GB2381380B - LED lamp - Google Patents
LED lampInfo
- Publication number
- GB2381380B GB2381380B GB0227463A GB0227463A GB2381380B GB 2381380 B GB2381380 B GB 2381380B GB 0227463 A GB0227463 A GB 0227463A GB 0227463 A GB0227463 A GB 0227463A GB 2381380 B GB2381380 B GB 2381380B
- Authority
- GB
- United Kingdom
- Prior art keywords
- led lamp
- lamp
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9724507.0A GB9724507D0 (en) | 1997-09-12 | 1997-11-19 | Light source arrangements |
GBGB9820311.0A GB9820311D0 (en) | 1997-11-19 | 1998-09-17 | Led lamp |
GB9825403A GB2331625B (en) | 1997-11-19 | 1998-11-19 | led Lamp |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0227463D0 GB0227463D0 (en) | 2002-12-31 |
GB2381380A GB2381380A (en) | 2003-04-30 |
GB2381380B true GB2381380B (en) | 2003-06-18 |
Family
ID=27269100
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0227463A Expired - Lifetime GB2381380B (en) | 1997-11-19 | 1998-11-19 | LED lamp |
GB0227947A Expired - Lifetime GB2381381B (en) | 1997-11-19 | 1998-11-19 | LED lamp |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0227947A Expired - Lifetime GB2381381B (en) | 1997-11-19 | 1998-11-19 | LED lamp |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB2381380B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4055503B2 (en) | 2001-07-24 | 2008-03-05 | 日亜化学工業株式会社 | Semiconductor light emitting device |
EP1667241B1 (en) | 2003-08-19 | 2016-12-07 | Nichia Corporation | Semiconductor light emitting diode and method of manufacturing the same |
DE102004025684A1 (en) | 2004-04-29 | 2005-11-17 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and method for forming a contact structure for electrically contacting an optoelectronic semiconductor chip |
DE102004021175B4 (en) | 2004-04-30 | 2023-06-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Semiconductor chips for optoelectronics and methods for their manufacture |
DE102009047889A1 (en) | 2009-09-30 | 2011-03-31 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and method for adapting a contact structure for the electrical contacting of an optoelectronic semiconductor chip |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0544512A1 (en) * | 1991-11-25 | 1993-06-02 | Sharp Kabushiki Kaisha | Light-emitting diode having a surface electrode of a tree-like form |
US5696389A (en) * | 1994-03-15 | 1997-12-09 | Kabushiki Kaisha Toshiba | Light-emitting semiconductor device |
US5744828A (en) * | 1995-07-13 | 1998-04-28 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device with blocking layer |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0405757A3 (en) * | 1989-06-27 | 1991-01-30 | Hewlett-Packard Company | High efficiency light-emitting diode |
DE19517697A1 (en) * | 1995-05-13 | 1996-11-14 | Telefunken Microelectron | Orange to green light emitting semiconductor LED |
DE19549818B4 (en) * | 1995-09-29 | 2010-03-18 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor device |
DE59814431D1 (en) * | 1997-09-29 | 2010-03-25 | Osram Opto Semiconductors Gmbh | Semiconductor light source and method for its production |
-
1998
- 1998-11-19 GB GB0227463A patent/GB2381380B/en not_active Expired - Lifetime
- 1998-11-19 GB GB0227947A patent/GB2381381B/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0544512A1 (en) * | 1991-11-25 | 1993-06-02 | Sharp Kabushiki Kaisha | Light-emitting diode having a surface electrode of a tree-like form |
US5696389A (en) * | 1994-03-15 | 1997-12-09 | Kabushiki Kaisha Toshiba | Light-emitting semiconductor device |
US5744828A (en) * | 1995-07-13 | 1998-04-28 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device with blocking layer |
Also Published As
Publication number | Publication date |
---|---|
GB0227947D0 (en) | 2003-01-08 |
GB2381381A (en) | 2003-04-30 |
GB0227463D0 (en) | 2002-12-31 |
GB2381380A (en) | 2003-04-30 |
GB2381381B (en) | 2003-06-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20120119 AND 20120125 |
|
PE20 | Patent expired after termination of 20 years |
Expiry date: 20181118 |