GB2378742A - An apparatus and method for supporting varying sizes of memory cards for shock and vibration - Google Patents
An apparatus and method for supporting varying sizes of memory cards for shock and vibration Download PDFInfo
- Publication number
- GB2378742A GB2378742A GB0218571A GB0218571A GB2378742A GB 2378742 A GB2378742 A GB 2378742A GB 0218571 A GB0218571 A GB 0218571A GB 0218571 A GB0218571 A GB 0218571A GB 2378742 A GB2378742 A GB 2378742A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- cards
- support clip
- card
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
- G11B33/08—Insulation or absorption of undesired vibrations or sounds
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
An apparatus and method for supporting varying sizes of memory cards 102, 104, 106, 108, 110, 112 against shock and vibration, the apparatus and method involving a method to assemble a support clip 122 to one or more of the memory cards 102, 104, 106, 108, 110, 112 attached on a substrate 120 such as a motherboard PCB by a connector (not shown). The method includes the fabrication of the support clip 122 using a series of pillars (124, 126, 128 in Fig. 3) between the substrate 120 and the clip 122. The apparatus may also consist of more than one support clip 122 securing a plurality of memory cards 102, 104, 106, 108, 110, 112 to the substrate 120 as illustrated in Fig. 4.
Description
1 0007429- 1
Support for Varying Sizes of Memory Cards for Shock and Vibration Christopher Gregory Malone Stephan Karl Barsun 5 Thomas J. Augustin BACKGROUND OF THE INVENTION
Field of the Invention
This invention relates generally to supporting cards against shock and vibration, 10 and more particularly to supporting varying sizes of cards against shock and vibration while allowing most air-flow to reach the cards.
Description of the Prior Art
In many data processing systems (e.g., computer systems, programmable 15 electronic systems, telecommunication switching systems, control systems, and so forth) one or more cards (e.g., memory cards populated with static or dynamic electronic memory components) are perpendicularly attached to substrates (e.g., motherboards or memory extenders) for data access for data processing. If multiple memory cards are used, the memory cards are typically identical in size, even though 20 the memory capacity required in each memory card can vary significantly.
However, if memory cards of different sizes are incorporated into the data processing system, it can be very difficult to support them against shock and vibration.
Conventional memory card support clips do not provide good shock and vibration protection to the memory cards perpendicular to the cards; and supports also frequently 25 block the cooling air-flow needed to avoid excessive temperature buildup. A lack of adequate cooling air-flow will typically cause the temperature of one or more electronic components to quickly rise to a temperature that results in either temporary or perm anent operational failure of the electronic components. This typically causes the entire data processing system to fail, since it is dependent on the electronic components.
30 FIG. 1 illustrates conventional attachment of memory cards 102 and 104 to a printed circuit board 120. There is typically no physical support to hold the memory
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cards 102 and 104 on the printed circuit board 120 beside the connectors (not shown) that hold one edge ofthe memory cards 102 and 104 to the printed circuit board 120.
What is needed is a support clip that provides shock and vibration protection to one or more cards attached to a substrate, while minimizing the blockage of air-flow to 5 the cards and adjacent cards. Additionally, this support clip needs to accommodate a variety of memory card sizes.
SUMMARY OF THE INVENTION
The present invention provides a support clip that provides shock and vibration 10 protection to one or more cards attached to a substrate, while min rruzing the blockage of air-flow to the card and adjacent cards. Such cards typically have planes that are perpendicular to the plane of the substrate, and different cards with different card edge heights above the substrate can still be supported by a common support clip by adding one or more spacers over the cards with shorter height card edges.
15 A first aspect of the invention is directed to a method to assemble a support clip to one or more cards each attached on a substrate by a connector. The method includes identifying one or more cards that can be secured to a substrate by a support clip, wherein each card of the cards has a card edge opposite to the card connector that can be secured by the support clip; placing the support clip on each of the card edges; and 20 physically attaching the support clip to the substrate, wherein the support clip secures the cards to the substrate.
A second aspect of the invention is directed to a method to fabricate a support clip. The method includes identifying one or more cards that can be secured to a substrate by a support clip, wherein the one or more cards are individually attached to 25 the substrate by a connector, and wherein each card has an card edge opposite to the connector; conforming the support clip to the card edge of each card; and including one or more structures on the support clip to attach the support clip to the substrate, wherein the support clip substantially secures the cards to the substrate.
A third aspect of the invention is directed to assembled substrate with a plurality 30 of cards secured by one or more support clips to the substrate. The assembled substrate includes a substrate; a plurality of cards attached to the substrate by a plurality of
1 0007429-1
connectors, wherein each card of the plurality of cards has a connector to the substrate on one card edge and a card edge opposite to the connector; and one or more support clips that secure the plurality of cards to the substrate by clamping the card edge opposite to the connector and by attachment to the substrate.
5 These and other objects and advantages of the invention will become apparent to those skilled in the art from the following detailed description of the invention and
the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
10 FIG. 1 illustrates conventional memory card attachment to a printed circuit board. FIG. 2 illustrates a support clip to support memory cards attached to a motherboard PCB, according to one embodiment of the present invention.
FIG. 3 illustrates two different memory card sizes with a spacer to allow both 15 memory card sizes to be supported by a support clip, according to one embodiment of the present invention.
FIG. 4 illustrates a set of short memory cards with a spacer, and a set of tall memory cards, according to another embodiment of the invention.
FIG. 5 illustrates the memory cards of FIG. 4 without the spacer.
20 FIG. 6 shows a flow chart for a method to secure one or more card edges using a support clip in accordance with one embodiment of the present invention.
FIG. 7 shows a flow chart for a method to fabricate one or more support clips for a plurality of memory cards in accordance with one embodiment of the present invention. DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS OF THE
INVENTION
The present invention provides a support clip for varying sizes of cards (e.g., memory cards and logic cards). The support clip provides greater shock and vibration 30 support, while causing a minimum of blockage to air-flow to cool the card and adjacent cards. While the discussion below is directed to an application of the invention to
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secure memory cards to a substrate, such as a printed circuit board (PCB), the invention can also be applied to any type of card attached on any type of substrate (e.g., a multi-
chip module, or another substrate upon which electrical components can be assembled).
FIG. 2 illustrates a support clip to support memory cards attached to a 5 motherboard PCB, according to one embodiment of the present invention. FIG. 2 illustrates an assembly of a first set of memory cards 102, 104, and 106, and a second set of memory cards 108, 110, and 112 that are perpendicularly attached to a substrate 120. The first set of memory cards 102, 104, and 106, and the second set of memory cards 108, 110, and 112 are secured to the substrate 120 by support clip 122 (shown in 10 partial cut-away). Support clip 122 is attached to the substrate 120 by two or more pillars. Due to the need to show the underlying cards, only pillar 124 is shown. In alternate embodiments ofthe invention, the support clip 122 does not cover the full length of the cards that need to be secured to the substrate. In other words, the support clip 122 that shown in partial cut-away with only pillar 124 could be a sufficient 15 support clip for some applications, especially in applications where there is only one or two cards that need support.
Support clip 122 preferably has one or more indentations (e.g., grooves or notches) to more closely conform the support clip 122 to the card edge opposite to the connectors of the cards to be supported. These indentations are preferably made by 20 molding, stamping, or machining the support clip 122. The support clip 122 can be fabricated from a piece of sheet metal, a molded piece of metal, a machined piece of metal, a molded piece of plastic, or a machined piece of plastic.
FIG. 3 illustrates a side view of two different memory card sizes with a spacer to allow both to be supported by a support clip, according to one embodiment of the 25 present invention. Here, a first set of memory cards 102, 104, and 106, and a second set of memory cards 108, 110, and 112 are perpendicularly attached to a substrate 120.
