GB2194341A - Capacitive acceleration sensors - Google Patents
Capacitive acceleration sensors Download PDFInfo
- Publication number
- GB2194341A GB2194341A GB08716443A GB8716443A GB2194341A GB 2194341 A GB2194341 A GB 2194341A GB 08716443 A GB08716443 A GB 08716443A GB 8716443 A GB8716443 A GB 8716443A GB 2194341 A GB2194341 A GB 2194341A
- Authority
- GB
- United Kingdom
- Prior art keywords
- acceleration
- plate
- acceleration sensor
- frame
- cover plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
A capacitive acceleration sensor, which is produced with micromechanical production technology and etching technique, has a preferably rectangular acceleration plate (2) suspended centrally in the interior of the acceleration sensor (1) and having an even number of bending bands (3, 15) arranged symmetrically with respect to the centre plane between the upper and lower side of the acceleration plate. The acceleration plate (2) itself or conductors applied to its surfaces form one of the capacitor electrodes of two plate capacitors. The counter-electrodes (7) for this purpose are arranged on opposite surfaces of cover plates (5) separated from the acceleration plate (2) by respective gaps (6). Preferably the acceleration plate (2), the bending bands (3) and a frame (4) are worked-out monolithically from a monocrystalline substrate of silicon. <IMAGE>
Description
SPECIFICATION
Capacitive acceleration sensors
This invention relates to capacitive acceleration sensors.
Such an acceleration sensor is known as a result of DE-OS 32 23 987. This has a flap which is fastened to a carrier by way of two torsion holders which are arranged symmetrically and in extension of one edge of the flap.
An electrode which is applied to a plate present underneath the flap makes it possible to measure the acceleration by measuring the corresponding change in the capacitance between the flap and the electrode. Such a sensor produces a capacitance change which is a relatively complicated function of the acceleration, because the air gap between the flap and the electrode changes only in wedge-shaped manner. Furthermore, in the case of this torsion suspension, relatively great transverse sensitivities are to be expected. As a result of the arrangement of the flap being unsymmetrical in the vertical direction, also no adequate overload protection of the sensor exists.
The problem underlying the invention is, in the case of an acceleration sensor of the kind mentioned at the beginning hereof, to improve the transverse sensitivity and the overload protection.
This problem is solved, in accordance with the invention, by the provision of a capacitive acceleration sensor, which is produced with micromechanical production technology and etching technique, characterised in that an acceleration plate, having an even number of bending bands arranged symmetrically with respect to the central plane between the upper and lower side of the acceleration plate, is suspended centrally-in the interior of the acceleration sensor, in which respect either the acceleration plate itself, or conductors applied to its surfaces, form one of the capacitor electrodes of two plate capacitors, counter-electrodes of which are applied to opposite surfaces which are separated by gaps from the acceleration plate.
As a result of the arrangement of the acceleration plate suspended centrally from bending bands, the acceleration sensor in accordance with the invention has a high sensitivity which is not achieved by known sensors, even by piezoresistive sensors. There is achieved capacitance changes which rise approximately uniformly and which correspond to the applied accelerations, in which respect a high degree of overload protection is achievable and thus the possibility of a short-circuit-is reduced.
The fully symmetrical construction of the structure guarantees a very accurately defined zero-point position. Moreover, as a result of the two-sided suspension with four, preferably eight, bending bands, the transverse sensitivity is extremely low. The two-sided arrangement of the rigid cover plates with the counter-electrodes ensures a high degree of electrical safety.
The invention will be described further, by way of example, with reference to the accompanying drawings, in which:
Fig. 1 is a cross-section through a first preferred embodiment of the acceleration sensor of the invention;
Fig. 2 is a perspective plan view of the acceleration sensor shown in Fig. 1 with its upper cover plate omitted in accordance with the arrows Il-lI; Fig. 3 is a view comparable with that of Fig.
1 but of a second preferred embodiment of the acceleration sensor of the invention; and
Fig. 4 is a view comparable with that of
Figs. 1 and 3 but of a third preferred embodiment of the acceleration sensor of the invention.
