GB2285868A - Apparatus and method for detecting alignment of contacts in a multi-substrate electronic assembly - Google Patents

Apparatus and method for detecting alignment of contacts in a multi-substrate electronic assembly

Info

Publication number
GB2285868A
GB2285868A GB9506239A GB9506239A GB2285868A GB 2285868 A GB2285868 A GB 2285868A GB 9506239 A GB9506239 A GB 9506239A GB 9506239 A GB9506239 A GB 9506239A GB 2285868 A GB2285868 A GB 2285868A
Authority
GB
United Kingdom
Prior art keywords
contacts
alignment
criterion
electronic assembly
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9506239A
Other versions
GB9506239D0 (en
Inventor
David A Vanyek
David Leon Bond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of GB9506239D0 publication Critical patent/GB9506239D0/en
Publication of GB2285868A publication Critical patent/GB2285868A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/68—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

An apparatus and method for detecting alignment of corresponding contacts (205 and 206) in a multi-substrate electronic assembly (107). In a preferred embodiment, a liquid crystal display (LCD) assembly (107) includes a display substrate (201) having first (205) and third (701) contacts and a printed circuit substrate (204) having second (206) and fourth (702) contacts. The first (205) and second (206) contacts are subject to alignment according to a first criterion. The third (701) and fourth (702) contacts are subject to alignment according to a second criterion more restrictive than the first criterion. A path (709) permits electrical coupling between the third (701) and fourth (702) contacts. A measure of the electrical coupling through the path (709) is indicative of alignment of the third (701) and fourth (702) contacts according to the second criterion, such that alignment of the third (701) and fourth (702) contacts according to the second criterion is indicative of alignment of the first (205) and second (206) contacts according to the first criterion. <IMAGE>
GB9506239A 1993-08-02 1994-06-20 Apparatus and method for detecting alignment of contacts in a multi-substrate electronic assembly Withdrawn GB2285868A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10084393A 1993-08-02 1993-08-02
PCT/US1994/007039 WO1995004286A1 (en) 1993-08-02 1994-06-20 Apparatus and method for detecting alignment of contacts in a multi-substrate electronic assembly

Publications (2)

Publication Number Publication Date
GB9506239D0 GB9506239D0 (en) 1995-05-31
GB2285868A true GB2285868A (en) 1995-07-26

Family

ID=22281829

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9506239A Withdrawn GB2285868A (en) 1993-08-02 1994-06-20 Apparatus and method for detecting alignment of contacts in a multi-substrate electronic assembly

Country Status (9)

Country Link
JP (1) JPH08502605A (en)
KR (1) KR950703739A (en)
CN (1) CN1112796A (en)
CA (1) CA2143760A1 (en)
DE (1) DE4495615T1 (en)
FR (1) FR2708822A1 (en)
GB (1) GB2285868A (en)
SG (1) SG47017A1 (en)
WO (1) WO1995004286A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2325085B (en) * 1997-05-09 2001-09-12 Motorola Gmbh Electrically coupled equipment and method of operation therefor
US8212575B2 (en) * 2008-12-29 2012-07-03 Lexmark International, Inc. Device for analyzing size and location of conductive item
US20110108312A1 (en) * 2009-11-12 2011-05-12 Novatel Inc. Shock damping system for a surface mounted vibration sensitive device
CN108401360B (en) * 2018-05-03 2019-07-05 京东方科技集团股份有限公司 The detection method of flexible circuit board, detection device and display panel

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507697A (en) * 1982-03-17 1985-03-26 Maurice Ozil Device for indicating the position of printed circuit cards relative to their connectors
US4566193A (en) * 1984-07-31 1986-01-28 Hewlett-Packard Company Use of an electronic vernier for evaluation of alignment in semiconductor processing
US4571538A (en) * 1983-04-25 1986-02-18 Rockwell International Corporation Mask alignment measurement structure for semiconductor fabrication
US4949035A (en) * 1989-01-06 1990-08-14 Digital Equipment Corporation Connector alignment verification and monitoring system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2548469A1 (en) * 1983-06-30 1985-01-04 Thomson Csf Device for connecting and aligning conductors arranged in ribbons
JPS60169834A (en) * 1984-02-15 1985-09-03 Hitachi Ltd Liquid-crystal display device
JPS60237431A (en) * 1984-05-10 1985-11-26 Optrex Corp Positioning method of display cell
JPS61123868A (en) * 1984-11-21 1986-06-11 キヤノン株式会社 Positioning securing method for panel substrate
US5386309A (en) * 1990-12-20 1995-01-31 Goldstar Co., Ltd. Liquid crystal display module with positioning marks on circuit substrate and heat seal
DE4105505A1 (en) * 1991-02-22 1992-09-03 Telefonbau & Normalzeit Gmbh Liquid crystal display device with large number of electrode connections - uses distance piece to separate compressable conducting blocks, enabling two rows of connections to be employed

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507697A (en) * 1982-03-17 1985-03-26 Maurice Ozil Device for indicating the position of printed circuit cards relative to their connectors
US4571538A (en) * 1983-04-25 1986-02-18 Rockwell International Corporation Mask alignment measurement structure for semiconductor fabrication
US4566193A (en) * 1984-07-31 1986-01-28 Hewlett-Packard Company Use of an electronic vernier for evaluation of alignment in semiconductor processing
US4949035A (en) * 1989-01-06 1990-08-14 Digital Equipment Corporation Connector alignment verification and monitoring system

Also Published As

Publication number Publication date
CA2143760A1 (en) 1995-02-09
DE4495615T1 (en) 1995-09-21
CN1112796A (en) 1995-11-29
GB9506239D0 (en) 1995-05-31
JPH08502605A (en) 1996-03-19
FR2708822A1 (en) 1995-02-10
WO1995004286A1 (en) 1995-02-09
KR950703739A (en) 1995-09-20
SG47017A1 (en) 1998-03-20

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)