GB2396482A

GB2396482A - Heat sink for CPU comprising resilient mounting

Info

Publication number: GB2396482A
Application number: GB0229465A
Authority: GB
Inventors: Yu Fu Huang
Original assignee: First International Computer Inc
Current assignee: First International Computer Inc
Priority date: 2002-12-18
Filing date: 2002-12-18
Publication date: 2004-06-23
Also published as: GB0229465D0; DE20219935U1

Abstract

A carrier structure supporting a CPU heat dissipating device includes a heat. sink 1 a socket 2 and a plurality of connecting members 3. The heat sink has a plurality of through holes 13. The socket is mounted under the heat sink, and includes a plurality of receiving openings 22 respectively communicating with the through holes 13. The connecting members are respectively mounted in the receiving openings. Each of the connecting members has a resilient element 30 a sleeve 31 and a screwing element 32. The sleeve is placed inside the spring and the screw is placed inside the sleeve. A flange 33 is further formed on a top of the sleeve for pressing against the resilient element. The screwing element is longer than the sleeve. The heatsink 1 further includes a heating tube 10 and a plurality of fins 12.

Description

1 2396482

CARRIER STRUCTURE FOR CENTRAL PROCESSOR

UNIT HEAT DISSIPATING DEVICE

The invention relates to a heatsink arrangement and to a carrier structure for supporting a heat dissipating device and, more particularly, to a carrier 5 structure suitable for supporting a CPU heat dissipating device inside a laptop computer. In a conventional carrier structure used for supporting a heat dissipating device of an electronic device such as a central processor unit (CPU) in, for example, a laptop computer, the CPU is screwed on to a metallic heatsink. The to screwing force usually determines a stress of the CPU applied by the heatsink. If the screwing force is not enough, then the CPU is not firmly attached on the carrier structure. On the other hand, if the screwing force is excessively large, the CPU may be damaged. Accurately controlling the screwing force is cumbersome.

Furthermore, a problem of alignment of the screw with its corresponding Is threaded hole may also occur.

An object of the present invention is to overcome or alleviate at least some of the above disadvantages.

It is a further object of a preferred embodiment of the invention to provide a carrier structure for supporting a heat dissipating device for e.g. a CPU, in which a no resilient element provides a resilient force for buffering a stress generated when a screwing element is screwed, and a sleeve helps accurately fasten the screwing element to a mainboard.

The invention provides a heatsink arrangement for an electronic device, the arrangement comprising a heatsink having a thermally conductive surface for as conducting heat from a surface of the electronic device, and a plurality of support members disposed about the periphery of said thermally conductive surface, said support members carrying resilient members which in use engage said heatsink and urge said thermally conductive surface against said surface of the electronic device. so Preferred features are defined in claims 1 to 9.

In one embodiment, a carrier structure for a CPU heat

dissipating device includes a heat sink, a socket, and a plurality of connecting members.

The heat sink has a plurality of through holes. The socket is mounted under the heat sink, and includes a plurality of receiving openings respectively corresponding to the s through holes. The connecting members are respectively mounted in the receiving openings. Each of the connecting members has a resilient element, a sleeve and a .... screwing element. The sleeve is placed inside the spring and the screw is placed inside the sleeve. A flange is further formed on a top of the sleeve for pressing against the resilient element. The screwing element is longer than the sleeve.

To provide a further understanding of the invention, the following detailed .. description illustrates embodiments and examples of the inverition, this detailed

Is description being provided only for illustration of the invention.

The drawings included herein provide a further understanding of the invention.

A brief introduction of the drawings is as follows:..DTD: FIG. 1 is an exploded view of a carrier structure for a CPU heat dissipating device according to one embodiment of the invention; FIG. 2 is a perspective view of a carrier structure fork CPU heat dissipating device according to one embodiment of the invention; 2s FIG. 3 is a cross- sectional view of a carrier structure for a CPU heat dissipating device according to one embodiment of the invention; FIG. 3A is a partially enlarged view of a carrier structure for a CPU heat dissipating device according to one embodiment of the invention; 30 FIG. 4 is an exploded view illustrating the association of the carrier structure with the CPU according to one embodiment of the invention; and!

FIG. 5 is a cross-sectional view illustrating the association of the carrier structure with the CPU according to one embodiment of the invention.

Wherever possible in the following description, like reference numerals will

5 refer to like elements and parts unless otherwise illustrated.

FIG. 1, FIG. 2 and FIG. 3 are respectively an exploded view, a perspective view and a cross-sectional view of a carrier structure for supporting a heat dissipating device of a central processor unit (CPU), particularly suitable for a laptop computer. The lo carrier structure is connected to a CPU 40 placed on a mainboard 4, and includes a heat sink 1, a socket 2 and a plurality of connecting members 3.

À The heat sink 1 is preferably made of a thermally conductive material such as a metallic material. The heat sink 1 is mounted inside a host of the laptop computer. A bottom of the heat sink 1 is mounted with a heating tube 10 that diagonally extends across the heat sink 1 through a plurality of heat slugs 12 that are arranged side by side to form a heat dissipating means 11. Regions of the heat sink 1 where the heating pipe 20 10 does not pass by comprise a plurality of through holes 13.

