GB2334631A - Zero insertion force test socket - Google Patents

Zero insertion force test socket Download PDF

Info

Publication number
GB2334631A
GB2334631A GB9803543A GB9803543A GB2334631A GB 2334631 A GB2334631 A GB 2334631A GB 9803543 A GB9803543 A GB 9803543A GB 9803543 A GB9803543 A GB 9803543A GB 2334631 A GB2334631 A GB 2334631A
Authority
GB
United Kingdom
Prior art keywords
frame
socket
apertures
receiving
set forth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9803543A
Other versions
GB9803543D0 (en
Inventor
Leif Sommar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microsemi Semiconductor AB
Original Assignee
Mitel Semiconductor AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitel Semiconductor AB filed Critical Mitel Semiconductor AB
Priority to GB9803543A priority Critical patent/GB2334631A/en
Publication of GB9803543D0 publication Critical patent/GB9803543D0/en
Priority to CA002262042A priority patent/CA2262042A1/en
Priority to SE9900524A priority patent/SE9900524L/en
Priority to DE19906848A priority patent/DE19906848A1/en
Priority to FR9901991A priority patent/FR2775346B1/en
Publication of GB2334631A publication Critical patent/GB2334631A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A zero insertion force socket for receiving electronic components to be tested, provides a top carrier frame 12 with apertures 14 for mounting insert terminals 16. The terminals are adapted to receive a component tray having components to be tested. A fixed lower frame 26 is hingedly connected to the top carrier frame 12. An eccentric rod (36) (Fig. 2, not shown) extends through the hinge and abuts an intermediate frame 20. Both an intermediate 20 and lower frame 26 contain insert terminals 24,30. A lever (34) is provided on the hinge rod (36) for moving longitudinally the intermediate frame 20 relative to the top carrier frame 12 and the lower frame 26. This facilitates alignment of the terminals. The design is such that a large test socket can be made at extremely low cost and which further provides a versatility for electronic package testing.

Description

ZERO INSERTION FORCE SOCKET The present invention relates to a zero insertion force socket and more particularly, the present invention relates to a low cost large multiple socket arrangement and bum-in system.
In this art1 one of the most significant drawbacks with existing test sockets relates to the darnage the package undergoes when contacted with the socket Generaily, the pin contacts of the packages are bent, warped or otherwise damaged occasionally to the point of being rendered useless subsequent to the testing procedure.
Numerous socket variations have been proposed to address this problem, typical of which is United States Patent No. 5,147,213, issued September 1 S, 5, 1992 to Funk et a.
This reference teaches a zero insertion pressure test socket for pin grid array electronic packages. The arrangement uses a toggle mechanism for opening and closing contacts within the socket for positioning of a component to be tested.
Nagums, in United States Patent No.5,206,167, provides a socket for testing electronic packages having a cover, latches with hooks and movable releasing blocks.
The socket incorporates several pieces and further is limited in that it may only be used with certain sizes of packages.
A further problem exists with the lack of versatility of currently known sockets.
Usually, size variation of the socket is not possible without employing expensive molding techniques. The present invention facilitates manufacture of low cost large sockets. It would be desirable to have a testing device which does not comport the structural and functional limitations of the prior art arrangements. The present invention satisfies this need.
One object of one embodiment of the present invention is to provide an improved ZIF socket which is versatile for use in a host of situations.
A further object of the present invention is to provide a zero insertion force test socket, comprising: a top carrier frame including apertures, the apertures for receiving top insert terminals, the terminals for receiving a component Way having components to be tested; a fixed lower frame having apertures for receiving lower insert terminals for communication with the top insert terminals, the lower frame hingedly connected to the top carrier frame; an intermediate frame having apertures for receiving intermediate inserts and for positioning between the top carrier frame and the lower frame1 the intermediate frame mounted for movement between the top frame and the lower frame: an eccentric hinge rod extending through and connecting the top carrier frame and the lower carrier frame, the rod being in contact with the intermediate frame; and means for moving the rod to effect movement of the intermediate frame relative to the top frame and the lower frame for aligning inserts of the top carrier frame, the intermediate frame and the lower frame.
As a further object of one embodiment of the present invention, there is provided a bum-in assembly suitable for testing electronic components, comprising: a burn-in board in electrical connection with an electrical source; a zero insertion force test socket in electrical connection with the board1 the socket comprising: a top carrier frame including apertures, the apertures for receiving top insert terminals. the terminals for receiving a component tray having components to be tested; a fixed lower frame having apertures for receiving lower insert terminals for communication with the top insert terminals and the bum-in board1 the lower frame hingedly connected to the top carrier frame; an intermediate frame having apertures for receiving intermediate inserts and for positioning between the top carrier frame and the lower frame, the intermediate frame mounted for movement between the top frame and the lower frame an eccentric hinge rod extending through and connecting the top carrier frame and the lower carrier frame, the rod being in contact with the intermediate frame; and means for moving the rod to effect movement of the intermediate frame relative to the top frame and the lower frame for aligning inserts of the top carrier frame, the intermediate frame and the lower frame.
Advantageously, the arrangement according to the present invention does not i) involve any moiding or size changes; ii) only two major parts are required as opposed to the prior art where several component sockets were normally encountered; and iii) a wide range of sizes of sockets may be readily formed for greater utility of the arrangement.
Having thus generally described the invention, reference will now be made to the accompanying drawings illustrating preferred embodiments and in which: Figure 1 is an exploded view of the socket according to one embodiment of the present invention; Figure 2 is a side view illustrating the disposition of the elements; and Figure 3 is a top plan view of the bum-in assembly.
Similar numerals used in the text denote similar elements.
Referring now to the drawings, the assembly denoted by numeral 10 0 includes a top carrier frame 12 having openings 14 for receiving top inserts 16 only one of which is shown, however, it will be understood that numerous openings may be positioned in opening 14.
Frame 12 has groove 18 for receiving a rod (discussed hereinafter). Frame 12 overlies an intermediate frame 20 which also indudes openings 22 Openings 22 receive inserts 24.
A lower frame 26 underlies frame 22 and provides openings 28 for receiving inserts 30.
Frame 26 has a groove 32 for accommodating the rod to be discussed hereinafter.
Frame 20 is mounted between frames 12 and 26 for longitudinal movement there between. Movement is accomplished by actuation of lever 34 connected to a rod 36. The rod 36 is eccentric and as such, movement thereof imparts movement to frame 20 which contacts rod 36. This movement facilitates alignment of inserts 16, 24 and 30.
In use a component tray 38 is positioned in contact with frame 12 and more particularly, the aligned inserts. A test device 40 is connected to tray 38 as shown. Once all of the described elements are in position, the assembly 10 may be soldered to a bum-in board 42. Board 42 is connected to an electrical source (not shown) in order to provide power to the sockets and thus the device to be tested.
It is preferred that the intermediate frame comprise a material that is ngid such as metal to prevent alignment problems typically associated with less rigid or durable materials. Further, nonconductive materials are preferred for the inserts in order to prevent short circuiting the test devices.
Although embodiments of the invention have been described above, the invention is not limited thereto and it will be apparent to those skilled in the art that numerous modifications form part of the present invention insofar as they do not depart from the spirit. nature, and scope of the daimed and descnbed invention

Claims (12)

