GB2294807B - Self-registered capacitor bottom plate local interconnect scheme for dram - Google Patents
Self-registered capacitor bottom plate local interconnect scheme for dramInfo
- Publication number
- GB2294807B GB2294807B GB9422069A GB9422069A GB2294807B GB 2294807 B GB2294807 B GB 2294807B GB 9422069 A GB9422069 A GB 9422069A GB 9422069 A GB9422069 A GB 9422069A GB 2294807 B GB2294807 B GB 2294807B
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- polysilicon
- capacitor electrode
- lower capacitor
- dram
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title abstract 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 8
- 229920005591 polysilicon Polymers 0.000 abstract 8
- 150000004767 nitrides Chemical class 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 210000003323 beak Anatomy 0.000 abstract 1
- 239000002019 doping agent Substances 0.000 abstract 1
- 239000007943 implant Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
Abstract
A method and structure for a lower capacitor electrode (67) for a dynamic random access integrated (DRAM) circuit (50). A polysilicon gate layer (64) is formed over a thin layer of oxide (63) in a first region of a semiconductor substrate (49). Another oxide layer (62) is then formed overlying the polysilicon gate layer (64). A polysilicon layer (121) which was doped by S/D implant and includes the lower capacitor electrode (131) self-aligns and forms overlying a second region of the semiconductor substrate (100) and over the oxide layer (108) on the polysilicon gate layer (110). A nitride layer (127) forms on the lower capacitor electrode (131) portion overlying the second region. Exposed portions (132) of the polysilicon layer (121) are then oxidized. The S/D (114, 116) was formed by driving dopant from implanted second layer polysilicon (121). Portions of polysilicon (121) under the nitride layer (127) corresponding to the lower capacitor electrode (131) oxidizes at a slower rate than the exposed portions (132) of the polysilicon (121) giving rise to a birds beak structure. Such sequence of steps forms a self-aligned lower capacitor electrode (67) for a DRAM (50). <IMAGE>
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9422069A GB2294807B (en) | 1994-11-02 | 1994-11-02 | Self-registered capacitor bottom plate local interconnect scheme for dram |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9422069A GB2294807B (en) | 1994-11-02 | 1994-11-02 | Self-registered capacitor bottom plate local interconnect scheme for dram |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9422069D0 GB9422069D0 (en) | 1994-12-21 |
GB2294807A GB2294807A (en) | 1996-05-08 |
GB2294807B true GB2294807B (en) | 1998-10-21 |
Family
ID=10763756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9422069A Expired - Fee Related GB2294807B (en) | 1994-11-02 | 1994-11-02 | Self-registered capacitor bottom plate local interconnect scheme for dram |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2294807B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0258657A1 (en) * | 1986-08-22 | 1988-03-09 | Siemens Aktiengesellschaft | Varactor-transistor device for dynamic semiconductor memory |
US5272103A (en) * | 1991-02-08 | 1993-12-21 | Mitsubishi Denki Kabushiki Kaisha | DRAM having a large dielectric breakdown voltage between an adjacent conductive layer and a capacitor electrode and method of manufacture thereof |
-
1994
- 1994-11-02 GB GB9422069A patent/GB2294807B/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0258657A1 (en) * | 1986-08-22 | 1988-03-09 | Siemens Aktiengesellschaft | Varactor-transistor device for dynamic semiconductor memory |
US5272103A (en) * | 1991-02-08 | 1993-12-21 | Mitsubishi Denki Kabushiki Kaisha | DRAM having a large dielectric breakdown voltage between an adjacent conductive layer and a capacitor electrode and method of manufacture thereof |
Also Published As
Publication number | Publication date |
---|---|
GB9422069D0 (en) | 1994-12-21 |
GB2294807A (en) | 1996-05-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20091102 |