GB2326771A - Improvements relating to printed circuit board pin location - Google Patents
Improvements relating to printed circuit board pin location Download PDFInfo
- Publication number
- GB2326771A GB2326771A GB9804903A GB9804903A GB2326771A GB 2326771 A GB2326771 A GB 2326771A GB 9804903 A GB9804903 A GB 9804903A GB 9804903 A GB9804903 A GB 9804903A GB 2326771 A GB2326771 A GB 2326771A
- Authority
- GB
- United Kingdom
- Prior art keywords
- pin
- plating
- board
- board according
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Description
1 2326771 Improvements relatinq to Printed Circuit Board Pin Location
Printed circuit boards conventionally carry a pattern of electrically conductive surface lines which interconnect mounting points for electrical components in a required circuit configuration. The components may be mounted to pins projecting from the surface of the printed circuit board. There is a need to be able to locate these pins securely onto the board in such a way that they are electrically connected to the circuit lines laid down on the board.
According to the present invention there is provided a printed circuit board incorporating surface electricallyconductive plating lines interconnecting electrically conductive pins set into the board at positions where blind holes to receive the pins are provided, the plating extending into and lining the internal side walls of the holes and each pin being constructed to have a mechanical interference fit into the respective hole.
By lining the interior of the blind holes and providing pins which have a mechanical interference fit when pushed into those holes, a positive electrical interconnection between the plating lines and the pins is achieved, together with a secure mounting of the pins into the board. This arrangement is particularly advantageous where the other face of the board (from which the pins project) is required for additional circuit layouts. If the holes extended all the way through the board this would reduce the area over 2 which those additional circuit layouts on the other face could be provided. Nevertheless there will be instances where there is a need to extend the circuit from one side of the board to the other and for this purpose the plating can additionally extend through through-holes allowing the plating to extend from one surface to the other of the board.
The plating, at least within the blind holes, ideally comprises successive layers of copper, then nickel, then 10 gold plating which provides for a secure coating and good electrical conductivity. Each pin is preferably formed from brass with gold plating.
It is preferred that the end of each pin fitting into a blind hole is knurled or splined, or is split to define is compressible projecting parts. This allows for a particularly secure grip of the pin into the hole. An enlarged collar can be formed between the two ends of each pin to enable the pin to be gripped readily during the assembly process of inserting the pin into a blind hole.
The invention may be performed in various ways and a preferred embodiment will now be described, by way of example, with reference to the accompanying drawings, in which:- Figure 1 is a section through part of a printed circuit board incorporating pin mountings in accordance with this invention; Figure 2 shows the design of one of the pins mounted into the board of Figure 1; 3 Figure 3 is a side view of an alternative form of pin for insertion into a board; Figure 4 is an end view of the pin shown in Figure 3; and Figures 5 and 6 illustrate alternative pin shapes for use in the printed circuit board of Figure 1.
A circuit board 1 shown in Figure 1 has a circuit printed thereon formed by a plating process using conven tional techniques and convent-Lonal plating materials giving good electrical conductivity. The plating lines can extend through through-holes 3 to interconnect with further plating lines 4 on the other face of the board 1. A component 5 could, for example, be electrically interconnected to the plating lines 4 in a known manner. Additionally though the board incorporates mounting pins 6 to which electrical components can be attached. In order to locate the pins 6 into the board 1, blind holes 7 are provided (which will not then interfere with the laid down plating lines 4 on the other surface of the board). The plating material of the plating lines 2 extends into the blind holes 7, as indicated at 8, to coat the internal side walls of the holes. In this instance the plating, at least within the holes 7, will comprise successive layers of copper, nickel and gold. A s can be seen from Figure 2 each pin has a splined end 9 which will be an interference fit within the hole 7. Thus when the pin 6 is driven into the hole 7 it will be held tightly in place and additionally will make secure electrical contact with the plating material 8 within the hole 7. A 4 collar 10 is formed on the pin, largely to enable the pin to be gripped readily during the assembly process.
The alternative form of pin 6A shown in Figures 3 and 4 has a head 11 which is split to define openings 12, thus creating projecting parts 13. When the head 11 of this pin 6A is driven into one of the holes 7, the head can compress to some extent and the projections 13 will grip the interior of the holes 7 firmly and also make good electrical contact with the plating material 8.
The pin shape can be modified in various ways and some possibilities are shown in Figures 5 and 6 for a curved shank 6A or a ball-shaped shank 6B respectively.
Claims (8)
- A printed circuit board incorporating surface electrically-conductive plating lines interconnecting electrical ly- conductive pins set into the board at positions where blind holes to receive the pins are provided, the plating extending into and lining the internal side walls of the holes and each pin being constructed to have a mechanical interference fit into the respective hole.
- 2. A board according to Claim 1, wherein the plating additionally extends through through-holes allowing the plating to extend from one surface to the other of the board.
- 3. A board according to Claim 1 or Claim 2, wherein the plating, at least within the blind holes, comprises successive layers of copper, then nickel, then gold plating.
