyl, n-propyl, octyl, cyclohexyl and phenyl; and monovalent substituted hydrocarbon group such as tolyl, xylyl, benzyl, p-chlorophenyl or cyanoethyl. With the exception of the hydrogen atoms present, the groups are preferably methyl. The amount of Component (B) is generally in an amount sufficient to cure the curable polysiloxane composition, but it is more specifically in an amount such as to provide a ratio of silicon-bonded hydrogen atoms in Component (B) to alkenyl substituents in Component (A) within a range of 1:10 to 10:1.
(C). The Platinum Group Catalyst [00131 The catalyst can be any platinum group catalyst that is effective for the addition of silicon bonded hydrogen to silicon bonded lower alkenyl groups. Such catalysts can be, for example, finely divided elemental platinum, finely divided platinum on carbon black, chloroplatinic acid, coordination complexes of chloroplatinic acid and olefins, coordination complexes of chloroplatinic acid and vinylsiloxanes, tetrakis(triphenylphosphine)palladium, or mixtures of palladium black, triphenylphosphine, and rhodium. While the amount of the catalyst is not critical, it is preferred to use 0.1 to 20 parts per million parts of the total amount of components (A) and (B).
D. The Treated Inorganic Filler [00141 The treated inorganic filler is preferably a reinforcing silica filler, but it can be any of those useful for the reinforcement of curable polysiloxane compositions or a suitable combination thereof. Most preferred is when the reinforcing silica filler is a precipitated or fumed silica, with a fumed silica being most preferred. The treated reinforcing silica filler should have a BET surface area greater than about 50 m2/g. The reinforcing silica filler is treated with one or more of the silica treating agents known to improve the reinforcing function of silica, and to prevent the phenomenon typically referred to as creping or crepe hardening, which can occur during the storage of such compositions.
100151 The silica treating agent can be any silanol free low molecular weight organosilicon compound known as being suitable as a silica treating agent. Such treating agents typically include organosilicon compounds such as hexaorganodisiloxanes and hexaorganodisilazanes that hydrolyze under the conditions used to treat the silica. For the present compositions, the preferred silica treating agent are hexamethyldisilazane, tetramethyldivinyldisilazane, and mixtures thereof. The amount of Component (D) is generally 5-40 percent by weight, based on the total weight of the curable polysiloxane composition.
E. The Polysiloxane Mold Release Agent S 10016] The polysiloxane mold release agent according to the present invention is a polysiloxane containing no silanol functionality. It has a viscosity measured at 25 C of about centistoke (mm2/s) or less. Preferred are polysiloxanes with a viscosity of S. 1O, or about centistoke (mm2/s). Generally, such polysiloxanes have the following structure: 1 2 1 2 1 2 R1 1i 0 -1i 0 1i R1 R2 R2 n R2 l0017l In this structure, R1 and R2 each represent an alkyl group containing 1-6 carbon atoms, such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, pentyl, and hexyl. Most preferred for the alkyl group for each R1 and R2 is the methyl group. The degree of polymerization (DP) or the number of repeating units n determines the molecular weight, and hence the viscosity of the polysiloxane, and n according to this invention can vary from O to about 80. For example, a trimethylsiloxy terminated polydimethylsiloxane having a viscosity of about 100 centistoke (mm2/s) has a molecular weight of about 6,000, and so n would have a value of about 80. Most preferred therefore are silanol free polysiloxanes having the structure shown below: f Ha -f H3 -fH3 H3C I i O - ji 0- I i CH3 CH3 _CH3 _ cH3 0 o l0018l The polysiloxane mold release agent can be incorporated into the curable polysiloxane compositions in amounts of 0. 1-2.0 weight percent, based on the total weight of the curable polysiloxane composition.
F. Peroxide catalysts organic peroxides which are capable of generating free radicals when heated to form crosslinks by reacting with the methyl and vinyl groups on the linear high molecular weight silicone polymer. Some commonly used organic peroxides are the non-vinyl specific organic] peroxides such as benzoyl peroxide, 1,4-dichlorobenzoyl peroxide, 2,4dichlorobenzoyl peroxide, di-t-butyl peroxide, dicumyl peroxide, tertiary butyl-perbenzoate, and monochlorobenzoyl peroxide; and the vinyl specific organic peroxides such as ditertiary butyl peroxide, 2,5-bis(tertiarybutyl-peroxy)-2,5-dimethylhexane, tertiary-butyl-trimethyl peroxide, tertiary-butyl-tertiary-butyl-tertiary-triphenyl peroxide, and t-butyl perbenzoate.
G. Other additives 10019] Other additives and processing aids can be added to the curable polysiloxane; composition without deleterious effects on the cured material. Such additives and processing aids can consist of for example, organic solvents such as xylene, toluene and trichloroethylene; inhibitors for the platinum group catalyst such as benzotriazole, 2 ethynylisopropanol, and dimethyl sulfoxide; flame retardants and heat stabilizers such as manganese carbonate and carbon black; oil stabilizers; and pigments.
The Process [0020] The curable polysiloxane composition can be prepared by simply mixing all of the various components together. However, if all of the components are mixed together, a cure reaction will initiate at room temperature. Therefore, it may be preferred not to mix all of the components at the same time, unless the curable polysiloxane composition is to be used right away. In order to avoid premature curing, the various items shown in Table 2 can be separated into two mixtures, i.e., a Part A and a Part B. which are then mixed together just I before use, to obtain a cured polysiloxane. The curable polysiloxane can then be cured to obtain a gel, an elastomer, or a very solid rubber, depending upon the type and ratio in mixtures of the various items. The curable polysiloxane may be cured at room temperature, or the cure rate can be accelerated by applying heat. For example, it has been found to be advantageous to heat the curable polysiloxane composition to a temperature of 50-150 C or even higher.
