GB2230220A - Method of embedding metal piles and metal pile material - Google Patents
Method of embedding metal piles and metal pile material Download PDFInfo
- Publication number
- GB2230220A GB2230220A GB8903477A GB8903477A GB2230220A GB 2230220 A GB2230220 A GB 2230220A GB 8903477 A GB8903477 A GB 8903477A GB 8903477 A GB8903477 A GB 8903477A GB 2230220 A GB2230220 A GB 2230220A
- Authority
- GB
- United Kingdom
- Prior art keywords
- piles
- metal
- base member
- adhesive
- embedding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Brushes (AREA)
- Wire Processing (AREA)
Description
1 METHOD OF EMBEDDING METAL PILES AND METAL PILE MATERIAL
Background of the Invention
Field of the Invention
This invention relates to a method of embedding metal piles to be secured to a base member.
Prior Art
A commonly termed electrostatic embedding process is well known, which comprises the steps of coating an adhesive on the surface of a base member, e.g., a knit fiber sheet, a plastic sheet or a rubber sheet and spraying pile pieces of nylon, rayon, cotton, etc. over the adhesive surface while applying a voltage between flat electrodes, between which the base member with the adhesive coating is disposed, thereby obtaining perpendicular embedding of the pile pieces in the adhesive coating with electrostatic forces of attraction provided by an electrostatic field set up by the applied voltage.
Further, Japanese Patent Laid-Open No. 60-214,940 discloses a technique of embedding metal piles over a base member surface.
In this disclosed technique, an adhesive is coated on the base member surface, and metal pile pieces having been chemically treated with a siliceous solution is sprayed over the adhesive coating surface 2 for vertically embedding these metal pile pieces in an electrostatic field set up by an applied voltage. In this technique, usually an adhesive is used solely for embedding. Therefore, fall-out of the embedded metal pile pieces is readily liable to result.
In addition, the adhesive coating layer which is formed between the base member surface and embedded metal pile pieces deteriorates the thermal and electri conductivities. Summary of the Invention
The present invention has been intended in order to overcome the above drawbacks, and its object is to provide a method of embedding metal piles, which permits obtaining tenacious embedding and excellent thermal and electric conductivities.
According to the invention, there is provided a method of embedding metal piles comprising the steps of coating an adhesive on a base member and electrically embedding said metal piles in the coated adhesive, wherein a solder is incorporated in a powdery or granular form in the adhetive to be thermally fused so as to secure the embedded metal piles to the base member.
More particularly, the adhesive preliminarily incorporated with the solder in the powdery or granular form is coated on the base member having been cleaned.
3 Then, the metal pile pieces are spread evenly over the adhesive coating by using a sieve while applying a high voltage between flat electrodes on the upper and lower sides of the base member with the adhesive coating from a high voltage generator.
In consequence, the metal pile pieces are perpendicularly embedded in the adhesive coating on the top surface of the base member.
Subsequently, the system is heated to a high temperature in a heating furnace, whereby the solder in the adhesive, having a low melting point compared to the base member 1 and metal pile pieces, is fused while the adhesive is burnt away so that the metal pile pieces are secured by the solder to the base member, Brief Description of the Drawings
Fig. 1 is a view schematically illustrating the process of the embedding method according to the invention; and Fig. 2 is a sectional view, to an enlarged scale, showing metal pile pieces soldered to a base member. Detailed Description of the Preferred Embodiment
Now, a preferred embodiment of the embedding method according to the invention will be described in detail with reference to the accompanying drawings. a. Embedding process 4 An adhesive 2 incorporating a solder 3 in the powdery or granular form is coated on a base member 1 having been cleaned, and metal pile pieces 4 sprayed evenly over the adhesive coating 2 while applying a high voltage between flat electrodes 7 and 8, thus electrically embedding the metal pile pieces 4 in the adhesive coating 2 on the base member 1.
The base member 1 is made of a material selected from iron, aluminum, copper and alloys of these metals depending on the purpose or use of the product, and the cleaning is done in the same manner as the ordinary surface treatment process such as fat removal or rust removal.
As the adhesive 2 may be used a paste-like resin adhesive usually used for plant fiber embedding processes, e.g., vinyl, ethylene acryl resins.
The powdery or granular solder 3 incorporated in the adhesive 2 is made of a member of a group consisting of iron, aluminum, copper and alloys of these metals and has a melting point lower than those of the base member 1 and metal piles 4.
The metal piles 4 to be embedded are obtained by cutting a very thin wire of iron, aluminum, copper or alloys of these metals into pieces and are subjected to a chemical treatment for fat removal, rust removal and also for imparting them with satisfactory disper- 1 sion property.
The metal piles 4 are dispersed evenly using a -sieve 5 as shown in Fig. 1.
Further, the high voltage is applied between the upper and lower flat electrodes 7 and 8 from a high voltage generator 6. b. Fusing process After the metal piles 4 have been electrically embedded in the adhesive 2 coated on the base member 1, the resultant system is heated in a heating furnace 9.
As a result, only the powdery or granular solder 3 in the adhesive 2 and having a low melting point is fused to solder the metal piles 4 to the base member 1.
The temperature and time of heating in the heating furnace 9 are set suitably such that the solder 3 can be fused while at the same time the adhesive 2 is burnt away. c. Finishing process After the metal plies 4 have been soldered via the solder 3 to the base member 1, defectively soldered metal piles 4 are removed using a brushing machine 10.
The base member 1, powdery or granular solder 3 and metal piles 4 described above in connection 6 with the above embodiment of the invention are by no means limitative. However, it is preferred to utilize iron or aluminum for the base member 1 and metal piles 4 while utilizing powdery or granular copper, which is a good electric conductor and has excellent thermal conductivity, for the solder 3.
