GB2215123A - Transistor array with polysilicon resistors - Google Patents
Transistor array with polysilicon resistors Download PDFInfo
- Publication number
- GB2215123A GB2215123A GB8803505A GB8803505A GB2215123A GB 2215123 A GB2215123 A GB 2215123A GB 8803505 A GB8803505 A GB 8803505A GB 8803505 A GB8803505 A GB 8803505A GB 2215123 A GB2215123 A GB 2215123A
- Authority
- GB
- United Kingdom
- Prior art keywords
- array
- polysilicon
- transistors
- resistors
- transistor array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 18
- 229920005591 polysilicon Polymers 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000003491 array Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
In a transistor array, such as a bipolar analogue array, comprising an array of cells 11, circuit function is determined by a customised resistor pattern. The resistors 16 comprise polysilicon deposited on the array. The transistors have polysilicon emitters and the polysilicon resistors may be formed from materials deposited simultaneously with these emitters. <IMAGE>
Description
IMPROVEMENT IN INTEGRATED CIRCUITS.
This invention relates to integrated circuits and in particular to transistor arrays in which circuit function is determined by the use of one or more customising masks.
Conventionally transistor arrays, e.g. bipolar analogue arrats, comprise an array of cells each formed from a number of transistors. Each cell is coupled to ablock of fixed value implanted or diffused resistors adjacent that cell. The particular function of the array is defined according to customer requirements by the provision of one or more customising metal layers which interconnect the transistors via particular series/parallel combinations of the fixed resistors.
This technique suffers from the disadvantage that serious constraints are placed on circuit design.
The length of any interconnect between a transistor and its associated resistor network in such a structure is, of necessity, longer than the ideal length. Furthermore, in such a construction, the design is often forced to route the interconnects to parts of the semiconductor die that may conflict with the required position of other interconnections. This limits the versatility and performance of the arrays.
The object of the present invention is to minimise or to overcome this disadvantage.
According to the invention there is provided a transistor array adapted to provide particular circuit functions by corresponding interconnection of the transistors, the array comprising a plurality of similar cells of transistors, and a plurality of resistors whereby selected transistors are coupled to define a predetermined circuit function, and wherein each said resistor comprises a body of polycrystalline silicon deposited on the array.
As the resistors are formed in the latter stages of processing they can be configured by a custom mask. This allows resistors of any required value to be placed at will or any part of the die. The metal routing task is thus reduced to that of interconnecting the transistors as required, the resistors being placed in the optimum positions to comply with positioning of the transistors interconnections.
An embodiment of the invention will now be described with reference to the accompanying drawings in which the single figure depicts in schematic form part of a transistor array. The invention is described below with reference to a bipolar analogue array, comprises an plurality of similar cells 11 of transistors disposed on a common semiconductor substrate 12. In the structure of the drawing, each cell consists of a pair of transistors each having a base 13 a 13 b, disposed in a common collector 14. Each transistor has a polycrystalline silicon (polysilicon) emitter body 15. Selected transistors of the array are coupled via polysilicon resistor tracks 16 routed via corridors 17 between the cells of array. Advantageously these tracks are deposited simultaneously with the transistor emitters using a customising mask. This provides the array with its desired circuit function. The polysilicon may be doped or undoped.
After provision of the polysilicon resistor pattern a further customising mask is employed to provide a desired metal interconnect (not shown). The chip is then mounted in a suitable package. The polysilicon resistors 16 may comprise a single polysilicon deposition or two polysilicon levels separated e.g. by oxide may be employed.
As the resistors are not formed until the latter part of the process there is no necessity to provide redundant resistors. This eases the constraints on chip space and simplifies the interconnection layout.
Claims (5)
1. A transistor array adapted to provide particular circuit functions by corresponding interconnection of the transistors, the array comprising a plurality of similar cells of transistors, and a plurality of resistors whereby selected transistors are coupled to define a predetermined circuit function, and wherein each said resistor comprises a body of polychrystalline silicon deposited on the array.
