GB2225099A - Boiling cooler - Google Patents
Boiling cooler Download PDFInfo
- Publication number
- GB2225099A GB2225099A GB8923697A GB8923697A GB2225099A GB 2225099 A GB2225099 A GB 2225099A GB 8923697 A GB8923697 A GB 8923697A GB 8923697 A GB8923697 A GB 8923697A GB 2225099 A GB2225099 A GB 2225099A
- Authority
- GB
- United Kingdom
- Prior art keywords
- medium
- evaporator
- liquid
- condenser
- boiling cooler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
- F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
- Engine Equipment That Uses Special Cycles (AREA)
Abstract
A boiling cooler comprises an evaporator (1) in which a liquid working medium (5) is vaporised by the heat of a cooled object (6), a vapor conveyance section (2) for conveying the medium vaporized in the evaporator to a condenser (3) in which the vaporized medium is liquefied by being cooled, and a liquid conveyance means (11) through which the liquefied medium is conveyed from the condenser (3) to the evaporator (1). The liquid conveyancing means 11 passes through the object 6 such that heat therefrom causes boiling in the medium in the conveyancing means to form a bubble pump. Alternatively a heating means may surround the conveyancing means to produce the boiling (Figs 5, 6, 7). In a further embodiment the gap between the object and the walls of the evaporator may be such that a bubble pumping action occurs therein (Figs 8, 9). <IMAGE>
Description
BOILING COOLER
BACKGROUND OF THE INVENTION
The present invention relates to a boiling cooler for an on-vehicle electric appliance or the like, and particularly relates to a boiling cooler, the height of the condenser of which is made so small that the cooler can be installed in a machine of limited height.
FIG. 10 is a schematic view of a conventional boiling cooler 100 which is for an electric appliance and was published in the pages 379 through 385 of the Journal of the Institute of Electrical Engineers of Japan, No. 5,
Vol. 99, issued in May 1979. The boiling cooler 100 comprises an evaporator 1 in which a liquid working medium 5 is vaporized by the heat of a cooled object 6 such as a semiconductor device, a vapor conveyance section 2 such as a vapor pipe, through which the working medium vaporized in the evaporator is conveyed, a condenser 3 in which the vaporized medium flowed into the condenser through the vapor conveyance section is liquefied by being cooled, and a liquid conveyance section 4 such as a liquid pipe, through which the medium liquefied in the condenser is conveyed therefrom to the evaporator.The cooled object 6 is immersed in the liquid working medium 5 so as to be cooled by the medium. Usually, the working medium 5 is put into the boiling cooler 100 after the interior thereof is made vacuum.
The operation of the boiling cooler 100 is described from now on. When the cooled object 6 is put in action, bubbles 7 are made from the liquid working medium 5 in contact with the heat transfer surface of the cooled object so that the object is well cooled by boiling heat transfer. The bubbles 7 ascend in the liquid working medium 5 and disappear at the free surface 8 of the medium. The vapor of the medium 5 over the free surface 8 of the liquid medium is conveyed into the condenser 3 through the vapor conveyance section 2 due to the difference between the pressure in the evaporator 1 and that in the condenser. The condenser 3 is usually cooled by air so that the vapor is liquefied by condensation in the condenser. The liquefied working medium 5 gravitates in the liquid conveyance section 4 so that the medium flows into the evaporator 1.At that time, since the pressure in the evaporator 1 is higher than that in the condenser 3, the liquid working medium 5 ascends back in the liquid conveyance section 4. The relationship between the height H of the ascent of the liquid working medium 5 in the liquid conveyance section 4 and the pressure loss
Ap in the spontaneous circulation of the working medium in the form of the vapor or liquid drops in the boiling cooler 100 is expressed as follows: Ap = (p1 - PV)'9'H In the equation, Pl, Pv and g denote the density of the working medium 5 in the form of the liquid, that of the medium in the form of the vapor and the acceleration of gravity, respectively.In the conventional boiling cooler 100 in which the heat is transferred through the spontaneous circulation of the working medium 5, the liquefied medium ascends to the height H in the liquid conveyance section 4. If the liquefied working medium 5 is stayed in the condenser 3, the condensation capacity thereof would fall. For that reason, the condenser 3 needs to be located above the height H of the ascent of the medium 5. If the cooler 100 is installed under the floor 9 of the body 200 of a vehicle such as an electric.
railway car or the like as shown in FIG. 11, the distance between the floor and rails 10 does not have a sufficient margin for the installation. For that reason, the crosssectional area of the vapor conveyance section 2 is increased to decrease the pressure loss Ap. As for the installation, the condenser 3 is placed in an outer location as to the vehicle body 200 so as to be cooled by the wind generated relative to the vehicle at the time of movement thereof.
Since the working medium 5 is conveyed through the spontaneous circulation thereof in the conventional boiling cooler 100, the condenser 3 needs to be placed above a prescribed height. For that reason, the boiling cooler 100 has a problem that it cannot be installed in a machine of limited height.
SUMMARY OF THE INVENTION
The present invention was made in order to solve the problem. Accordingly, it is an object of the present invention to provide a boiling cooler, the height of the location of the condenser of which is decreased to make it possible to install the cooler in a machine of limited height.A boiling cooler provided in accordance with the present invention comprises an evaporator in which a liquid working medium is vaporized by the heat of a cooled object; a vapor conveyance section for conveying the working medium vaporized in the evaporator; a condenser in which the vaporized working medium flowed into the condenser through the vapor conveyance section is liquefied by being cooled; and a liquid conveyance means through which the liquefied working medium is -conveyed from the condenser to the evaporator and which has a medium ascent passage which is located below the level of the liquid working medium in the evaporator so that bubbles are made from the medium in the medium ascent passage and ascent therein.
Another boiling cooler provided in accordance with the present invention comprises an evaporator in which a prescribed gap is provided between the outside surface of a cooled object and the inside surface of the evaporator and a liquid working medium is vaporized by the heat of the cooled object bubbles are made from the working medium so that the bubbles ascend in the gap between the cooled object and the evaporator; a vapor conveyance section for conveying the working medium vaporized in the evaporator; a condenser in which the vaporized working medium having flowed into the condenser through the vapor conveyance section is liquefied by being cooled; and a liquid conveyance means through which the liquefied working medium is conveyed from the condenser to the evaporator.In each of the boiling coolers provided in accordance with the present invention, the bubbles ascend in the medium ascent passage of the liquid conveyance means or in the gap between the cooled object and the evaporator so that the bubbles act to pump the liquid working medium out of the passage or the gap.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic view of a boiling cooler which is an embodiment of the present invention.
FIGS. 2 and 3 are views for describing that the level of liquid working medium in a condenser is lowered into a liquid conveyance section by boil bubble pumping.
FIG. 4 is a schematic view of a boiling cooler which is another embodiment of the present invention.
FIG. 5 is a schematic view of a boiling cooler which is yet another embodiment of the present invention.
FIG. 6 is a schematic view of a boiling cooler which is yet another embodiment of the present invention.
FIG. 7 is a schematic view of a boiling cooler which is yet another embodiment of the present invention.
FIG. 8 is a schematic view of a boiling cooler which is yet another embodiment of the present invention.
FIG. 9 is a schematic view of a boiling cooler which is yet another embodiment of the present invention.
FIG. 10 is a schematic view of a conventional boiling cooler.
FIG. 11 is a schematic view of the conventional boiling cooler in the state of being installed in an electric railway car.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Embodiments of the present invention are hereafter described with reference to the drawings.
FIG. 1 is a schematic view of a boiling cooler which is one of the embodiments. The boiling cooler comprises an evaporator 1 in which a liquid working medium 5 is vaporized by the heat of a cooled object 6; a vapor conveyance section 2 such as a vapor pipe, through which the working medium vaporized in the evaporator is conveyed; a condenser 3 in which the working medium flowed into the condenser through the vapor conveyance section is liquefied by being cooled; and a liquid conveyance section 11 such as a liquid pipe, through which the working medium liquefied in the condenser is conveyed therefrom to the evaporator. The cooled object 6 is immersed in the liquid working medium 5 so as to be cooled by the medium.The liquid conveyance section 11 has a medium ascent passage 12 which is located under the free surface 8 of the liquid working medium 5 in the evaporator 1 and extending through the cooled object 6.
When the cooled object 6 is put in action, the object heats so that bubbles 13 are made from the liquid working medium 5 in the medium ascent passage 12 because of the boiling of the medium. The bubbles 13 ascend due to the buoyancy. At that time, a shearing force acts at the boundary between each bubble 13 and the liquid around it so that the liquid ascends together with the bubble.
This phenomenon is called "boil bubble pumping". The principle of the phenomenon was described in the pages 2,797 through 2,806 of the Journal (second division) of the Japanese Association of Mechanical Engineers, No. 39,
Vol. 325, issued in September 1973. Because of the boil bubble pumping, the liquid working medium 5 in the liquid conveyance section 11 is moved out therefrom so that the level of the liquid working medium in the section descends.- For that reason, the condenser 3 can be located at a smaller height.
The movement of the level of the liquid working medium 5 in the liquid conveyance section 11 at the time of the action of the cooled object 6 and at the time of the non-action thereof is described from now on. FIG. 2 is a schematic view of the boiling cooler at the time of the action of the cooled object 6. FIG. 3 is a schematic view of the boiling cooler at the time of the action of the cooled object 6, at which the bubbles 13 are made in the medium ascent passage 12. When the cooled object 6 is not in action, the liquid working medium 5 is present in both the evaporator 1 and the condenser 3, as shown in
FIG. 2, because the evaporator and the condenser communicate with each other through the liquid conveyance section 11.When the cooled object 6 is put in action, the liquid working medium 5 is moved out of the liquid conveyance section 11 because of the boil bubble pumping in the medium ascent passage 12 so that the level 14 of the liquid working medium drops out of the condenser 3 into the liquid conveyance section, as shown in FIG. 3.
It is preferable that the cooled object 6 is entirely immersed in the liquid working medium 5 at the time of the non-action of the object as well as at the time of the action thereof so as to undergo stable boil cooling.
FIG. 4 is a schematic view of a boiling cooler which is another of the embodiments. The boiling cooler is the same as that shown in FIGS. 1, 2 and 3, except that the cooler shown in FIG. 4 has an electrically insulating pipe 15 connected between the casing of an evaporator 1 and a medium ascent passage 12 so as to electrically insulate a cooled object 6 from the casing of the evaporator.
FIG. 5 is a schematic view of a boiling cooler which is yet another of the embodiments. The boiling cooler is the same as that shown in FIGS. 1, 2 and 3, except that the medium ascent passage 12 of the boiling cooler shown in FIG. 5 does not extend through a cooled object 6, and a heating body 16 is provided in pressure contact with the outside surface of the medium ascent passage portion of a liquid conveyance section 11 so as to cause boil bubble pumping.
FIG. 6 is a schematic view of a boiling cooler which is yet another of the embodiments. The boiling cooler is the same as that shown in FIG. 5, except that the boiling cooler shown in FIG. 6 has a medium ascent passage 12 which is located outside an evaporator 1 and whose medium outlet port 17 is immersed in a liquid working medium 5 in the evaporator, and a heating body 16a provided in pressure contact with the outside surface of the medium ascent passage portion of a liquid conveyance section 11.
FIG. 7 is a schematic view of a boiling cooler which is yet another of the embodiments. The boiling cooler is the same as that shown in FIG. 6, except that the medium outlet port 17 of the medium ascent passage 12 of the cooler shown in FIG. 7 is located above the level 8 of a liquid working medium 5 in an evaporator 1. It is preferable that the medium outlet port 17 is immersed in the liquid working medium 5 in the evaporator so as to stabilize boil bubble pumping.
FIG. 8 is a schematic view of a boiling cooler which is yet another of the embodiments. The boiling cooler is the same as that shown in FIGS. 1, 2 and 3, except that the cooler shown in FIG. 8 has a prescribed gap 18 between the outside surface of a cooled object 6 and the inside surface of an evaporator 1, instead of a medium ascent passage extending through the cooled object.
When the cooled object 6 is in action, bubbles 19 are made from a liquid cooling medium 5 due to the boiling thereof in the gap 18 and ascend therein so that boil bubble pumping is performed to move up the liquid working medium out of the gap. For that reason, the level of the liquid working medium 5 in a condenser 3 is lowered into a liquid conveyance section 11. As a result, the condenser 3 can be located at a smaller height.
FIG. 9 is a schematic view of a boiling cooler which is yet another of the embodiments. The boiling cooler is the same as that shown in FIG. 8, except that the cooler shown in FIG. 9 has a medium ascent passage provided in a cooled object 6.
In each of the above-described embodiments, a medium of lower boiling point than the working medium 5 may be added thereto to be boiled by the heat of the working medium so as to perform boil bubble pumping, or the pressure in the medium ascent passage may be reduced, if possible, to lower the boiling point of the working medium therein to boil the medium at a lower temperature so as to perform boil bubble pumping.
A boiling cooler provided in accordance with the present invention comprises an evaporator in which a liquid working medium is vaporized by the heat of a cooled object; a vapor conveyance section for conveying the working medium vaporized in the evaporator; a condenser in which the vaporized working medium flowed into the condenser through the vapor conveyance section is liquefied by being cooled; and a liquid conveyance means through which the liquefied working medium is conveyed from the condenser to the evaporator and which has a medium ascent passage which is located below the level of the liquid working medium in the evaporator so that bubbles are made from the liquid working medium in the medium ascent passage and ascend therein. For that reason, the condenser can be located at a smaller height to make it possible to install the boiling cooler in a machine of limited height.
Another boiling cooler provided in accordance with the present invention comprises an evaporator in which a prescribed gap is provided between the outside surface of a cooled object and the inside surface of the evaporator and a liquid working medium is vaporized by the heat of the cooled object so that the bubbles ascend in the gap between the cooled object and the evaporator; a vapor conveyance section for conveying the working medium vaporized in the evaporator; a condenser in which the vaporized working medium having flowed into the condenser through the vapor conveyance section is liquefied by being cooled; and a liquid conveyance means through which the liquefied working medium is conveyed from the condenser to the evaporator and in which bubbles are made from the working medium. For that reason, the condenser can be located at a smaller height to make it possible to install the boiling cooler in a machine of limited height.
Claims (7)
1. A boiling cooler comprising:
an evaporator means for vaporating a liquid working medium by the heat of a cooled object:
a vapor conveyance section conveying said medium vaporixed in said evaporator means;
a condenser means for cooling and liquefying said vaporized in said evaporator means;
a condenser means for cooling and liquefying said vaporized medium flowed into said condenser means through said section; and
a liquid conveyance means for conveying said liquid medium from said condenser means to said evaporator means, in which said liquid conveyance means comprises a medium ascent passage in such a manner that bubbles are made from said medium in said medium ascent passage and said bubbles ascend therein.
2. A boiling cooler according to claim l, in which said medium ascent passage of said liquid conveyance means is located below the level of said liquid wording medium in said evaporator means.
3. A boiling cooler according to claim 1, in which said medium ascent passage of said liquid conveyance means extends through said cooled object.
4. A boiling cooler according to claim 3, further comprising an electrically insulating pipe connected between the casing of said evaporator means and said medium ascent passage so as to electrically insulate said cooled object from the casing of said evaporator means.
5. A boiling cooler according to claim 1, further comprising a heating body in pressure contact with the outside surface of said medium ascent passage of said liquid conveyance means so as to cause boil bubble pumping.
6. A boiling cooler according to claim 1, in which said medium ascent passage is located outside said evaporator means, the medium outlet port of said medium ascent passage is immersed in said liquid working medium in said evaporator means, and a heating body is provided in pressure contact with the outside surface of said medium ascent passage of said liquid conveyance means.
7. A boiling cooler according to claim 1 in which said medium ascent passage is located outside said evaporator means, the medium outlet port of said medium ascent passage is located above the level of said liquid working medium is said evaporator, and a heating body is provided in pressure contact with the outside surface of said medium ascent passage of said liquid conveyance means.
8 A boiling cooler comprising:
an evaporator means of vaporizing a liquid working medium by the heat of a cooled object, in which a prescribed gap is provided between the outside surface of said cooled object and the inside surface of said evaporator means in such a manner that bubbles are made from said medium and said bubbles ascend in said gap;
a vapor conveyance section conveying said medium vaporized in said evaporator;
a condenser means for cooling and liquefying said vaporized medium flowed into said condenser through said vapor conveyance section; and
a liquid conveyance section conveying said liquefied medium form said condenser means to said evaporator means.
9 A boiling cooler according to claim 8, in which said evaporator means further comprises a medium ascent passage extending through said cooled object.
10 A boiling cooler substantially as hereinbefore described with reference to any one of Figures 1 to 9 of the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27681288A JPH02122554A (en) | 1988-10-31 | 1988-10-31 | Boiling and cooling apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8923697D0 GB8923697D0 (en) | 1989-12-06 |
| GB2225099A true GB2225099A (en) | 1990-05-23 |
Family
ID=17574733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8923697A Withdrawn GB2225099A (en) | 1988-10-31 | 1989-10-20 | Boiling cooler |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH02122554A (en) |
| ES (1) | ES2017293A6 (en) |
| GB (1) | GB2225099A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7337829B2 (en) | 1999-09-03 | 2008-03-04 | Fujitsu Limited | Cooling unit |
| EP2119994A1 (en) * | 2008-05-14 | 2009-11-18 | Abb Research Ltd. | Evaporator for a cooling circuit |
| US7907408B2 (en) * | 2006-04-13 | 2011-03-15 | Mitsubishi Electric Corporation | Cooling apparatus and power converter |
| US8107241B2 (en) | 2006-03-31 | 2012-01-31 | Mitsubishi Electric Corporation | Electric power conversion apparatus including cooling units |
| WO2012116911A1 (en) * | 2011-03-02 | 2012-09-07 | Siemens Aktiengesellschaft | Cooling device for cooling a superconductor, in particular in a magnetic resonance device or a rotor |
| US8567482B2 (en) | 2004-12-17 | 2013-10-29 | Xuejun Yin | Heat tube device utilizing cold energy and application thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1317129A (en) * | 1971-02-26 | 1973-05-16 | Ibm | Cooling systems |
-
1988
- 1988-10-31 JP JP27681288A patent/JPH02122554A/en active Pending
-
1989
- 1989-10-20 GB GB8923697A patent/GB2225099A/en not_active Withdrawn
- 1989-10-30 ES ES8903665A patent/ES2017293A6/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1317129A (en) * | 1971-02-26 | 1973-05-16 | Ibm | Cooling systems |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7337829B2 (en) | 1999-09-03 | 2008-03-04 | Fujitsu Limited | Cooling unit |
| US7828047B2 (en) | 1999-09-03 | 2010-11-09 | Fujitsu Limited | Cooling unit |
| US8567482B2 (en) | 2004-12-17 | 2013-10-29 | Xuejun Yin | Heat tube device utilizing cold energy and application thereof |
| US8107241B2 (en) | 2006-03-31 | 2012-01-31 | Mitsubishi Electric Corporation | Electric power conversion apparatus including cooling units |
| US7907408B2 (en) * | 2006-04-13 | 2011-03-15 | Mitsubishi Electric Corporation | Cooling apparatus and power converter |
| EP2119994A1 (en) * | 2008-05-14 | 2009-11-18 | Abb Research Ltd. | Evaporator for a cooling circuit |
| US8134833B2 (en) | 2008-05-14 | 2012-03-13 | Abb Research Ltd | Evaporator for a cooling circuit |
| WO2012116911A1 (en) * | 2011-03-02 | 2012-09-07 | Siemens Aktiengesellschaft | Cooling device for cooling a superconductor, in particular in a magnetic resonance device or a rotor |
| AU2012222562B2 (en) * | 2011-03-02 | 2016-02-25 | Siemens Aktiengesellschaft | Cooling device for cooling a superconductor, in particular in a magnetic resonance device or a rotor |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8923697D0 (en) | 1989-12-06 |
| ES2017293A6 (en) | 1991-01-16 |
| JPH02122554A (en) | 1990-05-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |