GB2191142B - Self-cleaning mold and method - Google Patents
Self-cleaning mold and methodInfo
- Publication number
- GB2191142B GB2191142B GB8709466A GB8709466A GB2191142B GB 2191142 B GB2191142 B GB 2191142B GB 8709466 A GB8709466 A GB 8709466A GB 8709466 A GB8709466 A GB 8709466A GB 2191142 B GB2191142 B GB 2191142B
- Authority
- GB
- United Kingdom
- Prior art keywords
- self
- cleaning mold
- mold
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004140 cleaning Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2608—Mould seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86964386A | 1986-06-02 | 1986-06-02 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8709466D0 GB8709466D0 (en) | 1987-05-28 |
GB2191142A GB2191142A (en) | 1987-12-09 |
GB2191142B true GB2191142B (en) | 1989-12-13 |
Family
ID=25353985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8709466A Expired GB2191142B (en) | 1986-06-02 | 1987-04-22 | Self-cleaning mold and method |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR950005709B1 (en) |
GB (1) | GB2191142B (en) |
HK (1) | HK26492A (en) |
SG (1) | SG19692G (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5478517A (en) * | 1994-02-28 | 1995-12-26 | Gennum Corporation | Method for molding IC chips |
-
1987
- 1987-04-22 GB GB8709466A patent/GB2191142B/en not_active Expired
- 1987-06-02 KR KR87005559A patent/KR950005709B1/en not_active IP Right Cessation
-
1992
- 1992-02-29 SG SG19692A patent/SG19692G/en unknown
- 1992-04-09 HK HK26492A patent/HK26492A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR950005709B1 (en) | 1995-05-29 |
GB2191142A (en) | 1987-12-09 |
GB8709466D0 (en) | 1987-05-28 |
SG19692G (en) | 1992-04-16 |
HK26492A (en) | 1992-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19960422 |