2. A bipolar transistor analogue array adapted to provide particular circuit functions by corresponding interconnection of the transistors, the array comprising a plurality of similar cells each containing a pair of transistors disposed on a common collector and each having a polycrystalline (polysilicon) emitter, and a plurality of resistors whereby selected transistors are coupled to define a predetermined circuit function, and wherein each said resistor comprises a body of polysilicon deposited on the array.
3. A transistor array as claimed in claim 2, wherein the polysilicon resistors are formed from materials deposited simultaneously with the transmitter emitters.
4. A transistor array as claimed in claim 1 or 2, wherein the polysilicon resistors comprise first and second levels of polysilicon.
5. A transistor array substantially as described herein with reference to and as shown in the accompanying drawing.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8803505A GB2215123B (en) | 1988-02-16 | 1988-02-16 | Improvement in integrated circuits |
EP19880310302 EP0316104A3 (en) | 1987-11-03 | 1988-11-02 | Integrated circuits comprising resistors and bipolar transistors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8803505A GB2215123B (en) | 1988-02-16 | 1988-02-16 | Improvement in integrated circuits |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8803505D0 GB8803505D0 (en) | 1988-03-16 |
GB2215123A true GB2215123A (en) | 1989-09-13 |
GB2215123B GB2215123B (en) | 1990-10-24 |
Family
ID=10631767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8803505A Expired - Fee Related GB2215123B (en) | 1987-11-03 | 1988-02-16 | Improvement in integrated circuits |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2215123B (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4291328A (en) * | 1979-06-15 | 1981-09-22 | Texas Instruments Incorporated | Interlevel insulator for integrated circuit with implanted resistor element in second-level polycrystalline silicon |
EP0037103A1 (en) * | 1980-03-31 | 1981-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
US4370798A (en) * | 1979-06-15 | 1983-02-01 | Texas Instruments Incorporated | Interlevel insulator for integrated circuit with implanted resistor element in second-level polycrystalline silicon |
GB2110470A (en) * | 1981-11-27 | 1983-06-15 | Hughes Aircraft Co | Polycrystalline semiconductor resistor |
EP0097595A2 (en) * | 1982-06-21 | 1984-01-04 | Fairchild Semiconductor Corporation | Static RAM cell |
EP0100676A2 (en) * | 1982-08-02 | 1984-02-15 | Fujitsu Limited | Resistors in semiconductor devices |
US4579600A (en) * | 1983-06-17 | 1986-04-01 | Texas Instruments Incorporated | Method of making zero temperature coefficient of resistance resistors |
US4682402A (en) * | 1983-05-16 | 1987-07-28 | Nec Corporation | Semiconductor device comprising polycrystalline silicon resistor element |
-
1988
- 1988-02-16 GB GB8803505A patent/GB2215123B/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4291328A (en) * | 1979-06-15 | 1981-09-22 | Texas Instruments Incorporated | Interlevel insulator for integrated circuit with implanted resistor element in second-level polycrystalline silicon |
US4370798A (en) * | 1979-06-15 | 1983-02-01 | Texas Instruments Incorporated | Interlevel insulator for integrated circuit with implanted resistor element in second-level polycrystalline silicon |
EP0037103A1 (en) * | 1980-03-31 | 1981-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
GB2110470A (en) * | 1981-11-27 | 1983-06-15 | Hughes Aircraft Co | Polycrystalline semiconductor resistor |
EP0097595A2 (en) * | 1982-06-21 | 1984-01-04 | Fairchild Semiconductor Corporation | Static RAM cell |
EP0100676A2 (en) * | 1982-08-02 | 1984-02-15 | Fujitsu Limited | Resistors in semiconductor devices |
US4682402A (en) * | 1983-05-16 | 1987-07-28 | Nec Corporation | Semiconductor device comprising polycrystalline silicon resistor element |
US4579600A (en) * | 1983-06-17 | 1986-04-01 | Texas Instruments Incorporated | Method of making zero temperature coefficient of resistance resistors |
Also Published As
Publication number | Publication date |
---|---|
GB8803505D0 (en) | 1988-03-16 |
GB2215123B (en) | 1990-10-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |