GB2201042A - Heat sink assembly - Google Patents

Heat sink assembly Download PDF

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Publication number
GB2201042A
GB2201042A GB08800384A GB8800384A GB2201042A GB 2201042 A GB2201042 A GB 2201042A GB 08800384 A GB08800384 A GB 08800384A GB 8800384 A GB8800384 A GB 8800384A GB 2201042 A GB2201042 A GB 2201042A
Authority
GB
United Kingdom
Prior art keywords
heat sink
kit
connector
heat sinks
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08800384A
Other versions
GB2201042B (en
GB8800384D0 (en
Inventor
Christopher Henry George Myers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marston Palmer Ltd
Original Assignee
Marston Palmer Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marston Palmer Ltd filed Critical Marston Palmer Ltd
Publication of GB8800384D0 publication Critical patent/GB8800384D0/en
Publication of GB2201042A publication Critical patent/GB2201042A/en
Application granted granted Critical
Publication of GB2201042B publication Critical patent/GB2201042B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink assembly comprises a pair of extruded heat sinks (1, 2) each having fins and a re-entrant slot (6, 7), and a connector (5) having respective portions (12, 13) adapted to engage in the slots. <IMAGE>

Description

Heat Sink Assembly This invention relates to heat sinks and has particular reference to joining heat sinks together.
Extruded heat sinks are well known. The heat sinks essentially comprise a planar base with a series of projecting fins along which air is free to pass to remove heat normally generated by an electronic component. Such heat sinks are sometimes attached to the rear top or sides of electronic apparatus and in some cases they are required to have aesthetic qualities as well as functional qualities.
In some cases there is a need to locate the maximum quantity of heat sink surface on an electronic component system box and this has led to the need to slice and/or join existing heat sinks which can cause inconvenience and result in a costly and unsightly assembly.
By the present invention there is provided a kit of parts for a heat sink assembly comprising a pair of extruded heat sinks, each heat sink having a base and fins extending away from the base, each heat sink having a re-entrant slot on one side at least of the heat sink, there being provided a connector adapted to engage each re-entrant slot of two adjacent heat sinks to form an interconnection therebetween.
The extruded heat sinks may be made of aluminium or an aluminium alloy. The re-entrant slot may be provided on the side of the heat sink or may be provided on the underside of the heat sink or may be provided on the top of the heat sink. The re-entrant slot may be provided on a raised portion of the inside of the heat sink.
The connector may be provided with no fins, or one or more fins. The connector may be of generally U-shape, having a base of the same thickness as that of the main heat sinks, and may be of sufficient width to accept various typical electronic devices on its upper surface. Each leg of the U may be provided with a male portion adapted to engage a re-entrant slot in the side of a heat sink.
By way of example embodiments of the present invention will now be described with reference to the accompanying drawings, of which: Figure 1 is a cross-section of one form of connector with two edges of adjacent heat sinks; and Figures 2 and 3 are cross-sections of alternative forms of-connector with two edges of adjacent heat sinks.
Referring to Figure 1 this shows a pair of heat sinks 1, 2 which are shown with their right hand edge 3 and their left hand edge 4 interconnected by means of a connector 5. The right hand edge of heat sink 1 has a re-entrant slot 6 and the left hand edge of heat sink 2 has a re-entrant slot 7. The connector 5 is of generally U-shape with a base 8 and a central fin 9. Each leg 10 and 11 of the U-shaped connector has a male portion 12, 13 which is slid into the re-entrant slots 6 and 7.
It will be appreciated that the fin 9 may be dispensed with if required and electronic devices may then be mounted on the connector.
The connector illustrated in Figure 1 enables a firm connection to be made between the two heat sinks 1 and 2 so that modular sized heat sinks can be made up to any required width. The connector enhances the aesthetics of an assembly of adjacent heat sinks, adds rigidity to the assembly by making a firm interconnection therebetween and increases the thermalperformance of the heat sinks by increasing their effective surface area.
In the design illustrated in Figures 2 and Figure 3 the aesthetic appearance of the interconnected heat sink is even further increased. In this arrangement heat sink members 14 and 15 are interconnected by a connector 16 which slots into re-entrant slots 17 and 18 located on the inside of the heat sinks 14 and 15. With such an arrangement, therefore, the upper surface of the heat sink merely appears to have a continuous run of fins.
It will be appreciated that any desired form of connector could be used and that the detailed forms shown in Figures 1, 2 and 3 are by way of example only.

Claims (10)

CLAIMS:
1. A kit of parts for a heat sink assembly comprising a pair of extruded heat sinks, each heat sink having a base and fins extending away from the base, each heat sink having a re-entrant slot on one side at least of the heat sink, there being provided a connector adapted to engage each re-entrant slot of two adjacent heat sinks to form an interconnection therebetween.
2. A kit as claimed in Claim 1 in which the extruded heat sinks are formed of aluminium or an aluminium alloy.
3. A kit as claimed in Claim 1 or 2 in which the re-entrant slot is provided on the side of the heat sink.
4. A kit as claimed in Claim 1 or 2 in which the re-entrant slot is provided on the underside of the heat sink.
5. A kit as claimed in Claim 1 or 2 in which the slot is provided on the top of the heat sink.
6. A kit as claimed in any one of Claims 1 or 2 in which the re-entrant slot is provided on a raised portion of the inside of the heat sink.
7. A kit as claimed in any one of Claims 1-6 in which the connector is provided with fins.
8. A kit as claimed in any one of Claims 1-7 in which the connector is generally of 'U' shape having a base of the same thickness as that of the main heat sinks and is of sufficient width to accept electronic devices on. its upper surface.
9. A kit as claimed in Claim 8 in which each leg of the 'U' is provided with a male portion adapted to engage a re-entrant slot in the side of a heat sink.
10. A kit of parts for a heat sink assembly substantially as herein described with reference to Figure 1, 2 or 3 of the accompanying drawings.
GB8800384A 1987-01-15 1988-01-08 Heat sink assembly Expired - Fee Related GB2201042B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB878700844A GB8700844D0 (en) 1987-01-15 1987-01-15 Heat sink assembly

Publications (3)

Publication Number Publication Date
GB8800384D0 GB8800384D0 (en) 1988-02-10
GB2201042A true GB2201042A (en) 1988-08-17
GB2201042B GB2201042B (en) 1991-01-09

Family

ID=10610710

Family Applications (2)

Application Number Title Priority Date Filing Date
GB878700844A Pending GB8700844D0 (en) 1987-01-15 1987-01-15 Heat sink assembly
GB8800384A Expired - Fee Related GB2201042B (en) 1987-01-15 1988-01-08 Heat sink assembly

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB878700844A Pending GB8700844D0 (en) 1987-01-15 1987-01-15 Heat sink assembly

Country Status (1)

Country Link
GB (2) GB8700844D0 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4406564A1 (en) * 1994-03-01 1995-09-07 Hans Juergen Karl Kiesling Car audio amplifier with accessory cooling body
DE10009398A1 (en) * 2000-02-28 2001-09-06 Epcos Ag Plate-shaped heat-sink module for capacitor, comprises edge structures that allow coupling to similar modules in defined orientation
DE10152475A1 (en) * 2001-10-24 2003-05-08 Hella Kg Hueck & Co Heat conducting connecting piece has protrusions on surfaces of parts butting onto insulating film corresponding to apertures of other part
US20110226458A1 (en) * 2008-04-28 2011-09-22 Eran Plonski Modular heat sink and method for fabricating same
DE102010029085A1 (en) * 2010-05-18 2011-11-24 Behr Gmbh & Co. Kg Cooling device and method of manufacturing a cooling device
US8425071B2 (en) 2006-09-30 2013-04-23 Cree, Inc. LED lighting fixture
DE102011085982A1 (en) * 2011-11-09 2013-05-16 Hüttinger Elektronik Gmbh + Co. Kg Heatsink system for an electrical device
WO2013163794A1 (en) * 2012-05-02 2013-11-07 Chen Shaofan Heat sink
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US9541246B2 (en) 2006-09-30 2017-01-10 Cree, Inc. Aerodynamic LED light fixture

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7952262B2 (en) 2006-09-30 2011-05-31 Ruud Lighting, Inc. Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules
CN105436750B (en) * 2015-11-20 2017-04-12 江苏晶中电子有限公司 Welding machine silicon controlled rectifier bridge cooling device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3793570A (en) * 1968-09-26 1974-02-19 Gen Motors Corp Compact power semiconductor device and method of making same
GB2047473A (en) * 1979-04-19 1980-11-26 Aei Semiconductors Ltd Improvements in or relating to mounting assemblies for electrical components

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3793570A (en) * 1968-09-26 1974-02-19 Gen Motors Corp Compact power semiconductor device and method of making same
GB2047473A (en) * 1979-04-19 1980-11-26 Aei Semiconductors Ltd Improvements in or relating to mounting assemblies for electrical components

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4406564A1 (en) * 1994-03-01 1995-09-07 Hans Juergen Karl Kiesling Car audio amplifier with accessory cooling body
DE10009398A1 (en) * 2000-02-28 2001-09-06 Epcos Ag Plate-shaped heat-sink module for capacitor, comprises edge structures that allow coupling to similar modules in defined orientation
DE10009398C2 (en) * 2000-02-28 2002-03-14 Epcos Ag Heatsink module and arrangement of heatsink modules
US6708757B2 (en) 2000-02-28 2004-03-23 Epcos Ag Heat sink module and an arrangment of heat sink modules
DE10152475A1 (en) * 2001-10-24 2003-05-08 Hella Kg Hueck & Co Heat conducting connecting piece has protrusions on surfaces of parts butting onto insulating film corresponding to apertures of other part
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US8425071B2 (en) 2006-09-30 2013-04-23 Cree, Inc. LED lighting fixture
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US9039223B2 (en) 2006-09-30 2015-05-26 Cree, Inc. LED lighting fixture
US9261270B2 (en) 2006-09-30 2016-02-16 Cree, Inc. LED lighting fixture
US9534775B2 (en) 2006-09-30 2017-01-03 Cree, Inc. LED light fixture
US9541246B2 (en) 2006-09-30 2017-01-10 Cree, Inc. Aerodynamic LED light fixture
US20110226458A1 (en) * 2008-04-28 2011-09-22 Eran Plonski Modular heat sink and method for fabricating same
DE102010029085A1 (en) * 2010-05-18 2011-11-24 Behr Gmbh & Co. Kg Cooling device and method of manufacturing a cooling device
DE102011085982A1 (en) * 2011-11-09 2013-05-16 Hüttinger Elektronik Gmbh + Co. Kg Heatsink system for an electrical device
DE102011085982B4 (en) 2011-11-09 2023-06-15 TRUMPF Hüttinger GmbH + Co. KG Heat sink system for an electrical device
WO2013163794A1 (en) * 2012-05-02 2013-11-07 Chen Shaofan Heat sink

Also Published As

Publication number Publication date
GB2201042B (en) 1991-01-09
GB8700844D0 (en) 1987-02-18
GB8800384D0 (en) 1988-02-10

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20010108