CLAIMS: 1. A zero insertion force test socket, comprising: a top carrier frame including apertures. said apertures for receiving top insert terminals. said terminals for receiving a component tray having components to be tested; a fixed lower frame having apertures for receiving lower insert terminals for communication with said top insert terminals, said lower frame hingedly connected to said top carrier frame; an intermediate frame having apertures for receiving intermediate inserts and for positioning between said top carrier frame and said lower'frame, said intermediate frame mounted for movement between said top frame and said lower frame; an eccentric hinge rod extending through and connecting said top carrier frame and said lower carrier frame, said rod being in contact with said intermediate frame; and means for moving said rod to effect movement of said intermediate frame relative to said top frame and said lower frame for aligning inserts of said top carrier frame. said intermediate frame and said lower frame. 2. The socket as set forth in claim 1, wherein said intermediate frame comprises a metal material. 3. The socket as set forth in claim 1, wherein said means for moving said rod comprises a lever. 4. The socket as set forth in daim 1, wherein said inserts comprise a nonconductive material. 5. The socket as set forth in claim 4, wherein said nonconductive material comprises plastic. 6. The socket as set forth in claim 2, wherein said metal material comprises aluminum. 7. A burn-in assembly suitable for testing electronic components, comprising: a bum-in board in electrical connection with an electrical source; a zero insertion force test socket in electrical connection with said board, said socket comprising: a top carrier frame induding apertures, said apertures for receiving top insert terminals, said terminals for receiving a component tray having components to be tested; a fixed lower frame having apertures for receiving lower insert terminals for communication with said top insert terminais and said bum-in board, said lower frame hingedly connected to said top carrier frame; an intermediate frame having apertures for receiving intermediate inserts and for positioning between said top carrier frame and said lower frame said intermediate frame mounted for movement between said top frame and said lower frame; an eccentric hinge rod extending through and connecting said top carrier frame and said lower carrier frame, said rod being in contact with said intermediate frame; and means for moving said rod to effect movement of said intermediate frame relative to said top frame and said lower frame for aligning inserts of said top carrier frame, said intermediate frame and said lower 8. The assembly as set forth in claim 7, wherein said assembly includes a plurality of sockets. 9. The assembly as set forth in claim 8, wherein said sockets are soldered to said bum-in board. 10. The assembly as set forth in claim 1, wherein said intermediate frame comprises metal material. Amendments to the claims have been fled as follows CLAIMS:
1. A zero insertion force test socket, comprising: a top carrier frame including apertures. said apertures for receiving top insert terminals, said terminals for receiving a component tray having components to be tested; a fixed lower frame having apertures for receiving lower insert terminals for communication with said top insert terminals, said lower frame hingedly connected to said top carrier frame; an intermediate frame having apertures for receiving intermediate inserts and for positioning between said top carrier frame and said lower'frame, said intermediate frame mounted for movement between said top frame and said lower frame: an eccentric hinge rod extending through and connecting said top carrier frame and said lower carrier frame, said rod being in contact with said intermediate frame; and means for moving said rod to effect movement of said intermediate frame relative to said top frame and said lower frame for aligning inserts of said top carrier frame. said intermediate frame and said lower frame.
2. The socket as set forth in claim 1, wherein said intermediate frame comprises a metal material.
3. The socket as set forth in claim 1, wherein said means for moving said rod comprises a lever.
4. The socket as set forth in claim 1, wherein said inserts comprise a nonconductive material.
5. The socket as set forth in claim 4, wherein said nonconductive material comprises plastic.
6. The socket as set forth in claim 2, wherein said metal material comprises aluminum.
7. A bum-in assembly suitable for testing electronic components, comprising: a bum-in board in electrical connection with an electrical source; a zero insertion force test socket in electrical connection with said board, said socket comprising: a top carrier frame including apertures, said apertures for receiving top insert terminals, said terminals for receiving a component tray having components to be tested; a fixed lower frame having apertures for receiving lower insert terminals for communication with said top insert terminals and said bum-in board, said lower frame hingedly connected to said top carrier frame; an intermediate frame having apertures for receiving intermediate inserts and for positioning between said top carrier frame and said lower frame, said intermediate frame mounted for movement between said top frame and said lower frame; an eccentric hinge rod extending through and connecting said top carrier frame and said lower carrier frame, said rod being in contact with said intermediate frame; and means for moving said rod to effect movement of said intermediate frame relative to said top frame and said lower frame for aligning inserts of said top carrier frame, said intermediate frame and said lower
8. The assembly as set forth in claim 7, wherein said assembly includes a plurality of sockets.
9. The assembly as set forth in claim 8, wherein said sockets are soldered to said burn-in board.
10. The assembly as set forth in claim 1, wherein said intermediate frame comprises metal material.
11. A zero insertion force test socket, substantially as hereinbefore described with reference to the accompanying drawings.
12. A bum-in assembly substantially as hereinbefore described with reference to the accompanying drawings.
GB9803543A 1998-02-20 1998-02-20 Zero insertion force test socket Withdrawn GB2334631A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB9803543A GB2334631A (en) 1998-02-20 1998-02-20 Zero insertion force test socket
CA002262042A CA2262042A1 (en) 1998-02-20 1999-02-15 Zero insertion force socket
SE9900524A SE9900524L (en) 1998-02-20 1999-02-17 Test base with zero force at insertion
DE19906848A DE19906848A1 (en) 1998-02-20 1999-02-18 Zero insertion force test socket for receiving electronic components to be tested
FR9901991A FR2775346B1 (en) 1998-02-20 1999-02-18 SUPPORT WITHOUT PLUG-IN EFFORT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9803543A GB2334631A (en) 1998-02-20 1998-02-20 Zero insertion force test socket

