GB2271306A - Tape automated bonding control system - Google Patents

Tape automated bonding control system Download PDF

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Publication number
GB2271306A
GB2271306A GB9221009A GB9221009A GB2271306A GB 2271306 A GB2271306 A GB 2271306A GB 9221009 A GB9221009 A GB 9221009A GB 9221009 A GB9221009 A GB 9221009A GB 2271306 A GB2271306 A GB 2271306A
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United Kingdom
Prior art keywords
stage
lead
gold
bonding
energy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9221009A
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GB2271306B (en
GB9221009D0 (en
Inventor
Farhad Farassat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
F&K Delvotec Bondtechnik GmbH
Newfrey LLC
Original Assignee
F&K Delvotec Bondtechnik GmbH
Newfrey LLC
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Publication date
Application filed by F&K Delvotec Bondtechnik GmbH, Newfrey LLC filed Critical F&K Delvotec Bondtechnik GmbH
Priority to GB9221009A priority Critical patent/GB2271306B/en
Publication of GB9221009D0 publication Critical patent/GB9221009D0/en
Publication of GB2271306A publication Critical patent/GB2271306A/en
Application granted granted Critical
Publication of GB2271306B publication Critical patent/GB2271306B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Abstract

A tape automated bonding process for attaching an integrated circuit to a printed circuit board comprises supplying energy to a bonding tool 8 arranged to press a lead 2 of the integrated circuit against the printed circuit board and monitoring the deformation of the lead. The level and duration of the supply of energy is continuously controlled during the bonding process in response to the deformation of the lead. The method is particularly appropriate for gold, gold-tin-copper or gold-tin-gold systems, and is carried out as a three stage process. <IMAGE>

