GB2364434B - Apparatus for anisotropic plasma etching - Google Patents

Apparatus for anisotropic plasma etching

Info

Publication number
GB2364434B
GB2364434B GB0111847A GB0111847A GB2364434B GB 2364434 B GB2364434 B GB 2364434B GB 0111847 A GB0111847 A GB 0111847A GB 0111847 A GB0111847 A GB 0111847A GB 2364434 B GB2364434 B GB 2364434B
Authority
GB
United Kingdom
Prior art keywords
plasma etching
anisotropic plasma
anisotropic
etching
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0111847A
Other versions
GB2364434A (en
GB0111847D0 (en
Inventor
Klaus Breitschwerdt
Franz Laermer
Andrea Schilp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB0111847D0 publication Critical patent/GB0111847D0/en
Publication of GB2364434A publication Critical patent/GB2364434A/en
Application granted granted Critical
Publication of GB2364434B publication Critical patent/GB2364434B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
GB0111847A 2000-05-16 2001-05-15 Apparatus for anisotropic plasma etching Expired - Fee Related GB2364434B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2000123946 DE10023946A1 (en) 2000-05-16 2000-05-16 Device for anisotropically etching a substrate has an aperture arranged between the plasma source and the substrate with openings arranged in such a way that the ions from the plasma vertically hit the surface of the substrate

Publications (3)

Publication Number Publication Date
GB0111847D0 GB0111847D0 (en) 2001-07-04
GB2364434A GB2364434A (en) 2002-01-23
GB2364434B true GB2364434B (en) 2003-05-14

Family

ID=7642245

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0111847A Expired - Fee Related GB2364434B (en) 2000-05-16 2001-05-15 Apparatus for anisotropic plasma etching

Country Status (2)

Country Link
DE (1) DE10023946A1 (en)
GB (1) GB2364434B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2044608B1 (en) 2006-07-20 2012-05-02 SPP Process Technology Systems UK Limited Ion sources
JP2009545101A (en) 2006-07-20 2009-12-17 アビザ テクノロジー リミティド Plasma source
WO2008009889A1 (en) 2006-07-20 2008-01-24 Aviza Technology Limited Ion deposition apparatus
US7485827B2 (en) 2006-07-21 2009-02-03 Alter S.R.L. Plasma generator

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4661203A (en) * 1985-06-28 1987-04-28 Control Data Corporation Low defect etching of patterns using plasma-stencil mask
US5445709A (en) * 1992-11-19 1995-08-29 Hitachi, Ltd. Anisotropic etching method and apparatus
US5518572A (en) * 1991-06-10 1996-05-21 Kawasaki Steel Corporation Plasma processing system and method
GB2327909A (en) * 1997-08-07 1999-02-10 Bosch Gmbh Robert Anisotropic plasma etching of a silicon wafer with aperture between plasma source and wafer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960016218B1 (en) * 1987-06-05 1996-12-07 가부시기가이샤 히다찌세이사꾸쇼 Surface treatment method and apparatus thereof
US5421888A (en) * 1992-05-12 1995-06-06 Sony Corporation Low pressure CVD apparatus comprising gas distribution collimator
DE19900179C1 (en) * 1999-01-07 2000-02-24 Bosch Gmbh Robert Installation for etching substrates by high-density plasmas comprises a phase delay line causing the supply voltages at both ends of the inductively coupled plasma coil to be in counter-phase with one another

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4661203A (en) * 1985-06-28 1987-04-28 Control Data Corporation Low defect etching of patterns using plasma-stencil mask
US5518572A (en) * 1991-06-10 1996-05-21 Kawasaki Steel Corporation Plasma processing system and method
US5445709A (en) * 1992-11-19 1995-08-29 Hitachi, Ltd. Anisotropic etching method and apparatus
GB2327909A (en) * 1997-08-07 1999-02-10 Bosch Gmbh Robert Anisotropic plasma etching of a silicon wafer with aperture between plasma source and wafer

Also Published As

Publication number Publication date
DE10023946A1 (en) 2001-11-29
GB2364434A (en) 2002-01-23
GB0111847D0 (en) 2001-07-04

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20150515