Referring now in detail to the drawings, the first preferred embodiment of the acceleration sensor 1 shown in Figs. 1 and 2 comprises a central acceleration plate 2, which is suspended by means of an even number of bending bands 3, preferably eight bending bands, from a frame 4. The bending bands 3 extend from the corners of the upper and lower side of the acceleration plate 2 to the frame 4 which is arranged at a spacing around the acceleration plate 2. Present above and below the acceleration plate 2 and the frame 4, which are the same thickness, are cover plates 5, which in each case rest on the frame 4. In the cover plates 5 opposite the acceleration plate 2 and the bending bands 3 are respective depressions 6, into each of which depressions 6 is applied a metal film 7.
If the acceleration plate 2, the bending bands 3 and the frame 4 are worked-out monolithically from a monocrystalline silicon, the surfaces of the acceleration plate 2 can serve as one of the electrodes and the metallic films 7 in the cover plates 5 can serve as the other electrodes of two plate capacitors with the depressions 6 as gaps between the electrodes. Upon the effecting of accelerations, the electrodes form variable capacitances, which serve for the measurement of the acceleration. The decrease in the changing or alternating current changes by changes in the gaps 6 upon different accelerations is effected in known manner for example by a power or lead strip 8 connected to the acceleration plate 2 (see Fig. 2) and power or lead strips 9 conducted out from the metallic films 6 between the cover plates 5 and the frame (see
Fig. 1).Two possibilities are available for damping the sensor 1. Firstly, the inner space formed by the gaps 6 and free spaces 11 around the acceleration plate 2 can be evacuated, save for a defined residual pressure, through a duct 12 worked into the upper cover plate 5. The second possibility consists in leaving the duct 12 open as an air duct.
To produce the first preferred embodiment, in which the acceleration plate 2, the bending beams 3 and the frame 4 are worked monolithically out of a monocrystalline substrate.
Silicon with low doping and a crystal orientation (100) is used for the substrate. The bending beams 3, which may not lie parallel to a (111) crystal plane, have to be provided with a high edge doping ( > 7 x 10'9 cm-3), so that they are made etching-resistant for the subsequent structuring process. This can be achieved by means of an appropriately doped epitaxy layer, or respectively with ion implantation or diffusion. After that, the contours of the etching pit are lithographically defined and gnisotropically etched. Into the cover plates 5, which preferably consist of glass, the depressions 6 are likewise etched out and subsequently thereto the metallic films 7 and lead strips 9 are deposited by evaporation.Finally, the cover plates 5 are connected to the frame 4 with the aid of an anodic connection technique by applying an electrical voltage at increased temperature.
In the second preferred embodiment, shown in Fig. 3 of an acceleration sensor la, instead of the bending bands 3 worked out of the uniform substrate, separate bending strips 15 are present, which are inserted between the cover plates 5 and the acceleration plate 2.
The bending strips ' 1 5 can, as shown here, consist of a dielectric coated with a metal film
16, for example of Si3N4or SiO2. Furthermore, the bending strips 15 can be directly deposited by evaporation or applied directly from a metal film or respectively a metal foil. This arrangement has the advantage that the bending strips 15 serving as central capacitor electrodes or respectively the metal films 16 can be isolated dielectrically vis-a-vis the frame 4.
In the third preferred embodiment of an acceleration sensor 1b shown in Fig. 4, the acceleration plate 2 and the bending bands 3 are thinner, by the width of the gaps 6, than the frame 4. This reduced thickness can be worked out without difficulty upon the production from a uniform substrate. This arrangement has the advantage that the cover plates 5 do not have to be separately worked.
All three embodiments of the acceleration sensor 1, 1 a and 1 b can be used directly as capacitive signal transmitters, in which respect upon the effecting of accelerations two oppo
sitely changing capacitances are available, which can be wired in a suitable bridge ar
rangement. Furthermore, the two measuring capacitances can be supplemented by two rigid capacitances, which make possible, between frame 4 and the cover plates 5, a temperature compensation of the measuring capacitances.
Another possibility of the signal evaluation consists in the electrical fettering or impe
dance of the acceleration plate 2, in which
respect this can be kept in its zero position by application of a counter-voltage. In this respect, the counter-voltage occurring upon an acceleration is measured. With this arrangement, resonance effects can be compensated out.
The embodiments shown in the figures represent the most customary kind of the acceleration sensor in accordance with the invention. It also lies within the scope of the invention to arrange at least two bending bands, which connect in the centre of a longitudinal side the upper and lower sides of the acceleration plate and of the frame. A further embodiment which is usable in practice comprises four bending bands arranged in mirrorinverted manner at only one longitudinal side of the acceleration plate, and connecting the longitudinal side to the upper and lower side of the frame. This embodiment is suitable for particularly sensitive measurements, for example for measuring the inclination of an object relative to the gravitational field of the earth.
Claims (14)
1. A capacitive acceleration sensor, which is produced with micromechanical production technology and etching technique, characterized in that an acceleration plate, having an even number of bending bands arranged symmetrically with respect to the central plane between the upper and lower side of the acceleration plate, is suspended centrally in the interior of the acceleration sensor, in which respect either the acceleration plate itself, or conductors applied to its surfaces, form one of the capacitor electrodes of two plate capacitors, counter-electrodes of which are applied to opposite surfaces which are separated by gaps from the acceleration plate.
2. An acceleration sensor as claimed in claim 1, characterized in that the acceleration plate, a frame surrounding it and the bending bands are covered on both sides, whilst leaving the gaps free, by cover plates to whose surfaces facing the acceleration plate the counterelectrodes are applied.
3. An acceleration sensor as claimed in claims 1 and 2, characterized in that the acceleration plate, the bending bands and the frame are worked monolithically from a mono
crystalline substrate.
4. An acceleration sensor as claimed in
claims 1 and 2, characterized in that only the acceleration plate and the frame consist of a
monocrystalline substrate, and in that separate
bending strips are inserted between the acceleration plate and the cover plates.
5. An acceleration sensor as claimed in
claim 4, characterized in that the bending
strips consist of a dielectric which is provided
with a metal layer.
6. An acceleration sensor as claimed in
claim 4, characterized in that the bending
strips consist of a metal foil.
7. An acceleration sensor as claimed in one or more of claims 1 to 6, characterized in that the gaps between the acceleration plate with the bending bands and the cover plates are produced by etching-in of the cover plates.
8. An acceleration sensor as claimed in any one of claims 1 to 6, characterized in that the gaps between the acceleration plate with the bending bands and the cover plates are formed by a reduced thickness, of the acceleration plate opposite the frame.
9. An acceleration sensor as claimed in one or more of claims 1 to 8, characterized in that the gaps and free spaces between the acceleration plate, the cover plates and the frame are evacuated save for a defined residual pressure.
10. An acceleration sensor as claimed in one or more of claims 1 to 8, characterized in that from the gaps and the free spaces between the acceleration plate, the cover plates and the frame an air duct leads through one of the cover plates.
11. An acceleration sensor as claimed in any one of claims 1 to 10, characterized by four bending bands arranged in mirror-inverted manner on only one longitudinal side of the acceleration plate and connecting the longitudinal side to the upper and lower side of the frame.
12. An acceleration sensor as claimed in any one of claims 1 to 10, characterized by eight bending bands which are arranged in mirror-symmetrical manner at the corners of the acceleration plate and connect its upper and lower side to the frame.
13. Arí acceleration sensor as claimed in any of claims 1 to 10 wherein the acceleration plate is rectangular or square.
14. A capacitive acceleration sensor substantially as hereinbefore described with reference to and as illustrated in Figs. 1 and 2, or in Fig. 3, or in Fig. 4 of the accompanying drawings.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19863625411 DE3625411A1 (en) | 1986-07-26 | 1986-07-26 | CAPACITIVE ACCELERATION SENSOR |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8716443D0 GB8716443D0 (en) | 1987-08-19 |
GB2194341A true GB2194341A (en) | 1988-03-02 |
GB2194341B GB2194341B (en) | 1990-05-23 |
Family
ID=6306096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8716443A Expired - Lifetime GB2194341B (en) | 1986-07-26 | 1987-07-13 | Capacitive acceleration sensors |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH673897A5 (en) |
DE (1) | DE3625411A1 (en) |
FR (1) | FR2602055B1 (en) |
GB (1) | GB2194341B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2212274A (en) * | 1987-11-09 | 1989-07-19 | Vaisala Oy | Capacitive accelerometer and its fabrication method |
GB2232489A (en) * | 1989-06-05 | 1990-12-12 | Motorola Inc | Silicon acceleration sensor |
EP0459939A1 (en) * | 1990-05-30 | 1991-12-04 | Copal Company Limited | Capacitive acceleration sensor with free diaphragm |
US5115291A (en) * | 1989-07-27 | 1992-05-19 | Honeywell Inc. | Electrostatic silicon accelerometer |
EP2053413A1 (en) * | 2006-11-14 | 2009-04-29 | Panasonic Corporation | Sensor |
WO2010101023A1 (en) * | 2009-03-04 | 2010-09-10 | コニカミノルタホールディングス株式会社 | Parallel displacement mechanism and method for manufacturing parallel displacement mechanism |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3742385A1 (en) * | 1987-12-14 | 1989-06-22 | Siemens Ag | Acceleration-sensitive electronic component |
US4825335A (en) * | 1988-03-14 | 1989-04-25 | Endevco Corporation | Differential capacitive transducer and method of making |
JPH0623782B2 (en) * | 1988-11-15 | 1994-03-30 | 株式会社日立製作所 | Capacitance type acceleration sensor and semiconductor pressure sensor |
US4928203A (en) * | 1989-02-28 | 1990-05-22 | United Technologies | Capacitive accelerometer with hinges on top and bottom surface |
US4930043A (en) * | 1989-02-28 | 1990-05-29 | United Technologies | Closed-loop capacitive accelerometer with spring constraint |
US5008774A (en) * | 1989-02-28 | 1991-04-16 | United Technologies Corporation | Capacitive accelerometer with mid-plane proof mass |
US4930042A (en) * | 1989-02-28 | 1990-05-29 | United Technologies | Capacitive accelerometer with separable damping and sensitivity |
DD282530A5 (en) * | 1989-04-24 | 1990-09-12 | Karl Marx Stadt Tech Hochschul | CAPACITIVE MICROMECHANICAL ACCELERATION SENSOR |
DE3922476A1 (en) * | 1989-07-06 | 1991-01-17 | Siemens Ag | CAPACITIVE MICROMECHANICAL ACCELERATION SENSOR |
US5006487A (en) * | 1989-07-27 | 1991-04-09 | Honeywell Inc. | Method of making an electrostatic silicon accelerometer |
US5295386A (en) | 1989-12-28 | 1994-03-22 | Kazuhiro Okada | Apparatus for detecting acceleration and method for testing this apparatus |
US6864677B1 (en) | 1993-12-15 | 2005-03-08 | Kazuhiro Okada | Method of testing a sensor |
DE4016471A1 (en) * | 1990-05-22 | 1991-11-28 | Bosch Gmbh Robert | MICROMECHANICAL INCLINATION SENSOR |
US5233213A (en) * | 1990-07-14 | 1993-08-03 | Robert Bosch Gmbh | Silicon-mass angular acceleration sensor |
DE4022495A1 (en) * | 1990-07-14 | 1992-01-23 | Bosch Gmbh Robert | MICROMECHANICAL SPEED SENSOR |
DE4102805A1 (en) * | 1991-01-31 | 1992-08-13 | Bosch Gmbh Robert | CAPACITIVE ACCELERATION SENSOR |
DE9205416U1 (en) * | 1992-04-21 | 1993-05-19 | Kampfrath, Gerit, Dr. | Dynamic acceleration sensor |
DE4226430C2 (en) * | 1992-08-10 | 1996-02-22 | Karlsruhe Forschzent | Capacitive acceleration sensor |
US5824901A (en) * | 1993-08-09 | 1998-10-20 | Leica Geosystems Ag | Capacitive sensor for measuring accelerations and inclinations |
DE4326666C1 (en) * | 1993-08-09 | 1995-02-23 | Wild Heerbrugg Ag | Capacitive sensor |
