GB2215053A - Electro-mechanical oscillating transducer devices - Google Patents

Electro-mechanical oscillating transducer devices Download PDF

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Publication number
GB2215053A
GB2215053A GB8803385A GB8803385A GB2215053A GB 2215053 A GB2215053 A GB 2215053A GB 8803385 A GB8803385 A GB 8803385A GB 8803385 A GB8803385 A GB 8803385A GB 2215053 A GB2215053 A GB 2215053A
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GB
United Kingdom
Prior art keywords
filaments
transducer
oscillation
mass
filament
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8803385A
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GB8803385D0 (en
GB2215053B (en
Inventor
John Christopher Greenwood
Paul Nicholas Egginton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
STC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STC PLC filed Critical STC PLC
Priority to GB8803385A priority Critical patent/GB2215053B/en
Publication of GB8803385D0 publication Critical patent/GB8803385D0/en
Publication of GB2215053A publication Critical patent/GB2215053A/en
Application granted granted Critical
Publication of GB2215053B publication Critical patent/GB2215053B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/097Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/16Measuring force or stress, in general using properties of piezoelectric devices
    • G01L1/162Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0828Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Gyroscopes (AREA)

Abstract

A transducer, e.g. for the sensing and measurement of acceleration, includes an oscillatory structure comprising three parallel filaments (15, 16, 17) coupled to a seismic mass (13). The frequency of oscillation of the filaments corresponds to the magnitude of displacement of the mass in response to an accelerating force. The filaments are maintained in oscillation in a mode such that the centre filaments (16) oscillates in antiphase with the two outer filaments (15, 17) to provide a balanced arrangement. Piezoresistive devices are implanted at the ends of the filaments for both driving and frequency sensing. The mass (13) is also connected to the support frame (11) by hinges (14) and the structure is made by etching a single piece of silicon. <IMAGE>

Description

TRANSDUCER DEVICE.
This invention relates to transducers, and in particular to electromechanical transducers in which a sensing element is, in use, maintained in a state of vibrational resonance.
Transducers in which the sensor element includes a mechanically resonant structure are finding increasing use, particularly in the field of inertial navigation on sensors of force or acceleration. The magnitude of the force acceleration is determined from a corresponding change in the frequency of the resonant structure. One example of such a device is shown in our published specification No. 21623214 (J.C. Greenwood et al 59-7X) which describes a transducer in which the resonant structure includes a double ended tuning fork.
The arrangement is such that, when subjected to an acceleration, a torsional force is applied to the resonator structure thus causing a corresponding change in the resonant frequency.
Whilst this device has proved satifactory in use, the power requirements for the maintenance of oscillation are somewhat critical and difficulty has been experienced in confining oscillation to a single balanced mode.
According to the present invention there is provided a transducer, including an oscillatory structure whose natural resonant frequency is a function of a stress applied to the oscillatory structure, wherein the oscillatory structure includes three parallel resilient filaments, and wherein the transducer includes means for maintaining the filaments in a state of oscillation in a mode such that two of said filaments oscillate in phase with each other and in antiphase with the third filament, said oscillation being at a frequency corresponding to said stress.
An embodiment of the invention will now be described with reference to the accompanying drawings in which Fig. 1 is a plan view of a transducer structure; Fig. la shows in detail the ocsillatory part of the transducer of Fig. 1; Fig. 2 is a sectional view of the transducer structure of Fig. 1; Fig. 3 shows in schematic form a drive circuit for maintaining oscillation of the transducer structure of Figs. 1 and 2.
and Fig. 4 is a schematic diagram of an inertial navigation and guidance system employing transducer structures as shown in Figs. 1 and 2.
Referring to Figs. 1 and 2 the transducer includes a rigid frame 11 having an opening 12 within which a seismic mass 13 is supported on flexible hinge members 14. In the absence of an applied force, the equilibrium position of the seismic mass 13 is in the plane of the frame 11. Movement of the seismic mass 13 is restrained by three parallel filaments 15, 16, 17 whereby the seismic mass is coupled to the frame. The filaments are disposed on a plane parallel to but distinct from that of the hinge members 14.
The filaments 15, 16 and 17 are all of substatially equal thickness, but the width of the centre filament 16 is preferably twice that of the two outer filaments 15 and 17. Each filament has a diffused or implanted piezo-resistor, 18, 19, 20 respectively, disposed at the region of the junction of that filament with the frame 11. The piezo-resistors provide a means of driving the filaments into ocsillation and of providing output signals whereby the frequency of that oscillation may be determined.
The transducer structure of Figs. 1 and 2 may be formed on an integral structure from a body of single crystal silicon by selective etching. Typically, a body, i.e. a wafer, of single crystal silicon is masked on both its upper and lower surfaces and is then exposed to an anisotropic etch. Etching may be performed with a mixture of potassium hydroxide, isopropanol and water, or with hydrazine hydrate. The thickness of hinge members 14 and of the filaments 15, 16 and 17 is determined by timing the etching process and termination exposure to the etchant when the desired thickness has been obtained. The etch produces an inwardly tapered cut. Thus, the mask dimensions are determined from the wafer thickness to obtain the desired dimensions of the finished transducer structure. Preferably the piezo-resistors are diffused or implanted prior to the etching process.
Fig. 3 shows a schematic circuit whereby the filaments 15, 16 and 17 are maintained in oscillation in the desired mode. The oscillatory system is driven by current pulses applied to the piezo-resistor 19 disposed on one end of the centre filament 16. This piezo-resistor is biased with current from a current source I1 and is supplied with current pulses from amplifier AMP via capacitor C1. Feedback signals at the frequency of oscillation are fed to the input of the amplifier from the piezo-resistors 18 and 20 associated with the outer filaments 15 and 17, these piezo-resistors being coupled in parallel and biased from a further current source I2. We have found that the mechanical coupling between the filaments is such that, by driving the centre filament, the two outer filaments oscillate in synchronism, but in antiphase, with the centre filament.The phase difference presented by the series combination of the amplifier AMP and the capacitor C1 maintains this 1800 phase relationship between the oscillating filaments.
The oscillatory mode described above is the preferred mode as the structure is in a condition of dynamic balance. The mass displacement of the larger central filament 16 is couterbalanced by the opposite mass displacements of the outer filaments 15 and 17.
This ensures that a high quality factor is provided and that the structure is relatively insensitive to transient noise s'ignals.
In use, subjection of the transducer structure has an acceleration having a component perpendicular to the plane of the structure causes a corresponding displacement of the seismic mass 13. This causes a change in tension within the filaments 15, 16 and 17 resulting in a change in resonant frequency that provides a measure of the magnitude of the accelerator.
It will be appreciated that, whilst oscillation of each filament at its fundemetal frequency is preferred, oscillation of the filaments at harmonic frequencies is also envisaged.
The transducer structure of Figs. 1 and 2 is of particular application to inertial navigation,'guidance systems, although it is not of course limited to this application. An inertial guidance system is shown schematically in Fig. 4 of the accompanying drawings.
Typically three transducer devices 41, 42, 43 are employed for sensing acceleration in three mutually perpendicular directions. The output of each transducer, comprising an oscillatory signal corresponding to acceleration in the respective direction, is fed to a central processor unit 44. Preferably each transducer output is amplified by a respective amplifier 45. In response to the input signals from the transducers, and from stored navigational information. The central processor unit 44 provides control signals to direction controls 46, 47 and 48 whereby guidance in the three mutually perpendicular directions may be affected.
The navigation/guidance system of Fig. 4 is compact, robust and of relatively low cost. It is thus particuarly suitable for use as a guidance system in airborne weapons. The system may also be employed in an aircraft.
It will be appreciated that although the transducer structure has been described with particular reference to its uses as an accelerometer, it is not limited to this application but may be used, for example, as a sensor of pressure or strain.

Claims (6)

1. A transducer, including an oscillatory structure whose natural resonant frequency is a function of a stress applied to the oscillatory structure, wherein the oscillatory structure includes three parallel resilient filaments, and wherein the transducer includes means for maintaining the filaments in a state of oscillation in a mode such that two of said filaments oscillate in phase with each other and in antiphase with the third filament, said oscillation being at a frequency corresponding to said stress.
2. A transducer, including a rigid laminar support structure having an opening within which a seismic mass is supported by a flexible hinge coupled to the support structure, first, second and third resilient parallel filaments coupled to the support structureand the seismic mass such that movement of the mass about the hinge causes a corresponding variation of tension in the filaments, and means for maintaining the filaments in a state of oscillation in a plane perpendicular to the support structure and in a mode such that two of said filaments oscillate in phase with each other and in antiphase with the third filament, said oscillation being at a frequency corresponding to the seismic mass relative to the support structure.
3. A transducer as claimed in claim 1 or 2, and comprising an integral structure formed from single crystal silicon.
4. A transducer as claimed in claims 1, 2 or 3, wherein the mass of said third filament is substantially equal to the sum of the masses of said two filaments.
5. A transducer substantially as described herein with reference to and as shown in Figs. 1 to 3 of the accompanyning drawings.
6. An inertial navigation/guidance system incorporating one or more transducers as claimed in any one of claims 1 to 5.
GB8803385A 1988-02-13 1988-02-13 Transducer device Expired - Fee Related GB2215053B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8803385A GB2215053B (en) 1988-02-13 1988-02-13 Transducer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8803385A GB2215053B (en) 1988-02-13 1988-02-13 Transducer device

