GB2326525A - Concentrators for light sensor arrays - Google Patents

Concentrators for light sensor arrays Download PDF

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Publication number
GB2326525A
GB2326525A GB9810762A GB9810762A GB2326525A GB 2326525 A GB2326525 A GB 2326525A GB 9810762 A GB9810762 A GB 9810762A GB 9810762 A GB9810762 A GB 9810762A GB 2326525 A GB2326525 A GB 2326525A
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GB
United Kingdom
Prior art keywords
light
electronic
sensor array
reflective
light sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9810762A
Other versions
GB9810762D0 (en
Inventor
Mark Leonard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of GB9810762D0 publication Critical patent/GB9810762D0/en
Publication of GB2326525A publication Critical patent/GB2326525A/en
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685Process for coatings or optical elements

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Description

ELECTRIC LIGHT SENSOR ARRAY This invention relates generally to an array of light sensors which can be used for image scanning in an electronic photography apparatus. in particular, it relates to an array of light sensitive devices and a corresponding array of light concentrators in which both arrays are located on a substrate.
An electronic camera generally converts an optical image into a set of electronic signals. The electronic signals may represent intensities of colors of light received by the camera. The electronic camera typically includes an array of light-sensitive sensors which detect the intensity of light received by the camera. The light-sensitive sensors typically generate electronic signals that have amplitudes that are proportionate to the intensity of the light received by the sensors. The electronic signals can be conditioned and sampled to allow image processing.
Many optical systems use micro-lens elements to concentrate a light source onto an array of light sensitive elements. These systems can be limited in performance because the light being imaged onto the light sensitive elements is not well controlled. Circuitry for conditioning the electronic signals generated by the light sensitive element can be located proximate to the light sensitive elements. The electrical performance of the conditioning circuitry, however, can be affected by light which is directly or indirectly focused on the conditioning circuitry. The imaging of the light passing through the micro-lenses cannot be controlled with enough precision to prevent the conditioning circuitry from being exposed to any light. Furthermore, the intensity of the light the conditioning circuitry receives varies as the intensity of the light source varies. Therefore, the electrical performance of the signal conditioning circuitry is affected by the intensity of the light source.
Other optical systems use charge coupled devices (CCDs) to detect light directly from a image light source. CCD devices are expensive. Furthermore, CCD devices cannot be fabricated from standard integrated circuit technology along with the signal conditioning circuitry. That is, the use of CCD devices requires a separate integrated circuit for the signal conditioning circuitry. Additional integrated circuits increase the cost of the optical system.
It is desirable to have an imaging system which allows light sensitive devices to be located on the same substrate as at least a portion of the signal conditioning circuitry. It is desirable for light received by the imaging system to be concentrated on each light sensitive device. The direction of the concentrated light should be controllable with enough precision that proximate signal conditioning circuitry is not exposed to the received light. Light which is shielded from the signal conditioning circuitry should be directed towards the light sensitive devices rather than being lost. Furthermore, it is desirable that the light sensitive devices and the conditioning circuitry be fabricated on a single CMOS integrated circuit.
The present invention provides an electronic image detection structure which optimizes coupling of received light to light sensors within the image detection structure.
The light sensors are located on a substrate and generate electronic signals proportional to the intensity of the light received by the light sensors. The structure allows signal processing circuitry associated with the light sensors to be located on the same substrate as the light sensors.
A first embodiment of this invention includes an electronic light sensor array. The electronic sensor array includes a plurality of light sensors located on a substrate. Each light sensor senses light and generates an electronic signal proportional to the intensity of the sensed light. This embodiment further includes a plurality of light concentrators located on the substrate. Each light concentrator receives light and concentrates the light on a corresponding light sensor. Each electronic signal is received by signal conditioning circuitry. At least a portion of the signal conditioning circuitry is located on the substrate with the light sensors.
Another embodiment of the invention is similar to the first embodiment, but includes each light concentrator passing a select range of wavelengths of light.
Other aspects and advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
Figure 1 shows an embodiment of the invention.
Figure 2 shows a single reflective light concentrator Figure 3 shows the formation of the reflective light concentrators by etching an aluminum layer.
Figure 4 shows the formation of the reflective light concentrators by etching an aluminum layer.
Figure 5 shows the formation of the reflective light concentrators by etching an aluminum layer.
Figure 6 shows the reflective light concentrators with the resist removed.
Figure 7 shows the cavities of the reflective light concentrators of Figure 6 filled with a transparent material which passes a select range of wavelengths of light.
Figure 8 shows the reflective light concentrator structure of Figure 7 with the aluminum etched away.
Figure 9 shows reflective light concentrators which provide varying levels of optical intensity.
Figure 10 shows reflective light concentrators formed as troughs in which each reflective light concentrator corresponds with several light sensitive devices.
As shown in the drawings for purposes of illustration, the invention is embodied in an array of reflective light concentrators attached and aligned to an array of light detection devices. The light detection devices are on a substrate which also includes signal conditioning circuitry. The reflective light concentrators concentrate received light on the light detection devices. The light detection devices generate electronic signals proportional to the intensity of the received light. The signal conditioning circuitry conditions the electronic signals generated by the light detection devices.
