GB2219298A - Moulding compound - Google Patents
Moulding compound Download PDFInfo
- Publication number
- GB2219298A GB2219298A GB8911997A GB8911997A GB2219298A GB 2219298 A GB2219298 A GB 2219298A GB 8911997 A GB8911997 A GB 8911997A GB 8911997 A GB8911997 A GB 8911997A GB 2219298 A GB2219298 A GB 2219298A
- Authority
- GB
- United Kingdom
- Prior art keywords
- weight
- moulding compound
- polymers
- compound according
- resol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000206 moulding compound Substances 0.000 title claims description 20
- 229920000642 polymer Polymers 0.000 claims description 22
- 229920001568 phenolic resin Polymers 0.000 claims description 18
- 229920003987 resole Polymers 0.000 claims description 15
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 6
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- 239000002671 adjuvant Substances 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Substances O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- -1 methylol groups Chemical group 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 238000005382 thermal cycling Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 239000005995 Aluminium silicate Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004815 dispersion polymer Substances 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- 241000531908 Aramides Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L11/00—Compositions of homopolymers or copolymers of chloroprene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
-2219298 1 K.ULDING COMPOUND The invention relates to moulding compounds
for producing thermoset and chemically stable equipment, including containers and tubes. Known moulding compounds by weight, 25 to 60 parts by weight of a phenol- formal dehy de reso'L resin and 40 to 75 parts by weight of a mixture of fillers, reinforcing fibres and conventional adjuvants.
German Patents 27 38 490, 27 38 491 and 31 48 326 disc lose moulding compounds that are of a doughy consistency and readily manually processable. Such compounds are used for the production of chemically stable single-layer equipment in a self-supporting structural form. The mixture comprises thermosetting precondensed phenol- formaldehyde resins, pulverulent mineral fillers, such as barytes, kaolin, mica, graphite, coke powder or carbon black, and reinforcing fitra.;, particularly glass and/or carbon fibres, as well as conventional adjuvants, including catalysts, thickeners and accelerators. Cracks occur in the moulded articles produced from these moulding compounds, particularly when the articles are subjected to thermal cycling: this is a disadvantage and the present invention seeks to provide a moulding compound, oil' greater resistance to thermal cycling and of improved stabillity under the action of chemicall media, particularly organic solvents, but whose mechanical character ist ics and thermal stability under load are nevertheless unimpaired.
In accordance with the present invention the phenol formaldehyde resol resin in a moulding compound described above contains 0.5 to 20%, preferably 3 to 12%, by weight of one or more polymers based on 1, 3butadiene, 2-chloro-1, 3-butadiene or isoprene or their copolymers with 0.5 to 45% by weight of acrylonitrile or with 0.5 to 65% by weight of styrene, the said polymers having a gel proportion of at least 45% by weight and being dispersed in the phenol -formaldehyde resol resin in the form of particles with an average particle size below 3 m- They are preferably added to the phenol -formaldehyde resol in the form of aqueous polymer dispersions with an average particle size below 1)1m. The polymers are preferably in the form of finely divided polymer dispersions, which are commercially available.
In view of the fact that polymer dispersions contain different emulsifiers and protective colloids and therefore can. have different 2 compatibilities with the phenol- formaldehyde resin, it is appropriate to carry out mixing tests beforehand, so as to ensure that during the mixing of the phenol -formaldehyde resin with the polymer dispersion there is no excessive thickening or lump- or gel-formation.
Apart from the novel phenol -formaldehyde resol, the moulding compound also contains fillers, reinforcing fibres and conventionai.
adjuvants. For example, barytes, kaolin, mica, graphite, coke powder or carbon black can be used as fillers. Examples of reinforcing fibres are commercially available glass, carbon, aramide, ceramic or silicon dioxide fibres. The fibres can be mixed in, for example as elementary fibres with an average length of 0.5 to 60 mm, or can be incorporated into the moulding compound in the form of textile fibres as mats or as woven, folded or non-woven fabrics.
To accelerate the hardening reaction, it is for example possible to add oxides or hydroxides of alkali metals or alkaline-earth metals or acids such as organic sulphonic acids.
By use of such a moulding compound, it is possible to produce articles that have a much greater resistance to thermal cycling and that have a better stability, particularly with respect to organic solvents, without impairment of their other mechanical characteristics.
The polymers may additionally contain carboxyl or methylol groups.
An illustrative embodiment of the present invention is set forth in greater detail in the following example.
EXAMPLE g of a commercially available phenol-formaldehyde resol with a phenol: formaldehyde molar ratio of 1:1.6, a viscosity of 5000 mPa.s at 250C, a pH of 7.2 and a water content of approximately 14% by weight is homogeneously mixed with 11 g of a commercially available aqueous dispersion of a copolymer of 2-chloro-1,3-butadiene and methacrylic acid having a solids content of 47%, a viscosity of 400 mPa.s at 250C, a pH of 7, an average particle size of approximately 0.3ym, and a gel proportion in the polymer higher than 80%, by adding the polymer dispersion to the phenol-formaldehyde resin with stirring.
90 g of mica is then stirred into 100 g of this mixture as filler. In addition 0.5 g of magnesium oxide is added as catalyst to accelerate the hardening reaction. Further adjuvants, including 1 zrj 3 thickeners, are also incorporated. From this material and reinforcing fibres, i.e. five layers of a commercia11y available glass roving 2, J nate fabric with a weight per unit area of 400 g..im is produced a lam. moulding with a glass content of approximately 30% by weight. This moulding is subsequently hardened at a 1350C at 8 bars for a period of approximately 6 hours.
Following the curing of the moulding, the latter is exposed to thermal cycling. A sample of this moulding is firstly stored for 5 to 6 days at 1700C and then for one day at ambient temperature. This thermal cycling is repeated four times. The sample is then out through and the out surface ground and polished. No cracks can be detected under observation by microscope.
4
Claims (5)
1. A moulding compound for producing thermoset, chemically stable equipment comprising 25 to 60 parts by weight of a pheno I -formaldehyde resol resin and 40 to 75 parts by weight of a mixture of fillers, reinforcing fibres and conventional adjuvants, in which the phenol formaldehyde resol resin contains 0.5 to 20% by weight of one or more polymers based on 1,3-butadiene, 2-chloro-1,3-butadiene or isoprene or their copolymers with 0.5 to 45/o by weight of acrylonitrile or with 0.5 to 65% by weight of styrene, the said polymers having a gel proportion of at least 45% by weight and being dispersed in the phenolformaldehyde resol resin in the form of particles with an average particle size below 3)1m.
2. A moulding compound according to-claim 1, in which the phenolformaldehyde resol contains 3 to 12 by weight of one or more polymers.
3. A moulding compound according to claim 1 or 2, in which the polymers additionally contain carboxy.' or methylol groups.
4. A moulding compound according to any one of claims 1 to 3, in which the polymer or polymers are added to the phenol- formaldehyde resol in the form of aqueous polymer dispersions with an average particle size below 1 jim.
5. A moulding compound according to claim 1, substantially as hereinbefore described with reference to the foregoing Example.
Published 1989 atThe Patent Office, State House. 66'71 High Holborn. London WC1R 4TP. Further copies maybe obtatnedfrom The Patent office. Sales Branch, St Mary Cray, Orpington, Kent BR,5 3RD. Printed by MultAplex techniques ltd, St Mary Cray, Kent, Con. 1/87
5. A moulding compound according to claim 1, substantially as hereinbefore described with reference to the foregoing Example.
1 - i-5 - Amendments to the claims have been filed as follows 1. A moulding compound for producing thermoset, chemically stable equipment comprising 25 to 60 parts by weight of an aqueous phenolformaldehyde resol resin and 40 to 75 parts by weight of a mixture of fillers, reinforcing fibres and conventional adjuvants, in which the phenol formaldehyde resol. resin contains 0.5 to 20% by weight of one or more polymers based on 1,3-butadiene, 2-chloro-1,3-butadiene or isoprene or their copolymers with 0.5 to 45% by weight of acrylonitrile or with 0.5 to 65% by weight of styrene, the said polymers having a gel proportion of at least 45% by weight and being dispersed in the phenolformaldehyde resol resin in the form of particles with an average particle size below 3 ym.
2. A moulding compound according to claim 1, in which the phenolformaldehyde resol contains 3 to 12% by weight of one or more polymers.
3. A moulding compound according to claim 1 or 2, in which the polymers additionally contain carboxyl or methylol groups.
4. A moulding compound according to any one of claims 1 to 3, in which the polymer or polymers are added to the phenol- formaldehyde resol in the form of aqueous polymer dispersions with an average particle size below 1 ym.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19883818942 DE3818942C2 (en) | 1988-06-03 | 1988-06-03 | Molding compound |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8911997D0 GB8911997D0 (en) | 1989-07-12 |
| GB2219298A true GB2219298A (en) | 1989-12-06 |
| GB2219298B GB2219298B (en) | 1992-03-25 |
Family
ID=6355797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8911997A Expired - Lifetime GB2219298B (en) | 1988-06-03 | 1989-05-25 | Moulding compound |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE3818942C2 (en) |
| FR (1) | FR2632317B1 (en) |
| GB (1) | GB2219298B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0416526A2 (en) * | 1989-09-08 | 1991-03-13 | Takeda Chemical Industries, Ltd. | Phenolic resin molding compounds and the articles thereof |
| EP0590233A2 (en) * | 1992-09-30 | 1994-04-06 | Sumitomo Bakelite Company Limited | Impact modified, reinforced phenolic resin molding materials |
| US5336724A (en) * | 1989-09-08 | 1994-08-09 | Takeda Chemical Industries, Ltd. | Phenolic resin molding compounds and the articles thereof |
| EP0940239A1 (en) * | 1998-03-06 | 1999-09-08 | Matsushita Electric Industrial Co., Ltd. | Recycling of cured phenolic resin and a product such as a vacuum thermal insulator obtained thereby |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1131549A (en) * | 1966-10-05 | 1968-10-23 | Bp Chem Int Ltd | Rubber modified novolak resins |
| GB1133990A (en) * | 1964-12-14 | 1968-11-20 | Union Carbide Corp | Improved phenolic moulding compositions |
| GB1477300A (en) * | 1973-06-05 | 1977-06-22 | British Industrial Plastics | Thermosetting resin compositions and moulding materials containing same |
| US4348491A (en) * | 1980-02-21 | 1982-09-07 | General Electric Company | Heat stable molded phenolic resin article |
| GB2147904A (en) * | 1983-10-14 | 1985-05-22 | Rogers Corp | Heat stable phenolic composition |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE375785B (en) * | 1969-02-25 | 1975-04-28 | British Industrial Plastics | |
| WO1982003080A1 (en) * | 1981-03-02 | 1982-09-16 | Gen Electric | Heat stable molded phenolic resin article |
| DD157910A5 (en) * | 1981-04-02 | 1982-12-15 | Gen Electric | HEAT-RESISTANT FORMKOERPER OF PHENOLY RESIN |
| JPH072895B2 (en) * | 1984-03-01 | 1995-01-18 | 日本ゼオン株式会社 | Impact resistant phenolic resin composition |
| US4599382A (en) * | 1984-03-21 | 1986-07-08 | Japan Synthetic Rubber Co., Ltd. | Rubber composition comprising a thermosetting resin and a functional rubber-like copolymer |
-
1988
- 1988-06-03 DE DE19883818942 patent/DE3818942C2/en not_active Expired - Fee Related
-
1989
- 1989-05-25 GB GB8911997A patent/GB2219298B/en not_active Expired - Lifetime
- 1989-06-01 FR FR8907245A patent/FR2632317B1/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1133990A (en) * | 1964-12-14 | 1968-11-20 | Union Carbide Corp | Improved phenolic moulding compositions |
| GB1131549A (en) * | 1966-10-05 | 1968-10-23 | Bp Chem Int Ltd | Rubber modified novolak resins |
| GB1477300A (en) * | 1973-06-05 | 1977-06-22 | British Industrial Plastics | Thermosetting resin compositions and moulding materials containing same |
| US4348491A (en) * | 1980-02-21 | 1982-09-07 | General Electric Company | Heat stable molded phenolic resin article |
| GB2147904A (en) * | 1983-10-14 | 1985-05-22 | Rogers Corp | Heat stable phenolic composition |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0416526A2 (en) * | 1989-09-08 | 1991-03-13 | Takeda Chemical Industries, Ltd. | Phenolic resin molding compounds and the articles thereof |
| EP0416526A3 (en) * | 1989-09-08 | 1991-12-18 | Takeda Chemical Industries, Ltd. | Phenolic resin molding compounds and the articles thereof |
| US5336724A (en) * | 1989-09-08 | 1994-08-09 | Takeda Chemical Industries, Ltd. | Phenolic resin molding compounds and the articles thereof |
| EP0590233A2 (en) * | 1992-09-30 | 1994-04-06 | Sumitomo Bakelite Company Limited | Impact modified, reinforced phenolic resin molding materials |
| EP0590233A3 (en) * | 1992-09-30 | 1994-11-23 | Sumitomo Bakelite Co | Impact modified, reinforced phenolic resin molding materials. |
| EP0940239A1 (en) * | 1998-03-06 | 1999-09-08 | Matsushita Electric Industrial Co., Ltd. | Recycling of cured phenolic resin and a product such as a vacuum thermal insulator obtained thereby |
| CN1094953C (en) * | 1998-03-06 | 2002-11-27 | 松下电器产业株式会社 | Method for using regenerating phenolic resin hardening material |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2219298B (en) | 1992-03-25 |
| FR2632317A1 (en) | 1989-12-08 |
| FR2632317B1 (en) | 1993-05-28 |
| GB8911997D0 (en) | 1989-07-12 |
| DE3818942C2 (en) | 1997-04-10 |
| DE3818942A1 (en) | 1989-12-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19980525 |