DE4406342C1 (en) * | 1994-02-26 | 1995-03-09 | Kernforschungsz Karlsruhe | Sensor and method for producing it |
US6602216B1 (en) * | 1998-05-18 | 2003-08-05 | William E. Nordt, III | Plantar fascia tension device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1163209A (en) * | 1966-09-09 | 1969-09-04 | Litton Industries Inc | Accelerometer |
EP0059488A1 (en) * | 1978-07-21 | 1982-09-08 | Hitachi, Ltd. | Capacitive pressure sensor |
GB2102579A (en) * | 1981-07-14 | 1983-02-02 | Sundstrand Data Control | Force transducer flexure reed bearing electrical connections |
GB2156523A (en) * | 1984-03-19 | 1985-10-09 | Draper Lab Charles S | Planar inertial sensor |
GB2158945A (en) * | 1984-05-18 | 1985-11-20 | Becton Dickinson Co | Capacitive transducer |
GB2178856A (en) * | 1985-07-25 | 1987-02-18 | Litton Systems Inc | Integrated, force balanced accelerometer |
GB2186085A (en) * | 1986-02-04 | 1987-08-05 | Draper Lab Charles S | Vibratory digital integrating accelerometer |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3709042A (en) * | 1969-05-14 | 1973-01-09 | S Lee | Capacitance accelerometer |
US4244225A (en) * | 1979-06-08 | 1981-01-13 | Itt Industries, Inc. | Mechanical resonator arrangements |
SE436936B (en) * | 1981-01-29 | 1985-01-28 | Asea Ab | INTEGRATED CAPACITY SENSOR |
CH642461A5 (en) * | 1981-07-02 | 1984-04-13 | Centre Electron Horloger | ACCELEROMETER. |
-
1986
- 1986-07-26 DE DE19863625411 patent/DE3625411A1/en active Granted
-
1987
- 1987-06-18 CH CH229987A patent/CH673897A5/de not_active IP Right Cessation
- 1987-07-13 GB GB8716443A patent/GB2194341B/en not_active Expired - Lifetime
- 1987-07-24 FR FR8710556A patent/FR2602055B1/en not_active Expired
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1163209A (en) * | 1966-09-09 | 1969-09-04 | Litton Industries Inc | Accelerometer |
EP0059488A1 (en) * | 1978-07-21 | 1982-09-08 | Hitachi, Ltd. | Capacitive pressure sensor |
GB2102579A (en) * | 1981-07-14 | 1983-02-02 | Sundstrand Data Control | Force transducer flexure reed bearing electrical connections |
GB2156523A (en) * | 1984-03-19 | 1985-10-09 | Draper Lab Charles S | Planar inertial sensor |
GB2158945A (en) * | 1984-05-18 | 1985-11-20 | Becton Dickinson Co | Capacitive transducer |
GB2178856A (en) * | 1985-07-25 | 1987-02-18 | Litton Systems Inc | Integrated, force balanced accelerometer |
GB2186085A (en) * | 1986-02-04 | 1987-08-05 | Draper Lab Charles S | Vibratory digital integrating accelerometer |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2212274A (en) * | 1987-11-09 | 1989-07-19 | Vaisala Oy | Capacitive accelerometer and its fabrication method |
GB2232489A (en) * | 1989-06-05 | 1990-12-12 | Motorola Inc | Silicon acceleration sensor |
GB2232489B (en) * | 1989-06-05 | 1993-11-03 | Motorola Inc | Double-integrating silicon acceleration sensing device |
US5115291A (en) * | 1989-07-27 | 1992-05-19 | Honeywell Inc. | Electrostatic silicon accelerometer |
EP0459939A1 (en) * | 1990-05-30 | 1991-12-04 | Copal Company Limited | Capacitive acceleration sensor with free diaphragm |
US5253526A (en) * | 1990-05-30 | 1993-10-19 | Copal Company Limited | Capacitive acceleration sensor with free diaphragm |
EP2053413A1 (en) * | 2006-11-14 | 2009-04-29 | Panasonic Corporation | Sensor |
EP2053413A4 (en) * | 2006-11-14 | 2011-11-16 | Panasonic Corp | Sensor |
US8201449B2 (en) | 2006-11-14 | 2012-06-19 | Panasonic Corporation | Sensor |
WO2010101023A1 (en) * | 2009-03-04 | 2010-09-10 | コニカミノルタホールディングス株式会社 | Parallel displacement mechanism and method for manufacturing parallel displacement mechanism |
Also Published As
Publication number | Publication date |
---|---|
DE3625411A1 (en) | 1988-02-04 |
GB8716443D0 (en) | 1987-08-19 |
FR2602055A1 (en) | 1988-01-29 |
FR2602055B1 (en) | 1989-12-22 |
DE3625411C2 (en) | 1988-05-11 |
CH673897A5 (en) | 1990-04-12 |
GB2194341B (en) | 1990-05-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PE20 | Patent expired after termination of 20 years |
Effective date: 20070712 |