GB2342775B - Method fabricating local interconnect - Google Patents

Method fabricating local interconnect

Info

Publication number
GB2342775B
GB2342775B GB9822665A GB9822665A GB2342775B GB 2342775 B GB2342775 B GB 2342775B GB 9822665 A GB9822665 A GB 9822665A GB 9822665 A GB9822665 A GB 9822665A GB 2342775 B GB2342775 B GB 2342775B
Authority
GB
United Kingdom
Prior art keywords
local interconnect
method fabricating
fabricating local
interconnect
local
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9822665A
Other versions
GB9822665D0 (en
GB2342775A (en
Inventor
Fu Tai Liou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Microelectronics Corp
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW087110878A external-priority patent/TW396570B/en
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to GB9822665A priority Critical patent/GB2342775B/en
Priority to JP10304328A priority patent/JP2000021886A/en
Priority to FR9813429A priority patent/FR2780811A1/en
Priority to DE19849745A priority patent/DE19849745A1/en
Priority to NL1010431A priority patent/NL1010431C2/en
Publication of GB9822665D0 publication Critical patent/GB9822665D0/en
Publication of GB2342775A publication Critical patent/GB2342775A/en
Publication of GB2342775B publication Critical patent/GB2342775B/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
GB9822665A 1998-07-06 1998-10-16 Method fabricating local interconnect Expired - Fee Related GB2342775B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB9822665A GB2342775B (en) 1998-07-06 1998-10-16 Method fabricating local interconnect
JP10304328A JP2000021886A (en) 1998-07-06 1998-10-26 Method of forming local interconnection
FR9813429A FR2780811A1 (en) 1998-07-06 1998-10-27 METHOD FOR MANUFACTURING A LOCAL INTERCONNECTION
DE19849745A DE19849745A1 (en) 1998-07-06 1998-10-28 Local connection production method on a substrate e.g. in the production of complex circuits such as microprocessors
NL1010431A NL1010431C2 (en) 1998-07-06 1998-10-29 Method of manufacturing a local connection.

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW087110878A TW396570B (en) 1998-07-06 1998-07-06 Method for forming semiconductor local interconnect
GB9822665A GB2342775B (en) 1998-07-06 1998-10-16 Method fabricating local interconnect
NL1010431A NL1010431C2 (en) 1998-07-06 1998-10-29 Method of manufacturing a local connection.

Publications (3)

Publication Number Publication Date
GB9822665D0 GB9822665D0 (en) 1998-12-09
GB2342775A GB2342775A (en) 2000-04-19
GB2342775B true GB2342775B (en) 2000-12-27

Family

ID=27269518

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9822665A Expired - Fee Related GB2342775B (en) 1998-07-06 1998-10-16 Method fabricating local interconnect

Country Status (5)

Country Link
JP (1) JP2000021886A (en)
DE (1) DE19849745A1 (en)
FR (1) FR2780811A1 (en)
GB (1) GB2342775B (en)
NL (1) NL1010431C2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10219361B4 (en) * 2002-04-30 2008-04-30 Advanced Micro Devices, Inc., Sunnyvale A semiconductor device having an improved local interconnect structure and a method of making such an element

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4039698A (en) * 1976-01-23 1977-08-02 Bell Telephone Laboratories, Incorporated Method for making patterned platinum metallization
FR2398385A1 (en) * 1977-07-22 1979-02-16 Thomson Csf Converting dielectric material to (semi)conductive material - by heat treating in a plasma, esp. created by HF alternating electromagnetic field

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4557036A (en) * 1982-03-31 1985-12-10 Nippon Telegraph & Telephone Public Corp. Semiconductor device and process for manufacturing the same
CA1176115A (en) * 1982-05-28 1984-10-16 Cornelis Blaauw Method of preparing ti0.sub.2 thick film photoanodes for photoelectrochemical cells
US4931411A (en) * 1985-05-01 1990-06-05 Texas Instruments Incorporated Integrated circuit process with TiN-gate transistor
JPH01196819A (en) * 1988-02-02 1989-08-08 Matsushita Electric Ind Co Ltd Manufacture of semiconductor integrated circuit device
JPH05243178A (en) * 1991-10-03 1993-09-21 Hewlett Packard Co <Hp> Method for forming connector for semiconductor integrated circuit
JPH088225B2 (en) * 1991-12-17 1996-01-29 インターナショナル・ビジネス・マシーンズ・コーポレイション Improved local interconnect for semiconductors.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4039698A (en) * 1976-01-23 1977-08-02 Bell Telephone Laboratories, Incorporated Method for making patterned platinum metallization
FR2398385A1 (en) * 1977-07-22 1979-02-16 Thomson Csf Converting dielectric material to (semi)conductive material - by heat treating in a plasma, esp. created by HF alternating electromagnetic field

Also Published As

Publication number Publication date
DE19849745A1 (en) 2000-01-13
JP2000021886A (en) 2000-01-21
NL1010431C2 (en) 2000-05-03
GB9822665D0 (en) 1998-12-09
GB2342775A (en) 2000-04-19
FR2780811A1 (en) 2000-01-07

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20021016