- 4. A board according to any one of Claims 1 to 3, wherein each pin is formed from brass with gold plating.
- 5. A board according to any one of Claims 1 to 4, wherein the end of each pin fitting into a blind hole is knurled or splined.
- 6. A board according to any one of Claims 1 to 4, wherein the end of each pin fitting into a blind hole is split to define compressible projecting parts.
- 7. A board according to any one of Claims 1 to 6, wherein an enlarged collar is formed between the two ends of each pin to enable the pin to be gripped readily during the assembly process of inserting the pin into a blind hole.6
- 8. A board according to any one of Claims 1 to 7, wherein the shank of each pin is formed to a linear, curved or ballshaped form.-9. A printed ci-cuit board substantially as herein 5 described with reference to the accompanying drawings.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9705277.3A GB9705277D0 (en) | 1997-03-14 | 1997-03-14 | Improvements relating to printed circuit board pin location |
Publications (2)
Publication Number | Publication Date |
---|---|
GB9804903D0 GB9804903D0 (en) | 1998-04-29 |
GB2326771A true GB2326771A (en) | 1998-12-30 |
Family
ID=10809208
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB9705277.3A Pending GB9705277D0 (en) | 1997-03-14 | 1997-03-14 | Improvements relating to printed circuit board pin location |
GB9804903A Withdrawn GB2326771A (en) | 1997-03-14 | 1998-03-10 | Improvements relating to printed circuit board pin location |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB9705277.3A Pending GB9705277D0 (en) | 1997-03-14 | 1997-03-14 | Improvements relating to printed circuit board pin location |
Country Status (2)
Country | Link |
---|---|
GB (2) | GB9705277D0 (en) |
WO (1) | WO1998042043A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1720387A1 (en) * | 2005-05-03 | 2006-11-08 | Franz Broch | High current terminal with press fit portion |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4752250A (en) * | 1985-02-05 | 1988-06-21 | American Specialties Corp. | Compliant connector |
US4821411A (en) * | 1985-06-13 | 1989-04-18 | Hirose Electric Co., Ltd. | Method of manufacturing electrical contact pins |
US4831778A (en) * | 1987-09-11 | 1989-05-23 | Capitol Products Corporation | Upper window sash with projections for simplified sash installation and removal |
US4836806A (en) * | 1983-10-24 | 1989-06-06 | Microdot Inc. | Pin connector |
WO1996024175A1 (en) * | 1995-01-31 | 1996-08-08 | The Whitaker Corporation | Press-fit connecting pin and electronic device using the same |
US5715595A (en) * | 1994-01-21 | 1998-02-10 | International Business Machines Corporation | Method of forming a pinned module |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4084869A (en) * | 1976-11-10 | 1978-04-18 | Intel Corporation | Interconnector for integrated circuit package |
US4312897A (en) * | 1978-09-18 | 1982-01-26 | Hughes Aircraft Company | Buried resist technique for the fabrication of printed wiring |
GB2121620A (en) * | 1982-06-08 | 1983-12-21 | Oxley Dev Co Ltd | Connectors pins for printed circuit boards |
JPH0234461B2 (en) * | 1983-06-20 | 1990-08-03 | Intaanashonaru Bijinesu Mashiinzu Corp | HIENKEIPINANAAKITASOJUDENTAIKIBANOYOBISONOSEIZOHOHO |
US4769907A (en) * | 1987-07-27 | 1988-09-13 | Northern Telecom Limited | Method of making a circuit board pin |
US5410452A (en) * | 1994-02-18 | 1995-04-25 | Aries Electronics, Inc. | Printed circuit board electrical adaptor pin |
-
1997
- 1997-03-14 GB GBGB9705277.3A patent/GB9705277D0/en active Pending
-
1998
- 1998-03-10 GB GB9804903A patent/GB2326771A/en not_active Withdrawn
- 1998-03-16 WO PCT/GB1998/000631 patent/WO1998042043A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4836806A (en) * | 1983-10-24 | 1989-06-06 | Microdot Inc. | Pin connector |
US4752250A (en) * | 1985-02-05 | 1988-06-21 | American Specialties Corp. | Compliant connector |
US4821411A (en) * | 1985-06-13 | 1989-04-18 | Hirose Electric Co., Ltd. | Method of manufacturing electrical contact pins |
US4831778A (en) * | 1987-09-11 | 1989-05-23 | Capitol Products Corporation | Upper window sash with projections for simplified sash installation and removal |
US5715595A (en) * | 1994-01-21 | 1998-02-10 | International Business Machines Corporation | Method of forming a pinned module |
WO1996024175A1 (en) * | 1995-01-31 | 1996-08-08 | The Whitaker Corporation | Press-fit connecting pin and electronic device using the same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1720387A1 (en) * | 2005-05-03 | 2006-11-08 | Franz Broch | High current terminal with press fit portion |
Also Published As
Publication number | Publication date |
---|---|
GB9705277D0 (en) | 1997-04-30 |
GB9804903D0 (en) | 1998-04-29 |
WO1998042043A1 (en) | 1998-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |