GB2351458B - Fluid knife - Google Patents

Fluid knife

Info

Publication number
GB2351458B
GB2351458B GB0012098A GB0012098A GB2351458B GB 2351458 B GB2351458 B GB 2351458B GB 0012098 A GB0012098 A GB 0012098A GB 0012098 A GB0012098 A GB 0012098A GB 2351458 B GB2351458 B GB 2351458B
Authority
GB
United Kingdom
Prior art keywords
fluid knife
knife
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0012098A
Other versions
GB0012098D0 (en
GB2351458A (en
Inventor
Peter Philip Andrew Lymn
Richard Andrew Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CIRCUIT ENGINEERING MARKETING
Circuit Engineering Marketing Co Ltd
Original Assignee
CIRCUIT ENGINEERING MARKETING
Circuit Engineering Marketing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CIRCUIT ENGINEERING MARKETING, Circuit Engineering Marketing Co Ltd filed Critical CIRCUIT ENGINEERING MARKETING
Publication of GB0012098D0 publication Critical patent/GB0012098D0/en
Publication of GB2351458A publication Critical patent/GB2351458A/en
Application granted granted Critical
Publication of GB2351458B publication Critical patent/GB2351458B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0653Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/06Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206Cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3468Applying molten solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/081Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1509Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Nozzles (AREA)
  • Treatment Of Fiber Materials (AREA)
GB0012098A 1999-06-02 2000-05-19 Fluid knife Expired - Fee Related GB2351458B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9912773.0A GB9912773D0 (en) 1999-06-02 1999-06-02 Fluid knife

Publications (3)

Publication Number Publication Date
GB0012098D0 GB0012098D0 (en) 2000-07-12
GB2351458A GB2351458A (en) 2001-01-03
GB2351458B true GB2351458B (en) 2003-09-10

Family

ID=10854578

Family Applications (3)

Application Number Title Priority Date Filing Date
GBGB9912773.0A Ceased GB9912773D0 (en) 1999-06-02 1999-06-02 Fluid knife
GBGB0011771.3A Ceased GB0011771D0 (en) 1999-06-02 2000-05-17 Fluid knife
GB0012098A Expired - Fee Related GB2351458B (en) 1999-06-02 2000-05-19 Fluid knife

Family Applications Before (2)

Application Number Title Priority Date Filing Date
GBGB9912773.0A Ceased GB9912773D0 (en) 1999-06-02 1999-06-02 Fluid knife
GBGB0011771.3A Ceased GB0011771D0 (en) 1999-06-02 2000-05-17 Fluid knife

Country Status (3)

Country Link
US (1) US6440215B1 (en)
DE (1) DE10025619B4 (en)
GB (3) GB9912773D0 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6719188B2 (en) * 2001-07-24 2004-04-13 International Business Machines Corporation Rework methods for lead BGA/CGA
JP5011119B2 (en) * 2004-11-10 2012-08-29 スプレイング システムズ カンパニー Fluid discharge device
DE102007034877A1 (en) * 2007-07-24 2009-01-29 Schmid Rhyner Ag Method and device for applying plastic coatings
US20090178298A1 (en) * 2008-01-15 2009-07-16 Anatoli Anatolyevich Abramov Device for fluid removal after laser scoring
MY153831A (en) * 2009-05-13 2015-03-31 Atotech Deutschland Gmbh Method, treatment station and assembly for treating a planar material to be treated
CN102082208A (en) * 2010-12-15 2011-06-01 苏州聚晶科技有限公司 Air knife device for drying solar cell plates through blowing
US8869422B2 (en) 2012-04-27 2014-10-28 Applied Materials, Inc. Methods and apparatus for marangoni substrate drying using a vapor knife manifold
KR20180060325A (en) * 2016-11-28 2018-06-07 엘지디스플레이 주식회사 Roll to roll fabrication apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3741643A (en) * 1971-11-19 1973-06-26 Savin Business Machines Corp Pneumatic assembly for removing excess developer liquid from photoconductive surfaces
US3917888A (en) * 1969-11-12 1975-11-04 Jones & Laughlin Steel Corp Coating control
JPH0372062A (en) * 1989-08-11 1991-03-27 Tanaka Kikinzoku Kogyo Kk Solder coater machine
US5593499A (en) * 1994-12-30 1997-01-14 Photocircuits Corporation Dual air knife for hot air solder levelling
US6042648A (en) * 1997-07-15 2000-03-28 Corey; Dave O. Vertical circuit board soldering apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3667425A (en) * 1971-03-01 1972-06-06 Inland Steel Co Apparatus for controlling coating thickness
US5483984A (en) * 1992-07-10 1996-01-16 Donlan, Jr.; Fraser P. Fluid treatment apparatus and method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3917888A (en) * 1969-11-12 1975-11-04 Jones & Laughlin Steel Corp Coating control
US3741643A (en) * 1971-11-19 1973-06-26 Savin Business Machines Corp Pneumatic assembly for removing excess developer liquid from photoconductive surfaces
JPH0372062A (en) * 1989-08-11 1991-03-27 Tanaka Kikinzoku Kogyo Kk Solder coater machine
US5593499A (en) * 1994-12-30 1997-01-14 Photocircuits Corporation Dual air knife for hot air solder levelling
US6042648A (en) * 1997-07-15 2000-03-28 Corey; Dave O. Vertical circuit board soldering apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
WPI Abstract Accession No 1991-135925 & JP 03 072 062 A *

Also Published As

Publication number Publication date
GB9912773D0 (en) 1999-08-04
DE10025619B4 (en) 2014-03-06
GB0012098D0 (en) 2000-07-12
DE10025619A1 (en) 2001-01-18
GB2351458A (en) 2001-01-03
US6440215B1 (en) 2002-08-27
GB0011771D0 (en) 2000-07-05

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20150519