Publications (3)

Publication Number Publication Date
GB8803385D0 GB8803385D0 (en) 1988-06-02
GB2215053A true GB2215053A (en) 1989-09-13
GB2215053B GB2215053B (en) 1991-09-11

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Family Applications (1)

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GB8803385A Expired - Fee Related GB2215053B (en) 1988-02-13 1988-02-13 Transducer device

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0506554A1 (en) * 1991-03-27 1992-09-30 Commissariat A L'energie Atomique Resonant pressure sensor
US5490420A (en) * 1991-05-24 1996-02-13 British Technology Group Ltd. Gyroscopic devices
WO1998053328A1 (en) * 1997-05-23 1998-11-26 Sextant Avionique Micro-accelerometer with capacitive resonator
DE4135624C2 (en) * 1990-10-29 2003-02-20 Litton Systems Inc Process for position control of a sensor component and sensor instrument based on force compensation with electrostatic charge control

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2121646A (en) * 1982-05-13 1983-12-21 Itt Ind Ltd Transducer
GB2122027A (en) * 1982-05-13 1984-01-04 Standard Telephones Cables Ltd >Semiconductor transducer and method of manufacture
EP0130705A2 (en) * 1983-06-07 1985-01-09 THE GENERAL ELECTRIC COMPANY, p.l.c. Beam structure for piezoelectric vibrating beam force or pressure sensors
EP0244086A2 (en) * 1986-04-26 1987-11-04 Stc Plc Resonator device
GB2194049A (en) * 1986-08-15 1988-02-24 Gen Electric Co Plc A photoacoustic measuring device
GB2194054A (en) * 1986-08-15 1988-02-24 Gen Electric Co Plc Magnetometer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2121646A (en) * 1982-05-13 1983-12-21 Itt Ind Ltd Transducer
GB2122027A (en) * 1982-05-13 1984-01-04 Standard Telephones Cables Ltd >Semiconductor transducer and method of manufacture
EP0130705A2 (en) * 1983-06-07 1985-01-09 THE GENERAL ELECTRIC COMPANY, p.l.c. Beam structure for piezoelectric vibrating beam force or pressure sensors
EP0244086A2 (en) * 1986-04-26 1987-11-04 Stc Plc Resonator device
GB2194049A (en) * 1986-08-15 1988-02-24 Gen Electric Co Plc A photoacoustic measuring device
GB2194054A (en) * 1986-08-15 1988-02-24 Gen Electric Co Plc Magnetometer

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4135624C2 (en) * 1990-10-29 2003-02-20 Litton Systems Inc Process for position control of a sensor component and sensor instrument based on force compensation with electrostatic charge control
EP0506554A1 (en) * 1991-03-27 1992-09-30 Commissariat A L'energie Atomique Resonant pressure sensor
FR2674627A1 (en) * 1991-03-27 1992-10-02 Commissariat Energie Atomique RESONANT PRESSURE SENSOR.
US5317917A (en) * 1991-03-27 1994-06-07 Commissariat A L'energie Atomique Resonant pressure transducer
US5490420A (en) * 1991-05-24 1996-02-13 British Technology Group Ltd. Gyroscopic devices
WO1998053328A1 (en) * 1997-05-23 1998-11-26 Sextant Avionique Micro-accelerometer with capacitive resonator
FR2763694A1 (en) * 1997-05-23 1998-11-27 Sextant Avionique CAPACITIVE RESONATOR MICRO-ACCELEROMETER
US6311556B1 (en) 1997-05-23 2001-11-06 Sextant Avionique Micro-accelerometer with capacitive resonator

Also Published As

Publication number Publication date
GB8803385D0 (en) 1988-06-02
GB2215053B (en) 1991-09-11

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PCNP Patent ceased through non-payment of renewal fee