Figure 1 shows a cross-sectional view of an embodiment of the invention. This embodiment includes a substrate 20. The substrate includes an array of light sensitive devices 22. An array of reflective light concentrators 24 are located on the substrate 20.
The array of reflective light concentrators 24 are aligned so that each reflective light concentrator 24 is centered over a corresponding light sensitive device 22. The reflective light concentrators 24 receive light and concentrate the light on the light sensitive devices 22. The substrate 20 further includes signal conditioning circuitry 26 between the light sensitive devices 22.
Figure 2 shows a single reflective light concentrator 24. The reflective light concentrator 24 includes light-reflective walls 28 which connect a large entrance opening 30 with a small exit opening 32. In this embodiment the large entrance opening 30 and the small exit opening 32 are circular. However, this invention includes the large entrance opening 30 and the small exit opening 32 being noncircular in shape if the reflective light concentrators need to be packed more densely. Light received by the large entrance opening 30 of the reflective light concentrator 24 is concentrated into the smaller exit opening 32 of the reflective light concentrator 24. The reflective light concentrator 24 gathers and concentrates light at the exit opening 32. Light intensity at the exit opening 32 is greater than light intensity at the entrance opening 30.
The reflective light concentrator 24 can formed in the shape of a compound parabolic concentrator. Compound parabolic concentrators are thoroughly described in "High Collection Nonimaging Optics, (W.T. Welford and R. Winston, 1989, Academic Press). Alternately, the shape of the concentrator 24 is dependent upon the process steps required to form the concentrator 24.
An array of concentrators 24 are attached and aligned to an array of light detection devices 22. Light received by each concentrator 24 is concentrated on a corresponding light detection device 22. Therefore, light which would otherwise have fallen on the signal conditioning circuitry 26 is re-directed and concentrated onto the light-sensitive devices 22.
The concentrators 24 increase the percentage of light which falls on light-sensitive devices 22.
The electrical performance of the signal processing circuitry 26 can be affected if the signal processing circuitry is exposed to light. The concentrators 24 increase the surface area of the substrate 20 which is not exposed to light. Therefore, the concentrators 24 increase the area on the integrated circuit which can be used for signal conditioning circuitry 26.
The light sensitive devices 22 can be photo-sensitive diodes or transistors.
However, the light sensitive devices 22 may be any electronic structure which can be manufactured within the constraints of integrated circuit manufacturing processes. Each light sensitive device 22 can include subdevices which are sensitive to particular colors of light.
The substrate 20 is typically silicon. However, other materials may be logical extensions or implementations of the invention.
The signal conditioning circuitry 26 can provide many different electronic functions. For example, the signal conditioning circuitry 26 can provide amplification and filtering of the electronic signals generated by the light-sensitive devices 22. Furthermore, the signal conditioning circuitry can include sampling circuitry for generating digital samples of the electronic signals. The digital samples can be further processes and conditioned with digital electronics.
Figures 3, 4 and 5 show a method of forming the reflective light concentrators on the substrate 20. A layer of aluminum 40 is deposited over the substrate 20. A layer of resist 42 is deposited over the layer of aluminum 40. Openings 44 are formed in the resist 42. The openings are formed using standard photolithographic techniques well known to integrated circuit manufacturers. The openings 44 are located where the reflective light concentrators are to be formed in the aluminum layer 40. The aluminum layer 40 is continually etched forming cavities where the openings 44 are located. Figures 3, 4 and 5 show the formation of the reflective light concentrators as the aluminum layer 40 is continually etched.
Figure 6 shows another embodiment in which the resist 42 has been removed.
Figure 7 shows another embodiment in which the reflective light concentrators have been filled with a material 70. The material 70 can include a clear plastic. The material 70 can be colored or dyed so that light passing through the material 70 is filtered. The reflective light concentrators can be systematically colored or dyed to correspond to a chromatic pattern. Furthermore, the material 70 may be selectively chosen so that the index of refraction of the material 70 is between the index of refraction of air and silicon. Silicon is very reflective because silicon has a high index of refraction. The material 70 can be selected to minimize the amount of light which is lost by reflection off of the surface of the substrate 20.
Figure 8 shows another embodiment in which the aluminum layer 40 has been removed.
Figure 9 shows an alternate embodiment of the invention. This embodiment includes the reflective light concentrators consisting of wider opening reflective light concentrators 90 and narrower opening reflective light concentrators 92. The wider opening reflective light concentrators 90 couple more light to the sensors 22 than the narrower opening reflective light concentrators 92. The sensitivity of the light sensors 22 can vary depending upon the color light the particular light sensor senses. For example, a red light sensor may not be as sensitive as a blue light sensor. Therefore, a wider opening reflective light concentrator 90 corresponding with the red sensor can couple more light to the red sensor.
Figure 10 shows an alternate embodiment of the invention. This embodiment includes the concentrators being formed as elongated troughs in which a single concentrator concentrates light to a plurality of light sensitive devices.
Although specific embodiments of the invention have been described and illustrated, the invention is not to be limited to the specific forms or arrangements of parts so described and illustrated. The invention is limited only by the claims.