The first set of memory cards 102, 104, and 106, and the second set of memory cards 108, 110, and 112 are secured to the substrate 120 by support clip 122. Support clip 122 is attached to the substrate 120 by pillars 124, 126, and 128.
30 Preferably, a spacer 140 is placed (e.g., clipped on a card edge, or slide onto a card edge) on each of the shorter memory cards to bring each shorter memory card up
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to the same height as the taller memory cards. The spacer 140 can be stamped, molded, or machined from several different materials, for example, plastic, metal, ceramic, or a composite material. The spacer 140 can extend the full length ofthe card edge of each card, or have a length greater or less than the length of the card edge of each card. The 5 spacer 140 is preferably indented to conform to each card edge. Once spacers are placed on all of the shorter cards to bring all the card edges opposite the connectors to the same distance from the substrate, the support clip is attached. The support clip provides shock and vibration protection to the cards.
FIG. 4 illustrates a set of short memory cards with a spacer 140, and a set of tall 10 memory cards, according to another embodiment ofthe invention. Here, a first set of memory cards 102, 104, and 106, and a second set of memory cards 108, 110, and 112 are perpendicularly attached to a substrate 120. The first set of memory cards 102, 104, and 106 is secured to the substrate 120 by spacer 140 and support clip 118. The second set of memory cards 108, 110, and 112 is secured to the substrate 120 by support clip 15 122. Support clip 118 is attached to the substrate 120 by pillars 124 and 126. Support clip 122 is attached to the substrate 120 by pillars 128 and 130.
FIG. 5 illustrates the memory extender of FIG. 4 without the spacers, illustrating the lack of support for the short memory cards. Here, a first set of memory cards 102, 104, and 106, and a second set of memory cards 108, 110, and 112 are 20 perpendicularly attached to a substrate 120. The first set of memory cards 102, 104, and 106 is secured to the substrate 120 by support clip 1 18. The second set of memory cards 108, 110, and 112 is secured to the substrate 120 by support clip 122. Support clip 118 is attached to the substrate 120 by pillars 124 and 126. Support clip 122 is attached to the substrate 120 by pillars 128 and 130.
25 FIG. 6 shows a flow chart for a method to secure one or more card edge opposite to the connectors using a support clip in accordance with an embodiment of the present invention. The method starts in operation 602, and is followed by operation 604. In operation 604, there is an attachment of a support clip to one edge of a card. In operation 606, the support clip is attached to another card of the same height as the first 30 card. Then operation 608 is next. In operation 608 the support clip is attached to the card edge opposite to the connectors of a different set of cards having an card edge
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opposite to the connector height different from the first set of cards. In operation 610, the support clip is physically attached to the substrate, by using screws, bolts, solder, or an equivalent attachment method. Operation 612 is the end ofthe method.
FIG. 7 shows another flow chart for a method to fabricate one or more support 5 clips for a plurality of memory cards in accordance with one embodiment of the present invention. The method starts in operation 702, and is followed by operation 704. In operation 704, a first group of memory cards that can be supported by the attachment of a support clip is identified. In operation 706, the support clip is shaped to conform to the first group of one or more memory cards (e.g., by conforming to the card edge 10 opposite to the connectors). Then operation 708 is next. In operation 708, a test is made to determine if the support clip needs to be shaped to support another group of memory cards attached to the same substrate, or if an additional support clip is needed for a second group of memory cards having card edge opposite to the connectors at a different height from the plane of the substrate. If the test of operation 708 finds 15 another support clip is needed, then in operation 710' another support clip is shaped to confomn to the second group of memory cards (e.g., shaped to conform to the card edge opposite to the connectors of the second group of memory cards). If the test of operation 708 determines that the support clip can be shaped to support another group of memory cards, then operation 712 is next, where the support clip is shaped to 20 support the other group of memory cards. In operation 714, the support clip(s) have structures (e.g., appendages, or pillars) added to facilitate their physical attachment to the substrate, by screws, bolts, solder, or by an equivalent attachment method.
