GB2336904B - Laser interferometric measuring system - Google Patents

Laser interferometric measuring system

Info

Publication number
GB2336904B
GB2336904B GB9909700A GB9909700A GB2336904B GB 2336904 B GB2336904 B GB 2336904B GB 9909700 A GB9909700 A GB 9909700A GB 9909700 A GB9909700 A GB 9909700A GB 2336904 B GB2336904 B GB 2336904B
Authority
GB
United Kingdom
Prior art keywords
measuring system
interferometric measuring
laser interferometric
laser
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9909700A
Other versions
GB9909700D0 (en
GB2336904A (en
Inventor
Kazuki Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB9909700D0 publication Critical patent/GB9909700D0/en
Publication of GB2336904A publication Critical patent/GB2336904A/en
Application granted granted Critical
Publication of GB2336904B publication Critical patent/GB2336904B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
GB9909700A 1998-04-27 1999-04-27 Laser interferometric measuring system Expired - Fee Related GB2336904B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10116907A JP3013837B2 (en) 1998-04-27 1998-04-27 Stage position measuring device and measuring method thereof

Publications (3)

Publication Number Publication Date
GB9909700D0 GB9909700D0 (en) 1999-06-23
GB2336904A GB2336904A (en) 1999-11-03
GB2336904B true GB2336904B (en) 2002-11-06

Family

ID=14698605

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9909700A Expired - Fee Related GB2336904B (en) 1998-04-27 1999-04-27 Laser interferometric measuring system

Country Status (3)

Country Link
JP (1) JP3013837B2 (en)
KR (1) KR100291226B1 (en)
GB (1) GB2336904B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1116932A3 (en) * 2000-01-14 2003-04-16 Leica Microsystems Wetzlar GmbH Measuring apparatus and method for measuring structures on a substrat
EP1510867A1 (en) 2003-08-29 2005-03-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4614386B2 (en) * 2005-02-04 2011-01-19 キヤノン株式会社 Positioning apparatus, exposure apparatus, and device manufacturing method using the same
JP5582996B2 (en) * 2010-12-16 2014-09-03 キヤノン株式会社 Absolute position measuring apparatus and absolute position measuring method
KR102126378B1 (en) 2013-08-07 2020-06-25 삼성디스플레이 주식회사 Position controller, controlling method thereof and the apparatus comprising the same
JP6278833B2 (en) * 2014-05-21 2018-02-14 キヤノン株式会社 Lithographic apparatus and article manufacturing method
DE102019119306A1 (en) * 2019-07-16 2021-01-21 Bundesrepublik Deutschland, Vertreten Durch Das Bundesministerium Für Wirtschaft Und Energie, Dieses Vertreten Durch Den Präsidenten Der Physikalisch-Technischen Bundesanstalt Measuring device for determining positions of markers on a planar measuring object and method for calibrating such a measuring device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4880308A (en) * 1987-04-08 1989-11-14 Nikon Corporation Aligning apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3005139B2 (en) * 1993-06-01 2000-01-31 キヤノン株式会社 Semiconductor manufacturing method
JPH09223650A (en) * 1996-02-15 1997-08-26 Nikon Corp Aligner
JP3401769B2 (en) * 1993-12-28 2003-04-28 株式会社ニコン Exposure method, stage device, and exposure device
JPH0822948A (en) * 1994-07-08 1996-01-23 Nikon Corp Scanning aligner
JPH08107058A (en) * 1994-10-05 1996-04-23 Nikon Corp Scanning-type aligner
JPH0982610A (en) * 1995-09-14 1997-03-28 Nikon Corp Exposure method and exposure apparatus
JPH09162113A (en) * 1995-12-04 1997-06-20 Nikon Corp Orthogonality measuring method, stage apparatus and aligner

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4880308A (en) * 1987-04-08 1989-11-14 Nikon Corporation Aligning apparatus

Also Published As

Publication number Publication date
JP3013837B2 (en) 2000-02-28
GB9909700D0 (en) 1999-06-23
GB2336904A (en) 1999-11-03
KR100291226B1 (en) 2001-05-15
KR19990083517A (en) 1999-11-25
JPH11304425A (en) 1999-11-05

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20050427