GB2244601B - Electrical circuit board assemblies - Google Patents

Electrical circuit board assemblies

Info

Publication number
GB2244601B
GB2244601B GB9105072A GB9105072A GB2244601B GB 2244601 B GB2244601 B GB 2244601B GB 9105072 A GB9105072 A GB 9105072A GB 9105072 A GB9105072 A GB 9105072A GB 2244601 B GB2244601 B GB 2244601B
Authority
GB
United Kingdom
Prior art keywords
circuit board
electrical circuit
board assemblies
assemblies
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9105072A
Other versions
GB2244601A (en
GB9105072D0 (en
Inventor
Geoffrey Arnold Trussler
Alastair Billing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smiths Group PLC
Original Assignee
Smiths Group PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smiths Group PLC filed Critical Smiths Group PLC
Publication of GB9105072D0 publication Critical patent/GB9105072D0/en
Publication of GB2244601A publication Critical patent/GB2244601A/en
Application granted granted Critical
Publication of GB2244601B publication Critical patent/GB2244601B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB9105072A 1990-03-14 1991-03-11 Electrical circuit board assemblies Expired - Fee Related GB2244601B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB909005742A GB9005742D0 (en) 1990-03-14 1990-03-14 Electrical circuit board assemblies

Publications (3)

Publication Number Publication Date
GB9105072D0 GB9105072D0 (en) 1991-04-24
GB2244601A GB2244601A (en) 1991-12-04
GB2244601B true GB2244601B (en) 1993-10-06

Family

ID=10672612

Family Applications (2)

Application Number Title Priority Date Filing Date
GB909005742A Pending GB9005742D0 (en) 1990-03-14 1990-03-14 Electrical circuit board assemblies
GB9105072A Expired - Fee Related GB2244601B (en) 1990-03-14 1991-03-11 Electrical circuit board assemblies

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB909005742A Pending GB9005742D0 (en) 1990-03-14 1990-03-14 Electrical circuit board assemblies

Country Status (1)

Country Link
GB (2) GB9005742D0 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108112208A (en) * 2016-11-25 2018-06-01 菏泽学院 A kind of connecting structure of electronic circuit board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007043886A1 (en) * 2007-09-14 2009-04-09 Continental Automotive Gmbh Electrical device for use in high-vibration environments and attenuator
DE102013208984B4 (en) * 2013-05-15 2022-06-30 Zf Friedrichshafen Ag control unit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1302558A (en) * 1968-12-30 1973-01-10
US4546410A (en) * 1983-10-31 1985-10-08 Kaufman Lance R Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink
US4546411A (en) * 1983-10-31 1985-10-08 Kaufman Lance R Mounting of a compact circuit package to a heat sink or the like

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1302558A (en) * 1968-12-30 1973-01-10
US4546410A (en) * 1983-10-31 1985-10-08 Kaufman Lance R Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink
US4546411A (en) * 1983-10-31 1985-10-08 Kaufman Lance R Mounting of a compact circuit package to a heat sink or the like

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108112208A (en) * 2016-11-25 2018-06-01 菏泽学院 A kind of connecting structure of electronic circuit board
CN108112208B (en) * 2016-11-25 2020-06-16 菏泽学院 Connection structure of electronic circuit board

Also Published As

Publication number Publication date
GB9005742D0 (en) 1990-05-09
GB2244601A (en) 1991-12-04
GB9105072D0 (en) 1991-04-24

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19990311