GB2379096A - Apparatus and method for making an RF connection to an RF module - Google Patents
Apparatus and method for making an RF connection to an RF module Download PDFInfo
- Publication number
- GB2379096A GB2379096A GB0120399A GB0120399A GB2379096A GB 2379096 A GB2379096 A GB 2379096A GB 0120399 A GB0120399 A GB 0120399A GB 0120399 A GB0120399 A GB 0120399A GB 2379096 A GB2379096 A GB 2379096A
- Authority
- GB
- United Kingdom
- Prior art keywords
- area
- conductive
- module
- module according
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 4
- 238000012360 testing method Methods 0.000 claims abstract description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000005476 soldering Methods 0.000 claims abstract description 5
- 229910052742 iron Inorganic materials 0.000 claims abstract description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000000523 sample Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000047 product Substances 0.000 description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
- H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
- H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
An RF module having a planar connector area, preferably a PCB, for connection to a coaxial cable 18 and for test probing. The connector area comprises a conductive outer area 6 and a conductive inner area 8, the outer area 6 substantially but not wholly encloses the inner conductive area 6, and the inner and outer conductive areas 6,8 are electrically isolated by an intermediate insulative area 10. The arrangement of the conducting areas 6,8 permits access for a soldering iron (15, Fig 3) to the inner conductive area 8.
Description
<Desc/Clms Page number 1>
APPARATUS AND METHOD FOR MAKING AN RF CONNECTION TO AN
RF MODULE This invention relates to an RF module particularly though not exclusively for use in cellular mobile devices such as those for use in GSM or GPRS enabled communications networks.
In accordance with a first aspect of the invention there is provided an RF module having a generally planar connector area for connection to a coaxial cable and for test probing, the connector area comprising a conductive outer area and a coplanar conductive inner area, the outer area substantially but not wholly enclosing the inner conductive area, and the inner and outer conductive areas being electrically isolated by an intermediate insulative area.
In a second aspect, the invention provides a method of providing electrical connectivity to an RF module comprises providing a conductive outer area and a coplanar conductive inner area substantially but not wholly enclosed by the outer conductive area, the inner and outer conductive areas being electrically isolated by an intermediate insulative area.
Embodiments of the invention will now be described by way of example with reference to the drawings in which :- Figure 1 is a schematic plan view of an RF module in accordance with the invention; Figure 2 is an enlarged plan view of the portion marked A of Figure 1 showing test probing of the module ; Figure 3 is an enlarged plan view of the portion marked A in Figure 1 showing access for a soldering tool ; and Figure 4 is an enlarged plan view of the portion marked A of Figure 1 showing attachment of a coaxial cable to the module.
<Desc/Clms Page number 2>
Miniaturised embedded wireless communications modules (such as Ubinetics Part No. GM400) require a connection to an external RF signal such as that leading to an antenna. A schematic view of such a module is shown in Figure 1.
The module has an integral PCB 2 upon which is mounted a shielded can 4 which contains the components forming the RF module. The can 4 is raised above the surface of the PCB (extending out of the plane of the drawing). Conventionally, such modules have a test probe area allowing testing of the assembled module and a separate connector area for connection to an antenna once the module is assembled for example to form a mobile handset. In many cases, in the prior art, no probe area for testing purposes is provided and testing of the module is carried out"over the air" by establishing a wireless link via the antenna. However, it will be appreciated that an over the air link can only be carried out once the module has been assembled into the final product and thus failure of the module results in a requirement either to disassemble the product or to scrap the product complete with the failed module.
Thus, over the air testing can incur significant costs if the failure rate of the modules reaches a significant rate.
Conversely, the prior art provision of separate probing areas and areas for connecting to an antenna increases unit cost and also unit size.
With reference to Figures 2,3 and 4, the arrangement of conductive pads formed on the PCB is such that probing and connection to a coaxial cable may be achieved within a compact area of the PCB.
With particular reference to Figure 2, an outer conductive area 6 partially surrounds an inner conductive area 8. The two conductive areas are electrically isolated by an unplated portion of the PCB substrate 10 which forms an intermediate insulative area.
With this arrangement, an"off the shelf'test probe consisting of a centre pin 12 and an outer concentric ground ring 14 may be placed over the test area so that the centre pin 12 makes electrical contact with the inner conductive area 8 and the concentric ground ring 14 makes electrical contact with a large part of the outer conductive area 6 (in the example shown, more than half the circumference of the outer ground ring is in contact with the pad 6).
<Desc/Clms Page number 3>
The use of a coaxial probe allows accurate impedance matching to be achieved (which is important particularly for calibration purposes).
