GB2327150B - Composite substrate for heat-generating semiconductor device and semiconductor decice and semiconductor apparatus using the same - Google Patents
Composite substrate for heat-generating semiconductor device and semiconductor decice and semiconductor apparatus using the sameInfo
- Publication number
- GB2327150B GB2327150B GB9823805A GB9823805A GB2327150B GB 2327150 B GB2327150 B GB 2327150B GB 9823805 A GB9823805 A GB 9823805A GB 9823805 A GB9823805 A GB 9823805A GB 2327150 B GB2327150 B GB 2327150B
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor
- decice
- heat
- same
- composite substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 3
- 239000002131 composite material Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6418796 | 1996-03-21 | ||
JP25062996 | 1996-09-20 | ||
GB9705237A GB2311414B (en) | 1996-03-21 | 1997-03-13 | Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9823805D0 GB9823805D0 (en) | 1998-12-23 |
GB2327150A GB2327150A (en) | 1999-01-13 |
GB2327150B true GB2327150B (en) | 1999-07-07 |
Family
ID=27268773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9823805A Expired - Fee Related GB2327150B (en) | 1996-03-21 | 1997-03-13 | Composite substrate for heat-generating semiconductor device and semiconductor decice and semiconductor apparatus using the same |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2327150B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101022583B1 (en) * | 2001-05-24 | 2011-03-16 | 프라이즈 메탈즈, 인크. | Thermal interface material and solder preforms |
CN1255563C (en) | 2001-05-24 | 2006-05-10 | 弗莱氏金属公司 | Thermal interface material and heat sink configuration |
US7709951B2 (en) * | 2007-03-16 | 2010-05-04 | International Business Machines Corporation | Thermal pillow |
DE102017221778A1 (en) * | 2017-12-04 | 2019-06-06 | Siemens Aktiengesellschaft | Heat sink for an electronic component, electronic assembly with such a heat sink and method for producing such a heat sink |
CN111647766B (en) * | 2020-06-11 | 2021-05-11 | 昆明理工大学 | Preparation method of copper-based composite material |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0471552A1 (en) * | 1990-08-14 | 1992-02-19 | Texas Instruments Incorporated | Heat transfer module for ultra high density and silicon on silicon packaging applications |
-
1997
- 1997-03-13 GB GB9823805A patent/GB2327150B/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0471552A1 (en) * | 1990-08-14 | 1992-02-19 | Texas Instruments Incorporated | Heat transfer module for ultra high density and silicon on silicon packaging applications |
Also Published As
Publication number | Publication date |
---|---|
GB2327150A (en) | 1999-01-13 |
GB9823805D0 (en) | 1998-12-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20030313 |