GB2378823B - Computer module housing - Google Patents
Computer module housingInfo
- Publication number
- GB2378823B GB2378823B GB0218594A GB0218594A GB2378823B GB 2378823 B GB2378823 B GB 2378823B GB 0218594 A GB0218594 A GB 0218594A GB 0218594 A GB0218594 A GB 0218594A GB 2378823 B GB2378823 B GB 2378823B
- Authority
- GB
- United Kingdom
- Prior art keywords
- module housing
- computer module
- computer
- housing
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31150501P | 2001-08-10 | 2001-08-10 | |
GB0119558A GB0119558D0 (en) | 2001-08-10 | 2001-08-10 | Computer systems |
US36643002P | 2002-03-21 | 2002-03-21 | |
GB0206719A GB0206719D0 (en) | 2001-08-10 | 2002-03-21 | Computer systems |
US10/171,810 US6934150B2 (en) | 2001-08-10 | 2002-06-14 | Computer module housing |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0218594D0 GB0218594D0 (en) | 2002-09-18 |
GB2378823A GB2378823A (en) | 2003-02-19 |
GB2378823B true GB2378823B (en) | 2003-09-24 |
Family
ID=27516032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0218594A Expired - Lifetime GB2378823B (en) | 2001-08-10 | 2002-08-09 | Computer module housing |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2378823B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6744632B2 (en) | 2002-09-20 | 2004-06-01 | Hewlett-Packard Development Company, L.P. | Composite construction baffle for modular electronic systems |
CN101472447B (en) * | 2007-12-27 | 2011-05-11 | 英业达股份有限公司 | Electronic device |
WO2017074433A1 (en) | 2015-10-30 | 2017-05-04 | Hewlett Packard Enterprise Development Lp | Enclosure with a shelf |
CN111787780A (en) * | 2018-08-02 | 2020-10-16 | 莫列斯有限公司 | Shield can assembly |
US10942322B2 (en) | 2018-08-02 | 2021-03-09 | Molex, Llc | Shield cage assembly |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3417161A1 (en) * | 1983-05-10 | 1984-11-15 | Karl Heinz 3079 Diepenau Otte | Kit for producing housings having two housing shells which can be plugged together for holding printed-circuit boards |
DE4436903A1 (en) * | 1994-10-15 | 1996-04-18 | Daimler Benz Ag | Electromagnetic screening and sealing circuit packages |
US5659459A (en) * | 1992-05-20 | 1997-08-19 | Seiko Epson Corporation | Cartridge for electronic devices including grounding pads and conductive shielding to decrease the wavelength of emitted electromagnetic radiation |
-
2002
- 2002-08-09 GB GB0218594A patent/GB2378823B/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3417161A1 (en) * | 1983-05-10 | 1984-11-15 | Karl Heinz 3079 Diepenau Otte | Kit for producing housings having two housing shells which can be plugged together for holding printed-circuit boards |
US5659459A (en) * | 1992-05-20 | 1997-08-19 | Seiko Epson Corporation | Cartridge for electronic devices including grounding pads and conductive shielding to decrease the wavelength of emitted electromagnetic radiation |
DE4436903A1 (en) * | 1994-10-15 | 1996-04-18 | Daimler Benz Ag | Electromagnetic screening and sealing circuit packages |
Also Published As
Publication number | Publication date |
---|---|
GB2378823A (en) | 2003-02-19 |
GB0218594D0 (en) | 2002-09-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE20 | Patent expired after termination of 20 years |
Expiry date: 20220808 |