GB2262736B - Electronic component packaging means,and supply mechanism for and method of supplying electronic components by using the electronic component packaging means - Google Patents

Electronic component packaging means,and supply mechanism for and method of supplying electronic components by using the electronic component packaging means

Info

Publication number
GB2262736B
GB2262736B GB9226271A GB9226271A GB2262736B GB 2262736 B GB2262736 B GB 2262736B GB 9226271 A GB9226271 A GB 9226271A GB 9226271 A GB9226271 A GB 9226271A GB 2262736 B GB2262736 B GB 2262736B
Authority
GB
United Kingdom
Prior art keywords
electronic component
packaging means
component packaging
supply mechanism
supplying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9226271A
Other languages
English (en)
Other versions
GB9226271D0 (en
GB2262736A (en
Inventor
Tetsuo Takahashi
Shinichi Araya
Kuniaki Takahashi
Kunio Mogi
Koji Kudo
Takeshi Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1991110793U external-priority patent/JPH0751834Y2/ja
Priority claimed from JP4126812A external-priority patent/JPH07112116B2/ja
Application filed by TDK Corp filed Critical TDK Corp
Publication of GB9226271D0 publication Critical patent/GB9226271D0/en
Publication of GB2262736A publication Critical patent/GB2262736A/en
Application granted granted Critical
Publication of GB2262736B publication Critical patent/GB2262736B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
GB9226271A 1991-12-18 1992-12-17 Electronic component packaging means,and supply mechanism for and method of supplying electronic components by using the electronic component packaging means Expired - Fee Related GB2262736B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1991110793U JPH0751834Y2 (ja) 1991-12-18 1991-12-18 電子部品の自動供給装置
JP4126812A JPH07112116B2 (ja) 1992-04-20 1992-04-20 電子部品の自動供給装置

Publications (3)

Publication Number Publication Date
GB9226271D0 GB9226271D0 (en) 1993-02-10
GB2262736A GB2262736A (en) 1993-06-30
GB2262736B true GB2262736B (en) 1995-06-21

Family

ID=26450324

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9226271A Expired - Fee Related GB2262736B (en) 1991-12-18 1992-12-17 Electronic component packaging means,and supply mechanism for and method of supplying electronic components by using the electronic component packaging means

Country Status (4)

Country Link
DE (1) DE4243083A1 (enrdf_load_stackoverflow)
FR (1) FR2691441B1 (enrdf_load_stackoverflow)
GB (1) GB2262736B (enrdf_load_stackoverflow)
TW (1) TW240369B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3081400B2 (ja) * 1993-01-18 2000-08-28 三洋電機株式会社 電子部品自動装着装置
AT13042U1 (de) * 2011-11-08 2013-05-15 Gassner Gmbh Vorrichtung und verfahren zur behandlung und zuführung von behälterverschlüssen
DE102019112258A1 (de) * 2019-05-10 2020-11-12 Homag Gmbh Verpackung zum Verpacken von Verbrauchsmaterial und Verfahren zum Zuführen von Verbrauchsmaterial

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2223482A (en) * 1988-09-02 1990-04-11 Tdk Corp Chip packaging means

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4033031A (en) * 1976-04-22 1977-07-05 Augat, Inc. Method and machine for inserting electrical contacts into electrical interconnection boards
IT1210763B (it) * 1986-05-27 1989-09-20 Nitto Kogyo Kk Apparecchiature per la separazione e l allineamento di chip
JPH0620910B2 (ja) * 1987-04-20 1994-03-23 株式会社村田製作所 電子部品チツプ収納カセツト

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2223482A (en) * 1988-09-02 1990-04-11 Tdk Corp Chip packaging means

Also Published As

Publication number Publication date
GB9226271D0 (en) 1993-02-10
FR2691441B1 (fr) 1995-06-09
DE4243083A1 (enrdf_load_stackoverflow) 1993-07-01
GB2262736A (en) 1993-06-30
TW240369B (enrdf_load_stackoverflow) 1995-02-11
FR2691441A1 (fr) 1993-11-26

Similar Documents

Publication Publication Date Title
GB9300320D0 (en) Component supply method
ZA929725B (en) Method and apparatus for controlling the cutting and placement of components on an moving substrate, and article made therewith.
GB2261779B (en) Power supply apparatus
GB2259199B (en) Power supply control apparatus
EP0588569A3 (en) Power supply for electronic device, and electronic device system
HU9302411D0 (en) Method for coating end-substratum
EP0539982A3 (en) Power supply apparatus for a vehicle
GR3022677T3 (en) Process for stabilizing paint.
EP0476219A3 (en) Apparatus for transporting substrates
PH30632A (en) Parts feeding apparatus for selectively feeding parts of different types
TW348933U (en) Chip component supply equipment
US5336453B1 (en) Method for producing ceramic-based electronic components
GB9223606D0 (en) Gas supply apparatus
EP0587916A4 (en) Parts supply method and apparatus
GB2223482B (en) Chip packaging means and supply mechanism for supplying chips by using the chip packaging means
TW305362U (en) The conveying apparatus for printed circuit-board
GB2274114B (en) Electrode forming apparatus for chip components
EP0408919A3 (en) Apparatus for supplying powder
GB2262736B (en) Electronic component packaging means,and supply mechanism for and method of supplying electronic components by using the electronic component packaging means
GB2261144B (en) Apparatus for generating graphics
EP0506178A3 (en) Power supply apparatus
AU2051792A (en) Parts feeding apparatus
SG165494G (en) Apparatus for transporting substrates
HU9302146D0 (en) Method for separing two solid components
EP0533174A3 (en) Feeding apparatus for feeding articles

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20051217