Publications (2)

Publication Number Publication Date
GB9803543D0 GB9803543D0 (en) 1998-04-15
GB2334631A true GB2334631A (en) 1999-08-25

Family

ID=10827274

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9803543A Withdrawn GB2334631A (en) 1998-02-20 1998-02-20 Zero insertion force test socket

Country Status (5)

Country Link
CA (1) CA2262042A1 (en)
DE (1) DE19906848A1 (en)
FR (1) FR2775346B1 (en)
GB (1) GB2334631A (en)
SE (1) SE9900524L (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2059063A1 (en) * 2007-11-12 2009-05-13 Panasonic Corporation Electronic component, electronic component unit, speaker, and mobile terminal including speaker

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2229050A (en) * 1987-12-21 1990-09-12 Wells Electronics Electrical socket for securing component leads
US5073125A (en) * 1989-04-07 1991-12-17 Japan Aviation Electronics Industry, Limited Electrical connector comprising an intermediate connection element for connecting and disconnecting between a first and second connection element

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4012099A (en) * 1975-05-01 1977-03-15 E-H Research Laboratories, Inc. Zero insertion force socket
JPS5827400A (en) * 1981-08-11 1983-02-18 山一電機工業株式会社 Locking mechanism for ic retaining plate in ic socket
JPS60129147U (en) * 1984-02-09 1985-08-30 野中　良眞 IC socket with no-load attachment/detachment mechanism
US4988310A (en) * 1989-10-10 1991-01-29 Amp Incorporated ZIF PGA socket and a tool for use therewith
US5149276A (en) * 1991-12-18 1992-09-22 Amp Incorporated Modular holder having an ejector mechanism for a dual IC package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2229050A (en) * 1987-12-21 1990-09-12 Wells Electronics Electrical socket for securing component leads
US5073125A (en) * 1989-04-07 1991-12-17 Japan Aviation Electronics Industry, Limited Electrical connector comprising an intermediate connection element for connecting and disconnecting between a first and second connection element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2059063A1 (en) * 2007-11-12 2009-05-13 Panasonic Corporation Electronic component, electronic component unit, speaker, and mobile terminal including speaker

Also Published As

Publication number Publication date
SE9900524L (en) 1999-08-21
FR2775346A1 (en) 1999-08-27
SE9900524D0 (en) 1999-02-17
DE19906848A1 (en) 1999-09-09
GB9803543D0 (en) 1998-04-15
FR2775346B1 (en) 2001-11-02
CA2262042A1 (en) 1999-08-20

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)