GB2234461B - Desoldering method and apparatus for integrated circuits - Google Patents

Desoldering method and apparatus for integrated circuits

Info

Publication number
GB2234461B
GB2234461B GB8915757A GB8915757A GB2234461B GB 2234461 B GB2234461 B GB 2234461B GB 8915757 A GB8915757 A GB 8915757A GB 8915757 A GB8915757 A GB 8915757A GB 2234461 B GB2234461 B GB 2234461B
Authority
GB
United Kingdom
Prior art keywords
integrated circuits
desoldering method
desoldering
circuits
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8915757A
Other versions
GB2234461A (en
GB8915757D0 (en
Inventor
Rodney John Browning
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AUTOMATED INTEGRATED DIAGNOSIS
AUTOMATED INTERGRATED DIAGNOSI
Original Assignee
AUTOMATED INTEGRATED DIAGNOSIS
AUTOMATED INTERGRATED DIAGNOSI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AUTOMATED INTEGRATED DIAGNOSIS, AUTOMATED INTERGRATED DIAGNOSI filed Critical AUTOMATED INTEGRATED DIAGNOSIS
Priority to GB8915757A priority Critical patent/GB2234461B/en
Publication of GB8915757D0 publication Critical patent/GB8915757D0/en
Publication of GB2234461A publication Critical patent/GB2234461A/en
Application granted granted Critical
Publication of GB2234461B publication Critical patent/GB2234461B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB8915757A 1989-07-10 1989-07-10 Desoldering method and apparatus for integrated circuits Expired - Fee Related GB2234461B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8915757A GB2234461B (en) 1989-07-10 1989-07-10 Desoldering method and apparatus for integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8915757A GB2234461B (en) 1989-07-10 1989-07-10 Desoldering method and apparatus for integrated circuits

Publications (3)

Publication Number Publication Date
GB8915757D0 GB8915757D0 (en) 1989-08-31
GB2234461A GB2234461A (en) 1991-02-06
GB2234461B true GB2234461B (en) 1993-11-10

Family

ID=10659800

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8915757A Expired - Fee Related GB2234461B (en) 1989-07-10 1989-07-10 Desoldering method and apparatus for integrated circuits

Country Status (1)

Country Link
GB (1) GB2234461B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2714520B2 (en) * 1992-08-28 1998-02-16 株式会社日立製作所 Mounting component mounting / dismounting device
US6201930B1 (en) * 1999-02-22 2001-03-13 Metcal, Inc. Chip removal and replacement system
DE102009000256A1 (en) * 2009-01-15 2010-07-22 Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG Solder vapor suction device for a microscope

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2154921A (en) * 1984-02-24 1985-09-18 Pace Inc Device for attaching modular electronic components to or removing them from an insulative substrate
GB2178354A (en) * 1985-06-07 1987-02-11 Pace Inc Soldering heater

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2154921A (en) * 1984-02-24 1985-09-18 Pace Inc Device for attaching modular electronic components to or removing them from an insulative substrate
GB2178354A (en) * 1985-06-07 1987-02-11 Pace Inc Soldering heater

Also Published As

Publication number Publication date
GB2234461A (en) 1991-02-06
GB8915757D0 (en) 1989-08-31

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19960710