With reference to Figure 3, the outer conductive area 6 deliberately has an opening 13 facing towards the edge of the PCB (away from the raised can 4) which allows easy access for a soldering iron 15 without risk of bridging the insulative area 10 with a solder flow. Therefore, with reference to Figure 4, it is relatively simple to attach the inner conductor 16 of a coaxial cable to the inner conductive area 8 using solder 17 and also to connect the outer conductor of the coaxial cable 18 to an enlarged portion 20 of the outer conductive area 6 using solder 21.
Thus by providing coaxial inner and outer conductive areas which allow test probing using an impedance matched probe and also providing comfortable access for hand soldering of a coaxial cable during final assembly, the dual requirements of a single connection area and the avoidance of an expensive RF connector (such as an SMA connector) are met. Furthermore, the pads may be implemented simply as additional plated areas in the design of the PCB for the module. Thus the additional cost required to provide this type of "connector-less" electrical connection is negligible.
Claims (8)
- Claims 1. An RF module having a generally planar connector area for connection to a coaxial cable and for test probing, the connector area comprising a conductive outer area and a coplanar conductive inner area, the outer area substantially but not wholly enclosing the inner conductive area, and the inner and outer conductive areas being electrically isolated by an intermediate insulative area.
- 2. An RF module according to claim 1, wherein the inner conductive area is located substantially at the geometric centre of the outer conductive area.
- 3. An RF module according to claim 1, or claim 2, wherein the outer conductive area has an inner perimeter defining part of the circumference of an outer circle and wherein the inner conductive area is located substantially at the centre of the circle.
- 4. An RF module according to claim 3, wherein the inner conductive area is circular and is located coaxially within the outer circle.
- 5. An RF module according to any preceding claim, wherein the connector area is formed as conductive areas formed adjacent an edge of a PCB forming part of the module, and the outer area being arranged to have an opening facing the edge of the PCB to permit access for a soldering iron to the inner conductive area.
- 6. An RF module according to any preceding claim, wherein the outer conductive area has a pad area arranged to receive a soldered coupling to an outer conductor of a coaxial cable.
- 7. A method of providing electrical connectivity to an RF module comprises providing a conductive outer area and a coplanar conductive inner area substantially but not wholly enclosed by the outer conductive area, the inner and outer conductive areas being electrically isolated by an intermediate insulative area.<Desc/Clms Page number 5>
- 8. An RF module constructed and arranged as described herein with reference to the drawings.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0120399A GB2379096A (en) | 2001-08-22 | 2001-08-22 | Apparatus and method for making an RF connection to an RF module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0120399A GB2379096A (en) | 2001-08-22 | 2001-08-22 | Apparatus and method for making an RF connection to an RF module |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0120399D0 GB0120399D0 (en) | 2001-10-17 |
GB2379096A true GB2379096A (en) | 2003-02-26 |
Family
ID=9920805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0120399A Withdrawn GB2379096A (en) | 2001-08-22 | 2001-08-22 | Apparatus and method for making an RF connection to an RF module |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2379096A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11903124B2 (en) | 2021-08-10 | 2024-02-13 | Rockwell Collins, Inc. | Wide band printed circuit board through connector |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4494083A (en) * | 1981-06-30 | 1985-01-15 | Telefonaktiebolaget L M Ericsson | Impedance matching stripline transition for microwave signals |
EP0394205A2 (en) * | 1989-04-12 | 1990-10-24 | Nokia Mobile Phones Ltd. | Resilient connector for radio frequency signals |
EP0395609A1 (en) * | 1989-04-12 | 1990-10-31 | Nokia Mobile Phones Ltd. | Surface connector for radio frequency signals |
WO1997005674A1 (en) * | 1995-07-25 | 1997-02-13 | Cinch Connectors Ltd. | Co-axial connector systen |
-
2001
- 2001-08-22 GB GB0120399A patent/GB2379096A/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4494083A (en) * | 1981-06-30 | 1985-01-15 | Telefonaktiebolaget L M Ericsson | Impedance matching stripline transition for microwave signals |
EP0394205A2 (en) * | 1989-04-12 | 1990-10-24 | Nokia Mobile Phones Ltd. | Resilient connector for radio frequency signals |
EP0395609A1 (en) * | 1989-04-12 | 1990-10-31 | Nokia Mobile Phones Ltd. | Surface connector for radio frequency signals |
WO1997005674A1 (en) * | 1995-07-25 | 1997-02-13 | Cinch Connectors Ltd. | Co-axial connector systen |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11903124B2 (en) | 2021-08-10 | 2024-02-13 | Rockwell Collins, Inc. | Wide band printed circuit board through connector |
Also Published As
Publication number | Publication date |
---|---|
GB0120399D0 (en) | 2001-10-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |