GB2248725B - Wiring member - Google Patents

Wiring member

Info

Publication number
GB2248725B
GB2248725B GB9121743A GB9121743A GB2248725B GB 2248725 B GB2248725 B GB 2248725B GB 9121743 A GB9121743 A GB 9121743A GB 9121743 A GB9121743 A GB 9121743A GB 2248725 B GB2248725 B GB 2248725B
Authority
GB
United Kingdom
Prior art keywords
wiring member
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9121743A
Other versions
GB2248725A (en
GB9121743D0 (en
Inventor
Hiroji Kitagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Publication of GB9121743D0 publication Critical patent/GB9121743D0/en
Publication of GB2248725A publication Critical patent/GB2248725A/en
Application granted granted Critical
Publication of GB2248725B publication Critical patent/GB2248725B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Inorganic Fibers (AREA)
  • Laminated Bodies (AREA)
GB9121743A 1990-10-12 1991-10-14 Wiring member Expired - Fee Related GB2248725B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2274648A JP2708623B2 (en) 1990-10-12 1990-10-12 Wiring material

Publications (3)

Publication Number Publication Date
GB9121743D0 GB9121743D0 (en) 1991-11-27
GB2248725A GB2248725A (en) 1992-04-15
GB2248725B true GB2248725B (en) 1994-08-24

Family

ID=17544632

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9121743A Expired - Fee Related GB2248725B (en) 1990-10-12 1991-10-14 Wiring member

Country Status (3)

Country Link
JP (1) JP2708623B2 (en)
DE (1) DE4133835A1 (en)
GB (1) GB2248725B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105451438A (en) * 2015-11-19 2016-03-30 业成光电（深圳）有限公司 Embedded metal line structure and manufacturing method

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3118103B2 (en) * 1992-12-21 2000-12-18 矢崎総業株式会社 Conductive member for electric circuit, electric circuit body and method of manufacturing the same
US6869664B2 (en) * 2000-12-12 2005-03-22 Thermalworks, Inc. Lightweight circuit board with conductive constraining cores
CN100540765C (en) 2003-09-16 2009-09-16 昭和电工株式会社 Composite of gas-phase growth of carbon fibre and fine inorganic particle and uses thereof
US7301105B2 (en) 2004-08-27 2007-11-27 Stablcor, Inc. Printed wiring boards possessing regions with different coefficients of thermal expansion
USRE45637E1 (en) 2005-08-29 2015-07-28 Stablcor Technology, Inc. Processes for manufacturing printed wiring boards
US7730613B2 (en) 2005-08-29 2010-06-08 Stablcor, Inc. Processes for manufacturing printed wiring boards
CN101507058B (en) 2006-07-14 2013-05-01 斯塔布科尔技术公司 Build-up printed wiring board substrate having a core layer that is part of a circuit
US9332632B2 (en) 2014-08-20 2016-05-03 Stablcor Technology, Inc. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards
DE102015005931B4 (en) * 2015-05-07 2023-06-15 Oechsler Aktiengesellschaft circuit arrangement

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243006A (en) * 1985-08-19 1987-02-25 昭和電工株式会社 Making of conducting high polymer material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NONE *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105451438A (en) * 2015-11-19 2016-03-30 业成光电（深圳）有限公司 Embedded metal line structure and manufacturing method

Also Published As

Publication number Publication date
JP2708623B2 (en) 1998-02-04
JPH04150089A (en) 1992-05-22
DE4133835A1 (en) 1992-04-16
GB2248725A (en) 1992-04-15
GB9121743D0 (en) 1991-11-27

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20041014