GB2335539B - Manufacturing method for self-aligned local interconnects and contacts - Google Patents
Manufacturing method for self-aligned local interconnects and contactsInfo
- Publication number
- GB2335539B GB2335539B GB9805671A GB9805671A GB2335539B GB 2335539 B GB2335539 B GB 2335539B GB 9805671 A GB9805671 A GB 9805671A GB 9805671 A GB9805671 A GB 9805671A GB 2335539 B GB2335539 B GB 2335539B
- Authority
- GB
- United Kingdom
- Prior art keywords
- contacts
- self
- manufacturing
- local interconnects
- aligned local
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9805671A GB2335539B (en) | 1998-03-17 | 1998-03-17 | Manufacturing method for self-aligned local interconnects and contacts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9805671A GB2335539B (en) | 1998-03-17 | 1998-03-17 | Manufacturing method for self-aligned local interconnects and contacts |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9805671D0 GB9805671D0 (en) | 1998-05-13 |
GB2335539A GB2335539A (en) | 1999-09-22 |
GB2335539B true GB2335539B (en) | 2000-02-02 |
Family
ID=10828722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9805671A Expired - Fee Related GB2335539B (en) | 1998-03-17 | 1998-03-17 | Manufacturing method for self-aligned local interconnects and contacts |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2335539B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6630718B1 (en) * | 1999-07-26 | 2003-10-07 | Micron Technology, Inc. | Transistor gate and local interconnect |
KR100333353B1 (en) * | 2000-02-21 | 2002-04-18 | 박종섭 | Contact hole and fabricating method thereof |
US6791190B1 (en) * | 2003-05-09 | 2004-09-14 | Macronix International Co., Ltd. | Self-aligned contact/borderless contact opening and method for forming same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2187889A (en) * | 1986-03-14 | 1987-09-16 | Motorola Inc | Providing contact separation in silicided devices |
US5621232A (en) * | 1993-10-05 | 1997-04-15 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device including a local interconnection between an interconnection layer and an adjoining impurity region |
-
1998
- 1998-03-17 GB GB9805671A patent/GB2335539B/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2187889A (en) * | 1986-03-14 | 1987-09-16 | Motorola Inc | Providing contact separation in silicided devices |
US5621232A (en) * | 1993-10-05 | 1997-04-15 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device including a local interconnection between an interconnection layer and an adjoining impurity region |
Also Published As
Publication number | Publication date |
---|---|
GB9805671D0 (en) | 1998-05-13 |
GB2335539A (en) | 1999-09-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20100317 |