Claims (16)

1. An electronic light sensor array comprising: a plurality of light sensors located on a substrate, each light sensor sensing light and generating an electronic signal proportional to the intensity of the sensed light; a plurality of reflective light concentrators, each reflective light concentrator receiving light and concentrating the light on a corresponding light sensor; and signal conditioning circuitry receiving the electronic signal, conditioning circuitry located on the substrate.
2. The electronic light sensor array recited in claim 1, wherein the plurality of reflective light concentrators are attached to the substrate.
3. The electronic light sensor array recited in claim 1 or 2, wherein the reflective light concentrators comprise reflective cavities.
4. The electronic light sensor array recited in claim 3, wherein the reflective cavities are at lest partially filled wit a transparent material.
5. The electronic light sensor array recited in any preceding claim, wherein each reflective light concentrator passes a select range of wavelengths of the light.
6. The electronic light sensor array recited in claim 1, wherein each reflective light concentrator includes a material which has an index of refraction between the index of refraction of air and the index of refraction of the substrate.
7. The electronic light sensor array recited in any preceding claim, wherein the light sensors include light-sensitive transistors.
8. The electronic light sensor array recited in any receding claim, wherein the light sensors include light-sensitive diodes.
9. The electronic light sensor array recited in any preceding claim, wherein the signal conditioning circuitry includes electronic signal amplification and signal sampling.
10. The electronic light sensor array recited in any preceding claim, wherein each light sensitive device comprises a plurality of sub-sensors.
11. The electronic light sensor array recited in claim 10, wherein each sub-sensor detects a pre-selected range of wavelengths of light.
12. The electronic light sensor array recited in claim 1, wherein the reflective light concentrators are formed in the shape of elongated troughs and each reflective light concentrator concentrates light to a plurality of light sensors.
13. The electronic light sensor array recited in claim 12, wherein the reflective light concentrators are at least partially filled with a transparent material.
14. The electronic light sensor array recited in claim 12 or 13. wherein each reflective light concentrator passes a select range of wavelengths of the light.
15. The electronic light sensor array recited in claim 12, wherein each reflective light concentrator includes a material which has an index of refraction between the index of refraction of air and the index of refraction of the substrate.
16. An electronic light sensor array substantially as herein described with reference to each of the accompanying drawings.
GB9810762A 1997-05-20 1998-05-19 Concentrators for light sensor arrays Withdrawn GB2326525A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US85893997A 1997-05-20 1997-05-20

