GB2361360B - Adaptors for electronic components - Google Patents

Adaptors for electronic components

Info

Publication number
GB2361360B
GB2361360B GB0008975A GB0008975A GB2361360B GB 2361360 B GB2361360 B GB 2361360B GB 0008975 A GB0008975 A GB 0008975A GB 0008975 A GB0008975 A GB 0008975A GB 2361360 B GB2361360 B GB 2361360B
Authority
GB
United Kingdom
Prior art keywords
adaptors
electronic components
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0008975A
Other versions
GB0008975D0 (en
GB2361360A (en
Inventor
Alan David Morrison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMEGA RES Ltd
Original Assignee
OMEGA RES Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMEGA RES Ltd filed Critical OMEGA RES Ltd
Priority to GB0008975A priority Critical patent/GB2361360B/en
Publication of GB0008975D0 publication Critical patent/GB0008975D0/en
Publication of GB2361360A publication Critical patent/GB2361360A/en
Application granted granted Critical
Publication of GB2361360B publication Critical patent/GB2361360B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
GB0008975A 2000-04-13 2000-04-13 Adaptors for electronic components Expired - Fee Related GB2361360B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0008975A GB2361360B (en) 2000-04-13 2000-04-13 Adaptors for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0008975A GB2361360B (en) 2000-04-13 2000-04-13 Adaptors for electronic components

Publications (3)

Publication Number Publication Date
GB0008975D0 GB0008975D0 (en) 2000-05-31
GB2361360A GB2361360A (en) 2001-10-17
GB2361360B true GB2361360B (en) 2003-08-13

Family

ID=9889741

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0008975A Expired - Fee Related GB2361360B (en) 2000-04-13 2000-04-13 Adaptors for electronic components

Country Status (1)

Country Link
GB (1) GB2361360B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008275418A (en) * 2007-04-27 2008-11-13 Omron Corp Wiring board and electric current detector
DE102022108270A1 (en) 2022-04-06 2023-10-12 Bayerische Motoren Werke Aktiengesellschaft Circuit board for variable semiconductor layout

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0305157A2 (en) * 1987-08-25 1989-03-01 BICC Public Limited Company Adaptor assembly for circuit boards
US4871317A (en) * 1987-12-02 1989-10-03 A. O. Smith Corporation Surface mounted component adaptor for interconnecting of surface mounted circuit components
EP0413848A1 (en) * 1989-08-25 1991-02-27 Siemens Aktiengesellschaft Adaptor plate for electric coils
JPH03169093A (en) * 1989-11-28 1991-07-22 Mitsubishi Electric Corp Electronic component mounting device
DE4008542A1 (en) * 1990-03-16 1991-09-19 Siemens Ag Printed circuit boards - uses adaptor phases to fix non standard elements onto boards
US5457878A (en) * 1993-10-12 1995-10-17 Lsi Logic Corporation Method for mounting integrated circuit chips on a mini-board
US5682297A (en) * 1994-07-22 1997-10-28 Ast Research, Inc. Dual pattern microprocessor package footprint

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0305157A2 (en) * 1987-08-25 1989-03-01 BICC Public Limited Company Adaptor assembly for circuit boards
US4871317A (en) * 1987-12-02 1989-10-03 A. O. Smith Corporation Surface mounted component adaptor for interconnecting of surface mounted circuit components
EP0413848A1 (en) * 1989-08-25 1991-02-27 Siemens Aktiengesellschaft Adaptor plate for electric coils
JPH03169093A (en) * 1989-11-28 1991-07-22 Mitsubishi Electric Corp Electronic component mounting device
DE4008542A1 (en) * 1990-03-16 1991-09-19 Siemens Ag Printed circuit boards - uses adaptor phases to fix non standard elements onto boards
US5457878A (en) * 1993-10-12 1995-10-17 Lsi Logic Corporation Method for mounting integrated circuit chips on a mini-board
US5682297A (en) * 1994-07-22 1997-10-28 Ast Research, Inc. Dual pattern microprocessor package footprint

Also Published As

Publication number Publication date
GB0008975D0 (en) 2000-05-31
GB2361360A (en) 2001-10-17

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20070413