10021] The cured polysiloxane adheres strongly to metals, glass, ceramics, stones, concrete, wood, paper, fibers, plastics, and rubber. The curable polysiloxane even has good adhesion properties while it is being curing to its final state. In addition to their primary use as mold release agents in accordance with this invention, the curable polysiloxane compositions can also be used as an adhesive for metal, glass, ceramic, stone, concrete, wood, paper, fiber, plastic, and rubber substrates; as well as a sealant, a coating material, an encapsulant, a] potting compound, or an impregnating agent.
1 0 EXAMPLES
2] The following examples are set forth in order to illustrate the invention in more detail.
Example 1
3] An experiment was conducted using an injection molding device for making rubber; articles. The molding device had a small gate size, deep wells, and was sensitive in revealing imperfections in parts due to mold contamination. The objective of the experiment was to eliminate certain resinous precipitates that had been forming on the mold. The apparatus used in the procedure consisted of two storage containers for feeding Part A and Part B of the curable polysiloxane composition. The materials were pumped from each storage container into and through a static mixer, and then fed into the molding device. The mold included a stationary molding surface and a movable molding surface, in which the movable molding surface could be separated from the stationary molding surface to obtain articles of manufacture.
4] One of several parameters selected for the test was that the test would encompass the use of two polysiloxane mold release agents in the curable polysiloxane composition. One polysiloxane mold release agent would be a polysiloxane containing silanol functionality, and I the other polysiloxane mold release agent would be a polysiloxane that was free of silanol functionality. In either case, the mold release agent was to be incorporated into the curable polysiloxane composition at a level of 0.51.5 weight percent, based on the total weight of the curable polysiloxane composition.
5] Some key response factors selected for evaluating the molding quality and the mold fouling issue were (i) the molding time, i.e., the actual amount of time that the mold was in service), (ii) the number of backing members and/or units produced, and a molding scale factor which would be ranked by the mold operator. Molding efficiency was determined by a microscopic evaluation of the parts as they were being produced. The mold was taken out of service when any defects were found believed to be the result of the resinous build up on face of the mold. a _
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_ _
_
_
Claims (5)
1. A curable polysiloxane composition comprising (i) a polysiloxane containing alkenyl radicals, (ii) a polysiloxane containing siliconbonded hydrogen atoms, (iii) a platinum group metal catalyst, (iv) a treated inorganic filler, and (v) at least one additive for improving the properties of the curable polysiloxane composition, the improvement which comprises using as additive (v) a mold release agent comprising a polysiloxane that is free of silanol groups, with the further provision that the curable polysiloxane composition containing the mold release agent be free of any other polysiloxanes containing silanol functionality.
2. A curable polysiloxane composition according to Claim 1 wherein the mold release agent has a viscosity measured at 25 C of about 100 centistoke (mm2/s) or less, and a structure generally corresponding to the formula: 1 2 1 2 1 2 R1 fi o li o Ii R1 R2 R2 n R2 and wherein R1 and R2 each represent an alkyl group containing 1-6 carbon atoms, and n has a value of 0 to about 80.
S
3. A curable polysiloxane composition according to Claim 2 wherein the mold release agent has a structure generally corresponding to the formula: fH3 -I H3 -I H3 H3C-I i O-- I i 0- I i CH3 CH3 _CH3 CH3 o no and wherein the mold release agent is present in the curable polysiloxane composition in an amount of 0.1-2.0 weight percent, based on the total weight of the curable polysiloxane 1 0 composition.
4. A curable polysiloxane composition in accordance with any preceding claim wherein (ii) and (iii) are replaced by an organic peroxide.
5. A method of making articles of manufacture comprising injection molding a curable polysiloxane composition according to any one of claims I to 4 into a molding device having a stationary molding surface and a movable molding surface, and separating the movable molding surface from the stationary molding surface to obtain the articles of manufacture.
Applications Claiming Priority (1)
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US45244403P | 2003-03-05 | 2003-03-05 |
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GB0401793D0 GB0401793D0 (en) | 2004-03-03 |
GB2399089A true GB2399089A (en) | 2004-09-08 |
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GB0401793A Withdrawn GB2399089A (en) | 2003-03-05 | 2004-01-28 | Curable polysiloxane compositions containing silicone mold release agents |
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CN108300406A (en) * | 2016-08-31 | 2018-07-20 | 昆山乔伟新材料有限公司 | A kind of Adhesive composition, the silicone protective film of preparation method and the application Adhesive composition |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5859094A (en) * | 1996-09-03 | 1999-01-12 | Dow Corning Corporation | Use of high molecular weight organopolysiloxanes to improve physical properties of liquid silicone rubber compositions |
EP0903378A1 (en) * | 1997-09-19 | 1999-03-24 | Dow Corning Corporation | Dielectric gel for protection of electronic modules |
US20020188059A1 (en) * | 2001-04-02 | 2002-12-12 | Takayoshi Otomo | Mouldable silicone gel composition |
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2004
- 2004-01-28 GB GB0401793A patent/GB2399089A/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5859094A (en) * | 1996-09-03 | 1999-01-12 | Dow Corning Corporation | Use of high molecular weight organopolysiloxanes to improve physical properties of liquid silicone rubber compositions |
EP0903378A1 (en) * | 1997-09-19 | 1999-03-24 | Dow Corning Corporation | Dielectric gel for protection of electronic modules |
US20020188059A1 (en) * | 2001-04-02 | 2002-12-12 | Takayoshi Otomo | Mouldable silicone gel composition |
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