GB2325357B - Test board mount/dismount apparatus - Google Patents

Test board mount/dismount apparatus

Info

Publication number
GB2325357B
GB2325357B GB9807480A GB9807480A GB2325357B GB 2325357 B GB2325357 B GB 2325357B GB 9807480 A GB9807480 A GB 9807480A GB 9807480 A GB9807480 A GB 9807480A GB 2325357 B GB2325357 B GB 2325357B
Authority
GB
United Kingdom
Prior art keywords
test board
board mount
dismount apparatus
dismount
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9807480A
Other versions
GB9807480D0 (en
GB2325357A (en
Inventor
Yoshinao Kamo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ando Electric Co Ltd
Original Assignee
Ando Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ando Electric Co Ltd filed Critical Ando Electric Co Ltd
Publication of GB9807480D0 publication Critical patent/GB9807480D0/en
Publication of GB2325357A publication Critical patent/GB2325357A/en
Application granted granted Critical
Publication of GB2325357B publication Critical patent/GB2325357B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
GB9807480A 1997-04-30 1998-04-07 Test board mount/dismount apparatus Expired - Fee Related GB2325357B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12789997A JP3324445B2 (en) 1997-04-30 1997-04-30 Test board attaching / detaching device

Publications (3)

Publication Number Publication Date
GB9807480D0 GB9807480D0 (en) 1998-06-10
GB2325357A GB2325357A (en) 1998-11-18
GB2325357B true GB2325357B (en) 2001-07-18

Family

ID=14971425

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9807480A Expired - Fee Related GB2325357B (en) 1997-04-30 1998-04-07 Test board mount/dismount apparatus

Country Status (5)

Country Link
JP (1) JP3324445B2 (en)
KR (1) KR100318955B1 (en)
GB (1) GB2325357B (en)
IE (1) IE980260A1 (en)
SG (1) SG65062A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100632032B1 (en) * 1999-07-14 2006-10-04 동부일렉트로닉스 주식회사 Dc test equipment with guide for separating probe card
JP4835939B2 (en) * 2006-05-25 2011-12-14 横河電機株式会社 IC tester and test board attaching / detaching method
KR100772152B1 (en) * 2006-11-22 2007-11-02 프롬써어티 주식회사 Device for docking test head and performance board unit of wafer tester
US20120280707A1 (en) * 2009-11-25 2012-11-08 Advantest Corporation Board mounting apparatus, test head, and electronic device test apparatus
CN102451820B (en) * 2010-10-15 2014-04-16 王立民 Selecting method of electronic product
KR101348423B1 (en) * 2013-10-08 2014-01-10 주식회사 아이티엔티 Ejector device for test board of automatic test equipment
TWI593469B (en) * 2014-05-22 2017-08-01 旺矽科技股份有限公司 Die marking method and die marking equipment
KR101883749B1 (en) 2017-08-16 2018-07-31 주식회사 포스코 Zig for measuring surface roughness of steel and measuring method using the same
JP7109630B2 (en) * 2019-11-07 2022-07-29 東京エレクトロン株式会社 Wafer inspection system

Also Published As

Publication number Publication date
KR100318955B1 (en) 2002-03-20
GB9807480D0 (en) 1998-06-10
SG65062A1 (en) 1999-05-25
GB2325357A (en) 1998-11-18
JPH10300816A (en) 1998-11-13
IE980260A1 (en) 1998-11-04
JP3324445B2 (en) 2002-09-17
KR19980081806A (en) 1998-11-25

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20030407