Description

TAB PROCESS CONTROL SYSTEM The present invention relates to a method of controlling a tape-automated bonding process, and to the machine for carrying out that method. The method includes the monitoring, during the bonding process, of the quality of the bond.
Tape Automated Bonding (TAB) is a method for attaching integrated circuits to printed circuit boards, and is particularly indicated for fine pitch, high density applications. TAB is a surface mounting technique which uses a 35 mm tape film or similar, preprinted with the leads from the integrated circuits.
In comparison with the established technique of wire bonding, a much higher lead density can be attained using TAB techniques. More than 400 leads per device can be achieved, and it is generally considered that TAB provides an attractive solution where devices comprise more than 250 leads.
With these fine pitch, high density applications, conventional wire bonding processes include the problem of short circuiting of tightly packed connections. TAB also uses a flat lead design which provides a larger cross sectional area of conductor, to carry more current providing a shorter electrical trace, which is particularly important in high speed circuitry.
Leads processed photolithographically on to the film, extend flat from the integrated circuit and are not affected by other leads from the surrounding package. A support ring suitably formed from polyamide provides a quality connection and structural integrity is ensured.
In TAB production, the tape is supplied on a conventional film reel or similar and the dielectric is image patterned, followed by copper plating of the leads to provide straight walls, fine lines and thin spacings. The photo lithographic process is said to be cheaper on tooling costs than conventional packaging and custom metal and dielectric patterns can be created.
The chips, which are specially bumped for mounting, are positioned in the centre of the lead pattern and bonded.
Depending on manufacturing techniques, the tape can be respooled for automated device testing or cut into individual devices before being tested and mounted on the printed circuit board by pick and place.
The outer edges of each TAB interconnect incorporate test pads, allowing TAB devices to be tested before mounting on the printed circuit board. After testing, the pads are cut away and the TAB devices mounted.
Chip bumping involves the vacuum deposition of titanium, tungsten and gold, and builds up a profile at each lead out for easier contact with the TAB lead out and to provide a physical clearance for the leads to the chip.
It is important in a tape automated bonding apparatus to have as much control as possible over the process, and to be able to determine whether or not a bond has been successfully made, and it would be particularly advantageous to be able to ascertain this at the time of bonding rather than during a subsequent test routine.
Because of the very rapid throughput of a tape automated bonding apparatus, it would be advantageous if the bonding could be monitored immediately at the time of bonding, so that after the formation of an unsatisfactory bond the process can be stopped and the bonding conditions checked to prevent the production of a large number of unsatisfactory bonds, with the consequent wastage of time and expensive components and materials.
Most TAB machines currently in commercial use are only able to check whether a successful bond has been made after bonding is completed.
It is an object of the present invention to provide a method of controlling a tape automated bonding process in which the above disadvantages are reduced or substantially obviated.
The invention provides a method for carrying out a tape automated bonding process for attaching an integrated circuit to a printed circuit board, which process comprises supplying energy to a bonding tool arranged to press a lead of the integrated circuit against the printed circuit board and monitoring the deformation of the lead, characterised in that the level and duration of the supply of energy is continuously controlled during the bonding process in response to the deformation of the lead.
It has now been appreciated that the bonding process is not, as has previously been assumed, a single stage process, but is in fact a three-stage process, each of which stages is advantageously carried out with the level of energy being supplied at that stage being specifically determined for that stage. In particular, it has been determined that where the bonding process is a eutectic process, the process comprises a first stage, in which the surfaces of the lead and the substrate to which it is to be bonded are cleaned; a second stage in which both cleaning and bonding between the lead and the substrate takes place, and, a third stage during which bonding is completed.
Where the process is a reflow process, the bonding process comprises a first stage in which tempering takes place, a second stage in which reflow soldering takes place, and a third stage in which the bond area cools.
It has further been observed that each of these stages is advantageously carried out at a different energy level which can be empirically determined and controlled during the bonding process. It is in general found that the first, or cleaning, stage requires a relatively high energy level and takes place relatively rapidly; the second, or welding, stage requires a lower energy level and the third, tempering stage, where this occurs, requires an energy level which varies depending on the particular bond.
While it is generally found that the energy levels required change as stated above, this is not necessarily the case and it is a particular advantage of the process according to the present invention that the bonding conditions are determined for each individual bond and optimised for that bond.
Even successive bonds formed using the same lead and the same substrate may differ widely in their energy requirements, and by constantly monitoring the bonding process according to the invention, bonds of a consistent high quality can be achieved with high efficiency, independent of any variations in the bonding conditions.
The particular form or forms in which the bonding energy is supplied, and the apparatus by which it is supplied, can be selected depending on the requirements of the particular TAB process.
The lead may be copper, with gold or tin plating, and the bump may be pure gold or gold with tin plating.
Where the bump and lead systems are Gold-Tin-Copper or gold-tin-gold, then the bonding process is effectively a reflow soldering process, with only thermal energy and mechanical force.
In the case where both the bump and lead are gold, then the bonding process is effectively a eutectic process, with both thermal and ultrasonic energy being supplied in addition to mechanical force.
The bonding process may be followed by cooling of the bond area.
Because of the different lead lengths and position of the bumps on the chip, the energy requirements for each bond are different. By monitoring the deformation of the lead, the energy supply can be controlled to optimise the bond quality.
The system according to the invention is thus an in-line closed loop system. An embodiment of the process according to the invention and an embodiment of Tape Automated automatic bonding apparatus suitable for carrying out such a process will now be described with reference to the accompanying drawings of which; Figure 1 is a schematic view of the TAB system; Figure 2 is a block diagram of the apparatus for the eutectic system; Figure 3 is a graph of lead deformation against time in a eutectic process; and Figure 4 is a graph of lead deformation against time in a reflow process.
As is shown in Figure 1, a lead 2 is located on a bump 4 on the surface of a chip 6, and energy and mechanical force are supplied via a tool 8.
Figure 2 is a block diagram of the apparatus for carrying out the method of the invention.
The apparatus shown is particularly suitable for carrying out a eutectic process in which both thermal and ultrasonic energy are supplied to the bond in addition to mechanical force.
The automatic TAB machine comprises a bonding tool 8 which is attached to the horn 20 of an ultrasonic vibration transducer 22. A lead 2 is positioned for bonding to the bump 4 on the surface of a chip 6. A deformation sensor 24 is connected in a closed loop system to a deformation measuring system 26 which is connected via a processor 28 to a regulator 30 which is itself connected to an ultrasonic power generator 32 which drives the transducer 22. The deformation sensor 24 is mounted directly above the bonding tool 8, and measures the downward motion of the tool.
The bonding tool 8 is also attached to a heater 40, preferably a pulse heater or a laser, which is driven by a heater control 42 connected to the regulator 30.
In operation, data from the deformation sensor 24 is fed via the deformation measuring system 26 to the processor 28 where the process is continually monitored and the required level of energy calculated. Data on the calculated level is then used to control the ultrasonic generator 32 and heater control 42 by means of the regulator 30.
The deformation sensor 24 and deformation measuring system 26 may be any suitable deformation system such as an electronic system or an optical system, for example a laser system.
Figure 3 is a graph of lead deformation against time in a eutectic process. As can be seen from the graph, there are three different zones corresponding to three different stages of the bonding process. In the graph, the dotted line P represents the graph of power against time; the line T represents the change in temperature with time and d represents the deformation of the wire against time.
Zone 1 corresponds to the cleaning stage. Zone 2 corresponds to a mixed stage, in which both cleaning and some welding is taking place. Zone 3 is the true welding stage; after the correct time, as determined by the deformation of the lead, bonding is complete.
As can be seen from Figure 4, the reflow process also proceeds as a three stage process. The curves d, T and P have the same significance as in Figure 3. The initial stage is a tempering phase and is followed by a reflow phase at a higher temperature. When maximum defined deformation is reached, the reflow phase is complete, and a third cooling phase occurs. After the cooling phase, bonding is complete and bond quality is ensured.
Bonding of TAB systems is generally carried out point-to-point, for both the eutectic method and the reflow soldering method. The point-to-point method is particularly indicated for eutectic bonding, and for fine pitch lead arrangements.
However, reflow soldering can also be carried out using gang bonding, where a number of leads are bonded simultaneously. Where gang bonding is used, it is preferable to provide four separate deformation sensors, one at each edge of the bonding tool, to ensure that all edges have the same deformation.

Claims (7)

CLAIMS:
1. A method for carrying out a tape automated bonding process for attaching an integrated circuit to a printed circuit board, which process comprises supplying energy to a bonding tool arranged to press a lead of the integrated circuit against the printed circuit board and monitoring the deformation of the lead, characterised in that the level and duration of the supply of energy is continuously controlled during the bonding process in response to the deformation of the lead.
2. A method according to claim 1 in which the bump and lead systems are gold-tin-copper or gold-tin-gold systems, and the method is carried out as a three-stage process in which the first stage comprises tempering, the second stage comprises reflow and the third stage comprises a cooling stage.
3. A method according to claim 1 in which the bump and lead systems are gold, and the method is carried out as a three-stage process in which the first stage comprises a cleaning stage, the second stage comprises a mixed stage including both cleaning and welding and the third stage comprises the welding stage.
4. A method as claimed in any of claims 1 to 3 in which energy is supplied by means of a laser.
5. A method as claimed in any of claims 1 to 3 in which energy is supplied by means of a thermode from an impulse heater.
6. A method as claimed in any of claims 3 to 5 in which ultrasonic energy is additionally supplied.
7. A method substantially as herein described with reference to the accompanying drawings.
GB9221009A 1992-10-06 1992-10-06 Tab process control system Expired - Fee Related GB2271306B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9221009A GB2271306B (en) 1992-10-06 1992-10-06 Tab process control system

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Application Number Priority Date Filing Date Title
GB9221009A GB2271306B (en) 1992-10-06 1992-10-06 Tab process control system

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GB9221009D0 GB9221009D0 (en) 1992-11-18
GB2271306A true GB2271306A (en) 1994-04-13
GB2271306B GB2271306B (en) 1995-06-07

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0761371A1 (en) * 1995-08-22 1997-03-12 Ultex Corporation Ultrasonic vibration bonding machine
US8020746B2 (en) 2006-09-05 2011-09-20 Technische Universitaet Berlin Method and device for controlling the generation of ultrasonic wire bonds

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0761371A1 (en) * 1995-08-22 1997-03-12 Ultex Corporation Ultrasonic vibration bonding machine
US5730832A (en) * 1995-08-22 1998-03-24 Ultex Corporation Ultrasonic vibration bonding machine
US8020746B2 (en) 2006-09-05 2011-09-20 Technische Universitaet Berlin Method and device for controlling the generation of ultrasonic wire bonds

Also Published As

Publication number Publication date
GB2271306B (en) 1995-06-07
GB9221009D0 (en) 1992-11-18

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Effective date: 20041006