As has been described in the foregoing, the method of embedding metal piles according to the invention permits soldering of the metal piles 4 via the solder 3 to the base member 1, so that it is possible to obtain a metal-pile-embedded sheet or the like, which is very tenacious and has high thermal and electric conductivities compared to prior art products using resin adhesives.
The metal-pile-embedded sheet according to the invention may be utilized for various electronic apparatuses, heat radiators and other apparatuses.
Further, according to the invention only labor and equipment comparable to those in the case of the prior art method of embedding nylon piles or the like are necessary, so that there is no problem at all in the operation efficiency and equipment cost. The invention thus is highly beneficial in practice.
1
Claims (1)
1. A method of embedding metal piles comprising the steps of coating an adhesive on a base member and electrically embedding said metal piles in said coated adhesive, a solder being incorporated in a powdery or granular form in said adhesive to be thermally fused so as to secure said embedded metal piles to said base member.
2. A method according to claim 1 wherein th-e base member is first cleaned.
3. A method according to either of clailns 1 and 2 wherein the metal pkles are spread over the adhesive coating -using a sieve w11Ple applying a Flighvoltage between electrodes potitioned above and below the basemember carrying tFle adhes:ve coating.
4. A method according to any,one of the preceding claims wherein th.e base-member carry.ing the adh.esive coating on wficFi the metal piles have been spread is heated to a temperature sufficient to fus.e the solder but not the base member or-metal piles and to burn away the adhesitve so that the-metal piles are secured to the base-memUer Uy. the solder, 5. A method accordimg to any.one of the preced- 1C9 ing claims wherein or iron, aluminium 8. A ing claims wherein the base member is made of a material selected from-- iron., aluminium, copper and alloys of these metals.
6. A meth6d according to any one of the preceding claims wherein the adhesive is based on vinyl, ethylene, or acrylic resins.
7. A method according to any one of the precedthe piles consist of short pieces copper or alloys of these metals. method according to any one of the preceding claims wherein the solder is-selected from iron, aluminium, copper and-alloys of these metals and has a melting point lower than the base member and the metal piles.
9. A method according to anyone of the preceding claims wherein defectively-soldered mjetal-piles are removed by brushing.
10. A method of embedding metal piles substantially as hereinbefore descrflied with-reference to the accompanying drawing.
11. A product comprising embedded material piles made by-a method according to any one of the preceding claims.
AWM-hed M0 atThe Patent Met. State Mo^68 71 Eolborn.london WC1R 4TP. eroopits be obtained trom The Patent orrice. Branch. & Mary Cray. Orpington., Zent MUS 5RD. Printed by UWUplax tochwq 1UL Ot Mary OM. Xent. Con. 1457
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21380587A JPH0624793B2 (en) | 1987-08-27 | 1987-08-27 | Metal pile flocking method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8903477D0 GB8903477D0 (en) | 1989-04-05 |
| GB2230220A true GB2230220A (en) | 1990-10-17 |
| GB2230220B GB2230220B (en) | 1993-01-27 |
Family
ID=16645335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8903477A Expired - Fee Related GB2230220B (en) | 1987-08-27 | 1989-02-15 | Method of embedding metal piles and metal pile material |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH0624793B2 (en) |
| DE (1) | DE3904743A1 (en) |
| FR (1) | FR2643299B1 (en) |
| GB (1) | GB2230220B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998008643A1 (en) * | 1996-08-26 | 1998-03-05 | Peerless Of America Incorporated | Brazing and preparing articles for brazing |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4231338A1 (en) * | 1992-09-18 | 1994-03-24 | Emitec Emissionstechnologie | Method for soldering a metallic structure, in particular partial areas of a honeycomb body |
| DE4413867A1 (en) * | 1994-04-21 | 1995-10-26 | Paul Grote | Process for the production of a recuperative spiral heat exchanger |
| EP0858853B1 (en) * | 1996-07-29 | 2002-03-06 | Matsushita Electric Industrial Co., Ltd. | method for manufacturing a metallic porous body |
| CN111644808B (en) * | 2020-05-14 | 2021-06-08 | 杭州科晟能源技术有限公司 | Process and device for manufacturing corrosion-resistant pipe fitting of superheater |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3580783A (en) * | 1968-01-04 | 1971-05-25 | Fort Wayne Metals Inc | Method of producing multitudinous straight cut-to-length filaments in oriented form |
-
1987
- 1987-08-27 JP JP21380587A patent/JPH0624793B2/en not_active Expired - Lifetime
-
1989
- 1989-02-15 GB GB8903477A patent/GB2230220B/en not_active Expired - Fee Related
- 1989-02-16 DE DE19893904743 patent/DE3904743A1/en not_active Withdrawn
- 1989-02-22 FR FR8902280A patent/FR2643299B1/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998008643A1 (en) * | 1996-08-26 | 1998-03-05 | Peerless Of America Incorporated | Brazing and preparing articles for brazing |
| US5772104A (en) * | 1996-08-26 | 1998-06-30 | Peerless Of America Incorporated | Methods of brazing and preparing articles for brazing, and coating composition for use in such methods |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2643299B1 (en) | 1992-11-20 |
| FR2643299A1 (en) | 1990-08-24 |
| GB2230220B (en) | 1993-01-27 |
| GB8903477D0 (en) | 1989-04-05 |
| JPH0624793B2 (en) | 1994-04-06 |
| JPS6455227A (en) | 1989-03-02 |
| DE3904743A1 (en) | 1990-08-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19950215 |