The socket 2 has an approximately rectangular contour. A groove 20 fitting the heating pipe 10 is formed on a surface of the socket 2. A heat-conducting element 21 is attached to a bottom of the socket 2, with a bottom of the heat conducting element 2s 21 facing the CPU 40 (see FIG. 5) and a top thereof directly contacting with the heating pipe 10 through the groove 20. Thereby, the heat-conducting element 21 further dissipates the heat generated from the CPU 40.

3 A plurality of receiving openings 22 are formed on the socket 2 to respectively communicate with the through holes 13. Each receiving opening 22 has a via hole on its bottom.

The connecting members 3 are respectively placed into the receiving openings 22: Each of the connecting members 3 includes a resilient element 30, a sleeve 31 and a screwing element 32. The resilient element 30 is, for example, a spring. The s screwing element 32 is, for example, a screw. The sleeve 31 is placed inside the spring 30 and the screwing member 32 is placed inside the sleeve 31. A flange 33 is further formed on top of the sleeve 31 for pressing against the resilient element 30.

The screwing element 32 is longer than the sleeve 31 in order to pass through the whole sleeve 31. Around an upper portion of each screwing element 32 is mounted a collar 34 that has an outer diameter slightly larger than the correspondingly through hole 13 to prevent the head of the screwing element32 from penetrating through the through hole 13. As illustrated in FIG.3A, a chamfer 35 is further formed at a bottom of the sleeve 31 to enable a more accurate alignment of the sleeve 31 with the via hple 23.

Thereby, the carrier structure of one embodiment of the invention is accomplished.

FIG 4 and FIG.5 are respectively an exploded view and a crossectional view 20 showing the association of the carrier structure and the CP13 according to one embodiment of the invention. When the carrier structure of the invention is to be mounted on the CPU 4, a screw driver is used to tight the screwing element 32, inserted through the sleeve 31 into the receiving opening 22, until the sleeve 31 abuts against the via hole 23. Then, the screwing element 32 protruding from the via hole 23 is screwed into a positioning hole 41 on the mainboard 4. With the design of the connecting members 3, the screwing element 32 can keep vertical during screwing and thereby can be more smoothly fastened with a threaded hole 42 under the positioning hole 41.

3 ( _ While the screwing element 32 is fastened with the threaded hole 42, the flange

33 of the sleeve 31 presses against the resilient element 30. The resilient element 30 provides a resilient force for buffering a stress generated when the screwing element 35! is screwed. Furthermore, the. chamfer 35 of the sleeve 31.helps align the screwing s element 32 with the positioning hole 41 of the mainboard 4.

As described above, the carrier structure therefore favorably enables a more accurate alignment for fa ning the carrier structu e to the mainboard.

Furthermore, the assembly operation is rapidly achieved.

lo It should be apparent to those skilled in the art that the above description is only

illustrative of specific embodiments and examples of the invention. The invention.

should therefore cover various modifications and variations made to the herein-described structure.and operations of the invention, provided they. fall withm the.

scope of the invention as defined in the following appended claims.

Claims

CLAIMS:

1. A carrier structure of supporting a heat dissipating device of a central processor unit (CPU), comprising: 5 a heatsink, having a plurality of through holes; a socket, mounted under the heatsink, wherein the socket has a plurality of receiving openings respectively communicating with the through holes; and a plurality of connecting members, respectively mounted in the receiving openings, wherein each of the connecting members has a resilient element, a to sleeve and a screwing member, the sleeve being placed inside the spring and the screw inside the sleeve, a flange being further formed on a top of the sleeve for pressing against the resilient element, and the screwing element being longer than the sleeve.

15

2. The carrier structure of claim 1, wherein a heat-conducting element is further attached to a bottom of the socket.

3. The carrier structure of claim 1 or claim 2, wherein a top of the heat conducting element directly contacts with a heating tube that is mounted on a 20 bottom of the heatsink, and a groove fitting the heating pipe is formed on the socket.

4. The carrier structure of claim 3, wherein the heating pipe diagonally extends across the heatsink.

5. The carrier structure of claim 3 or claim 4, wherein the heating tube protrudes from the heatsink and passes through a plurality of heat slugs arranged side by side to form a heat dissipating means.

so

6. The carrier structure of any preceding claim, wherein the resilient element is a spring.

7. The carrier structure of any preceding claim, wherein a chamfer is further formed at a bottom of the sleeve.

s

8. The carrier structure of any preceding claim, wherein the screwing element is a screw.

9. The carrier structure of any preceding claim, wherein around an upper portion of each screwing element is placed a collar that has an outer diameter to slightly larger than the correspondingly through hole.

10. A heatsink arrangement for an electronic device, the arrangement comprising a heatsink having a thermally conductive surface for conducting heat from a surface of the electronic device, and a plurality of support members 15 disposed about the periphery of said thermally conductive surface, said support members carrying resilient members which in use engage said heatsink and urge said thermally conductive surface against said surface of the electronic device.

11. A heatsink arrangement substantially as described hereinabove with 20 reference to Figures 1 to 5 of the accompanying drawings.