Operation 716 is the end ofthe method.
The embodiments of the invention discussed above used examples of PCBs.
25 Preferred embodiments of the invention can be applied to PCBs using through-hole technology or surface mount technology, or can be applied to other types of electrical component substrates (e.g., multi-chip modules and flexible substrates).
The exemplary embodiments described herein are for purposes of illustration and are not intended to be limiting. Therefore, those skilled in the art will recognize 30 that other embodiments could be practiced without departing from the scope and spirit of the claims set forth below.
Claims (10)
1 0007429-1
What is claimed is:
1 1. A method to assemble a support clip (122) to one or more cards (108, 110, 112) 2 each attached on a substrate (120) by a connector, comprising: 3 identifying one or more cards (108, 110, 112) that can be secured to a substrate 4 (120) by a support clip (122), wherein each card of said one or more cards (108, 110, 5 112) has an card edge opposite to said connector that can be secured by said support 6 clip (122); 7 placing said support clip (122) on each of said card edges; and 8 physically attaching said support clip (122) to said substrate (120), wherein said 9 support clip (122) secures said one or more cards (108, 110, 112) to said substrate 10 (120).
1
2. The method of claim 1, wherein said substrate (120) has a plane, wherein each 2 of said one or more cards (108, 110, 112) has a plane that is substantially perpendicular 3 to said plane of said substrate (120), and each of said one or more cards (108, 110, 112) 4 has an card edge opposite to said connector at a substantially equal perpendicular 5 height above said substrate (120).
1
3. The method of claim 1, further comprising: 2 placing a spacer (140) on a card edge of a card (102), and 3 placing a support clip (122) on said spacer (140) to substantially support said 4 spacer (140) and said card (102).
1
4. The method of claim 1, wherein said substrate (120) is chosen from substrates 2 (120) consisting of: a printed circuit board (PCB), a multichip module (MCM), and a 3 flexible substrate.
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1
5. A method to fabricate a support clip (122), comprising: 2 identifying one or more cards (108, 110, 112) that can be secured to a substrate 3 (120) by a support clip (122), wherein said one or more cards (108, 110, 112) is 4 individually attached to said substrate (120) by a connector, and wherein each card of 5 said one or more cards (108, 110, 112) has an card edge opposite to said connector; 6 conforming said support clip (122) to said card edge of each card of said one or 7 more cards (108, 110,112); and 8 including one or more structures on said support clip (122) to attach said 9 support clip (122) to said substrate (120), wherein said support clip (122) thereby 10 substantially secures said one or more cards (108,110, 112) to said substrate (120).
1
6. The method of claim 5, wherein said substrate (120) has a plane, wherein each 2 of said one or more cards (108,110, 112) has a plane that is substantially perpendicular 3 to said plane of said substrate (120), and each of said one or more cards (108, 110, 112) 4 has an card edge at a substantially equal perpendicular height above said plane of said 5 substrate (120).
1
7. The method ofclairn5,whereinsaidoneor more cards(108, 110, 112) includes 2 a memory card.
1
8. Anassembledsubstrate(120)withapluralityofcards(102, 104, 106, 108, 110, 2 112) secured by one or more support clips (122) to said substrate (120), comprising: 3 a substrate (120); 4 a plurality of cards (102,104, 106, 108, 110, 112) attached to said substrate S (120) by a plurality of connectors, wherein each card of said plurality of cards (102, 6 104, 106, 108, 110,112)hasaconnectortosaidsubstrate(120)ononecardedgeanda 7 card edge opposite to said connector; and 8 one or more support clips (122) that secure said plurality of cards (102, 104, 9 106, 108, 110, 112) to said substrate (120) by clamping said card edge opposite to said 10 connector and by attachment to said substrate (120).