Publications (2)

Publication Number Publication Date
GB9810762D0 GB9810762D0 (en) 1998-07-15
GB2326525A true GB2326525A (en) 1998-12-23

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JP (1) JPH10335618A (en)
GB (1) GB2326525A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004011548A1 (en) * 2004-03-08 2005-09-29 Giesecke & Devrient Gmbh Optical sensor, e.g. for chip card fingerprint sensor, comprises optical layer with optical elements consisting of material deposited directly onto semiconductor circuit layer
US7160017B2 (en) 2004-06-03 2007-01-09 Eastman Kodak Company Brightness enhancement film using a linear arrangement of light concentrators
WO2009057075A2 (en) * 2007-11-01 2009-05-07 Insiava (Pty) Ltd Optoelectronic device with light directing arrangement and method of forming the arrangement

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4618765B2 (en) * 2003-08-19 2011-01-26 キヤノン株式会社 Image sensor and digital camera equipped with the image sensor
JP5402092B2 (en) * 2009-03-04 2014-01-29 ソニー株式会社 Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatus
US10763297B1 (en) * 2019-05-31 2020-09-01 Int Tech Co., Ltd. Optical sensor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029519A (en) * 1976-03-19 1977-06-14 The United States Of America As Represented By The United States Energy Research And Development Administration Solar collector having a solid transmission medium
US4080221A (en) * 1976-11-09 1978-03-21 Manelas Arthur J Solar cell electric and heating system
US4199376A (en) * 1978-11-06 1980-04-22 Atlantic Richfield Company Luminescent solar collector
WO1991018419A1 (en) * 1990-05-21 1991-11-28 The Boeing Company Terrestrial concentrator solar cell module
GB2248964A (en) * 1990-10-17 1992-04-22 Philips Electronic Associated Plural-wavelength infrared detector devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029519A (en) * 1976-03-19 1977-06-14 The United States Of America As Represented By The United States Energy Research And Development Administration Solar collector having a solid transmission medium
US4080221A (en) * 1976-11-09 1978-03-21 Manelas Arthur J Solar cell electric and heating system
US4199376A (en) * 1978-11-06 1980-04-22 Atlantic Richfield Company Luminescent solar collector
WO1991018419A1 (en) * 1990-05-21 1991-11-28 The Boeing Company Terrestrial concentrator solar cell module
GB2248964A (en) * 1990-10-17 1992-04-22 Philips Electronic Associated Plural-wavelength infrared detector devices

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004011548A1 (en) * 2004-03-08 2005-09-29 Giesecke & Devrient Gmbh Optical sensor, e.g. for chip card fingerprint sensor, comprises optical layer with optical elements consisting of material deposited directly onto semiconductor circuit layer
DE102004011548B4 (en) * 2004-03-08 2015-02-12 Giesecke & Devrient Gmbh Portable data carrier with optical sensor and suitable sensor and method of manufacture
US7160017B2 (en) 2004-06-03 2007-01-09 Eastman Kodak Company Brightness enhancement film using a linear arrangement of light concentrators
US7581867B2 (en) 2004-06-03 2009-09-01 Skc Haas Display Films Co., Ltd. Brightness enhancement film using an array of light concentrators
WO2009057075A2 (en) * 2007-11-01 2009-05-07 Insiava (Pty) Ltd Optoelectronic device with light directing arrangement and method of forming the arrangement
WO2009057075A3 (en) * 2007-11-01 2010-03-18 Insiava (Pty) Ltd Optoelectronic device with light directing arrangement and method of forming the arrangement
US8729582B2 (en) 2007-11-01 2014-05-20 Insiava (Pty) Limited Optoelectronic device with light directing arrangement and method of forming the arrangement
US8969112B2 (en) 2007-11-01 2015-03-03 Insiava (Pty) Limited Optoelectronic device with light directing arrangement and method of forming the arrangement

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Publication number Publication date
GB9810762D0 (en) 1998-07-15
JPH10335618A (en) 1998-12-18

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