GB2216532B - Heat resistant and photosensitive aromatic polyamide resins and method of preparing same - Google Patents

Heat resistant and photosensitive aromatic polyamide resins and method of preparing same

Info

Publication number
GB2216532B
GB2216532B GB8904786A GB8904786A GB2216532B GB 2216532 B GB2216532 B GB 2216532B GB 8904786 A GB8904786 A GB 8904786A GB 8904786 A GB8904786 A GB 8904786A GB 2216532 B GB2216532 B GB 2216532B
Authority
GB
United Kingdom
Prior art keywords
heat resistant
aromatic polyamide
polyamide resins
preparing same
photosensitive aromatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8904786A
Other versions
GB8904786D0 (en
GB2216532A (en
Inventor
Tsuguo Yamaoka
Yutaka Maruyama
Kentaro Tsutsumi
Haruhiko Komoriya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central Glass Co Ltd
Original Assignee
Central Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63048726A external-priority patent/JP2542033B2/en
Priority claimed from JP63104858A external-priority patent/JP2542041B2/en
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Publication of GB8904786D0 publication Critical patent/GB8904786D0/en
Publication of GB2216532A publication Critical patent/GB2216532A/en
Application granted granted Critical
Publication of GB2216532B publication Critical patent/GB2216532B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/32—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from aromatic diamines and aromatic dicarboxylic acids with both amino and carboxylic groups aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/48—Polymers modified by chemical after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polyamides (AREA)
GB8904786A 1988-03-03 1989-03-02 Heat resistant and photosensitive aromatic polyamide resins and method of preparing same Expired - Fee Related GB2216532B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63048726A JP2542033B2 (en) 1988-03-03 1988-03-03 Aromatic polyamide resin and heat-resistant photosensitive material using the same
JP63104858A JP2542041B2 (en) 1988-04-27 1988-04-27 Aromatic polyamide resin, method for producing the same, and heat-resistant photosensitive material using the same

Publications (3)

Publication Number Publication Date
GB8904786D0 GB8904786D0 (en) 1989-04-12
GB2216532A GB2216532A (en) 1989-10-11
GB2216532B true GB2216532B (en) 1991-07-24

Family

ID=26389033

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8904786A Expired - Fee Related GB2216532B (en) 1988-03-03 1989-03-02 Heat resistant and photosensitive aromatic polyamide resins and method of preparing same

Country Status (4)

Country Link
DE (1) DE3906684A1 (en)
FR (1) FR2628112B1 (en)
GB (1) GB2216532B (en)
IT (1) IT1228515B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5114826A (en) * 1989-12-28 1992-05-19 Ibm Corporation Photosensitive polyimide compositions
EP0450189B1 (en) * 1990-03-29 1996-10-30 Siemens Aktiengesellschaft High temperature stable negative resists and process for the production of high temperature stable relief structure
DE59208963D1 (en) * 1991-05-07 1997-11-20 Siemens Ag Highly heat-resistant positive resists and process for the production of highly heat-resistant relief structures
DE4206949A1 (en) * 1992-03-05 1993-09-09 Basf Ag MOLDING DIMENSIONS BASED ON UNSATURATED COPOLYAMIDES
DE4206948A1 (en) * 1992-03-05 1993-09-09 Basf Ag MOLDS BASED ON HOMO- AND COPOLYAMIDES CONTAINING OLEFINIC DOUBLE BINDINGS
TWI307822B (en) * 2001-07-03 2009-03-21 Hitachi Chemical Co Ltd

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3066117A (en) * 1957-02-08 1962-11-27 Bayer Ag Light-sensitive water soluble compounds
WO1980000706A1 (en) * 1978-09-29 1980-04-17 Hitachi Ltd Light-sensitive polymer composition
DE2933828A1 (en) * 1979-08-21 1981-03-12 Siemens AG, 1000 Berlin und 8000 München POLYOXAZOLE PREPARATIONS AND THEIR PRODUCTION.
JPS60180197A (en) * 1984-02-27 1985-09-13 宇部興産株式会社 Method of producing multilayer printed circuit board
GB2188936B (en) * 1986-03-06 1988-12-21 Central Glass Co Ltd Aromatic polyamides and polybenoxazoles having diphenylhexafluoropropane units

Also Published As

Publication number Publication date
FR2628112B1 (en) 1992-11-13
GB8904786D0 (en) 1989-04-12
IT8919593A0 (en) 1989-02-28
DE3906684A1 (en) 1989-09-21
IT1228515B (en) 1991-06-20
GB2216532A (en) 1989-10-11
FR2628112A1 (en) 1989-09-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19940302