1 0007429-1
1
9. Me assembled substrate (120) of clann 8, further comprising a spacer (140) 2 placed on a card edge, wherein a support clip (122) is placed on said spacer (140).
1
10. The assembled substrate of claim 8, wherein said support clip (122) includes a 2 plurality of indentations to substantially conform to said plurality of cards.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/932,372 US6633491B2 (en) | 2001-08-17 | 2001-08-17 | Support for varying sizes of memory cards for shock and vibration |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB0218571D0 GB0218571D0 (en) | 2002-09-18 |
| GB2378742A true GB2378742A (en) | 2003-02-19 |
| GB2378742B GB2378742B (en) | 2005-05-18 |
Family
ID=25462218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0218571A Expired - Fee Related GB2378742B (en) | 2001-08-17 | 2002-08-09 | Support for varying sizes of memory cards for shock and vibration |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6633491B2 (en) |
| GB (1) | GB2378742B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7306159B1 (en) * | 2003-06-07 | 2007-12-11 | Rochelo Donald R | Protective case for six different sized memory cards |
| US7282925B2 (en) * | 2004-10-25 | 2007-10-16 | Dell Products L.P. | Apparatus to facilitate functional shock and vibration testing of device connections and related method |
| DE602005018157D1 (en) * | 2005-02-03 | 2010-01-21 | 3M Innovative Properties Co | Function module and arrangement comprising at least one telecommunication module and at least one functional module |
| US7286364B2 (en) * | 2005-11-09 | 2007-10-23 | Wan Chien Chang | Heat dissipating device for a memory chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3863113A (en) * | 1974-01-04 | 1975-01-28 | Llyd G Ward | Modular formed wire cardcage |
| US3950603A (en) * | 1975-01-23 | 1976-04-13 | Analog Devices, Incorporated | Enclosure case for potless immobilization of circuit components |
| WO2000022624A1 (en) * | 1998-10-13 | 2000-04-20 | Avid Technology, Inc. | Disk drive enclosure |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5623396A (en) * | 1995-11-14 | 1997-04-22 | Digital Dynamics, Inc. | Adjustable printed wiring board fastener |
| US5642263A (en) * | 1996-08-16 | 1997-06-24 | Intel Corporation | Circuit board retention system |
| JP3846944B2 (en) * | 1996-10-01 | 2006-11-15 | 富士通株式会社 | Electronic device having an optional board removal prevention mechanism |
| US5822193A (en) * | 1997-06-03 | 1998-10-13 | Motorola, Inc. | Appparatus and method for rigidly stabilizing circuit boards |
| US5944199A (en) * | 1997-11-25 | 1999-08-31 | Micron Technology, Inc. | Integrated circuit package support system |
| US5996962A (en) * | 1998-05-18 | 1999-12-07 | Chang; Tommy H. C. | Computer card retainer and process for using the same |
| US6220887B1 (en) * | 1998-09-28 | 2001-04-24 | Enclosure Technologies, Inc. | Stabilizer for holding circuit boards in a port |
-
2001
- 2001-08-17 US US09/932,372 patent/US6633491B2/en not_active Expired - Fee Related
-
2002
- 2002-08-09 GB GB0218571A patent/GB2378742B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3863113A (en) * | 1974-01-04 | 1975-01-28 | Llyd G Ward | Modular formed wire cardcage |
| US3950603A (en) * | 1975-01-23 | 1976-04-13 | Analog Devices, Incorporated | Enclosure case for potless immobilization of circuit components |
| WO2000022624A1 (en) * | 1998-10-13 | 2000-04-20 | Avid Technology, Inc. | Disk drive enclosure |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0218571D0 (en) | 2002-09-18 |
| US6633491B2 (en) | 2003-10-14 |
| US20030035279A1 (en) | 2003-02-20 |
| GB2378742B (en) | 2005-05-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20120329 AND 20120404 |
|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20140809 |