GB2188483A - Heat sink fastener - Google Patents
Heat sink fastener Download PDFInfo
- Publication number
- GB2188483A GB2188483A GB8705109A GB8705109A GB2188483A GB 2188483 A GB2188483 A GB 2188483A GB 8705109 A GB8705109 A GB 8705109A GB 8705109 A GB8705109 A GB 8705109A GB 2188483 A GB2188483 A GB 2188483A
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat sink
- fastener
- circuit board
- electronic device
- device package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A fastener for mounting a heat sink (12) and an electronic device package (14) to a circuit board (58) includes at least one mounting member (60) extending to the circuit board and adapted for soldering thereon. The mounting member (60) spaces the fastener (10), heat sink (12) and electronic device package (14) above the surface of the circuit board (58). The fastener further includes attachment means (44) for gripping the heat sink and attaching it to the fastener. Screws (88) fix the package to the heat sink and the fastener above the surface of the circuit board. <IMAGE>
Description
SPECIFICATION
Heat sink fastener
This invention relates to a fastener for mounting a heat sink or the like to a circuit board.
All electronic device packages, such as transistors, resistors, diodes or the like, inherently produce heat as a by-product of transmission of electric current therethrough. This heat is then dissipated into the surrounding environment while the electronic device is in use.
Heat sinks may be placed in contact with the electronic device packages to facilitate the dissipation of heat. For the purposes of this application, a heat sink is any article adapted to transfer heat to the atmosphere at a high rate through radiation and/or convection. Generally, heat sinks are constructed from a metal, such as aluminum, having high thermal conduction characteristics and are mounted on the printed circuit board, each in contact with one or more of the heat dissipating electronic device packages. Heat produced by the electronic device package is transferred to the heat sink by conduction and is rapidly dissipated by the heat sink to the atmosphere.
Frequently, the heat sink is surface treated, such as by anodization, which protects the heat sink from corrosion and enhances the heat dissipating characteristics of the heat sink. However, the surface treatment makes it difficult to attach the heat sink directly to a circuit board by soldering. For this reason, and also due to the relatively large size and weight of heat sinks compared to the other components soldered to the circuit board, heat sinks are commonly mechanically mounted on the printed circuit board and an electronic device package mounted on the heat sink in order to conserve surface area on the circuit board.
Alternatively, the electronic device package is sometimes mounted directly on the circuit board and thermally connected to an adjacent heat sink.
Existing designs for mechanically mounting heat sinks to a circuit board utilize standoffs, such as threaded studs, nuts having a threaded cavity, tabs or pins, that are attachable to the heat sink and solderable into preformed holes in circuit boards. Usually two or more standoffs are required to mount the heat sink on the circuit board. In many instances, it is desirable to preassemble the standoffs to the heat sink prior to mounting on the circuit board. Alternatively, the standoffs may be soldered to the circuit board along with other components, and then attached to the heat sink. However, in any case the alignment of the heat sink with the multiple standoffs and with the circuit board is labor intensive and therefore costly.This is particularly true when an electronic device package is mounted on the heat sink and the leads extending from the electronic device package must be simultaneously aligned with and inserted into holes in the circuit board. Also, conventional standoffs are expensive to manufacture compared to the overall cost of the heat sink.
In those applications in which it is also desirable to secure an electronic device package to the heat sink, the electronic device package is sometimes provided with one or more mounting holes and a like number of mounting holes are formed on the heat sink on which the electronic device package is to be mounted. After the electronic device package is positioned on the heat sink and their respective mounting holes aligned, screws or the like are passed through each of the sets of aligned holes and secured by nuts. This process is likewise slow and labor intensive, and therefore costly. The use of separate structures for mounting the heat sink on the circuit board and for securing an electronic device package to the heat sink is also inherently inefficient.
The present invention provides an improved fastener for mounting a heat sink on a circuit board or the like. In one embodiment, the fastener includes a unitary, elongated body.
Means are provided to mount the fastener on a circuit board by simultaneously soldering the fastener on the circuit board at one or more locations. The mounting means of the fastener includes one or more downwardly extending mounting members adapted for insertion and soldering into aligned preformed holes in the circuit board.
The fastener body includes means for attaching the fastener to the heat sink. In one embodiment of the invention, the attachment means comprises a pair of longitudinally spaced clips. The heat sink and fastener may be forced together with the clips engaging opposite ends of the heat sink. The attachment clips enable the heat sink and fastener to be preassembled to each other prior to mounting the fastener on the circuit board, or alternatively, the fastener may be mounted on the circuit board and the heat sink attached to the fastener by the attachment clips.
The fastener body may also include securing means for securing an electronic device package to the heat sink. The securing means may comprise one or more threaded apertures formed in the fastener body and each aligned with one set of the mounting holes on the heat sink and electronic device package.
These apertures on the fastener are adapted to threadedly engage screws inserted through the aligned mounting holes to secure the electronic device package to the heat sink.
In other embodiments of the invention, multiple discrete fasteners are provided for mounting a heat sink to a circuit board, with or without an electronic device package secured thereto.
The invention may be carried into practice in various ways, and certain embodiments will now be described by way of example with reference to the accompanying drawings, in which:
Figure 1 is a perspective view of a heat sink and an electronic device package with a fastener according to this invention attached; sink and electronic device package of Figure 1.
Figure 2 is a side view of the heat sink, fastener and electronic device package of Figure 1 mounted on a circuit board.
Figure 2A is a detailed cross-sectional view of the securing means of the fastener of Figure 2.
Figure 3 is an end view of the heat sink, electronic device package and fastener of Figure 2.
Figure 4 is a top view of the fastener of
Figure 1.
Figure 5 is a side view of the fastener of
Figure 4.
Figure 6 is an end view of the fastener of
Figure 4.
Figure 7 is a side view of an alternative embodiment of the fastener of this invention attached to a heat sink and electronic device package and mounted on a circuit board.
Figure 8 is a top view of the fastener of
Figure 7.
Figure 9 is a side view of the fastener of
Figure 7.
Figure 10 is an end view of the fastener of
Figure 7.
Figure 11 is a side view of yet another alternative embodiment of the fastener of this invention attached to a heat sink and electronic device package and mounted on a circuit board.
Figure 12 is a top view of the fastener of
Figure 11.
Figure 13 is a side view of the fastener of
Figure 11.
Figure 14 is an end view of the fastener of
Figure 11.
Referring now to Figures 1 and 1A of the drawings, the reference numeral 10 generally indicates a fastener constructed in accordance with the invention. The fastener is attached to heat sink 12 and secured to electronic device package 14. The electronic device package may consist of any type of device intended to be mounted on a circuit board or connected to a heat sink, such as a transistor, resistor, diode or the like. In the illustrated embodiment, the electronic device package takes the form of a T03 type transistor package. The electronic device package includes cylindrical enclosure 16 enclosing an electronic component (not shown) and a surrounding flange 18.
The electronic device package furtherincludes a pair of downwardly extending leads 20 for connecting the electronic component to an external circuit.
Heat sink 12 is constructed in a manner known to he effective in radiating and conveying heat to the environment and includes rhombus shaped base 22 and four upwardlyextending side plates 24. Each side plate includes a plurality of parallel spaced upright fingers 26. Of course it is recognized that the heat sink may be constructed in any manner known to the art found suitable for use with the electronic device package. A pair of holes 28 are provided in the base of the heat sink in alignment with the leads 20 of the electronic device package to enable the leads to be connected to the circuit board (not shown).
Fastener 10 is shown in more detail in Figures 4-6 and includes unitary elongated body 40 defining longitudinal axis 42. The fastener may be formed by conventional metal forming techniques from suitable sheet or ribbon materials such as aluminum, copper, steel and alloys thereof. The material should exhibit sufficient strength and resilience to firmly support heat sink 12 and electronic device package 14 on the circuit board.
Means are provided to quickly and easily attach the fastener to the heat sink, preferably in a non-permanent manner so that, if desired, the heat sink may be quickly and easily removed from the fastener for repair or replacement. In the illustrated embodiment, the attachment means takes the form of clips 44 formed at either end of the elongated body along the longitudinal axis thereof. Each clip includes upwardly projecting tab 46 and inwardly extending tooth 48. Inclined, inwardly facing surface 50 is formed on the upper edge of the tooth.
As the fastener and the heat sink are pushed together, the inclined surfaces on the clips encounter the heat sink adjacent opposing corners thereof (as at 52), causing the clips to be deflected outwardly until the base of the heat sink passes the teeth of the clips and the clips resume their undeflected position to engage the base of the heat sink and secure the fastener to the heat sink. The heat sink may be removed by deflecting the attachment clips outward and pulling the heat sink away from the fastener.
As shown if Figures 2 and 3, means are also provided to mount the fastener on circuit board 58. In the illustrated embodiment, the mounting means takes the form of two longitudinally spaced pairs of downwardly extending mounting members 60 on the fastener symmetrical about the longitudinal axis thereof. In the preferred embodiment of the invention, each mounting member includes downwardly extending first member 62. The opposing first members each connect to transverse second members 64 directed inwardly towards the longitudinal axis of the body and terminating in downwardly extending third member 66.Each pair of opposing third members are adapted for insertion into an aligned preformed hole 68 in the circuit board and for soldering in place to secure the fastener and heat sink to the circuit board with the second members of each mounting member in contact with the surface of the circuit board. Although the mounting members are illustrated as being received in opposing pairs, this invention encompasses a fastener having one or more separate mounting members formed along the body. The mounting means of this invention also has the inherent property of spacing the heat sink and electronic device package above the surface of the circuit board by the length of the downwardly extending first members 62.
Alternatively, the mounting member may be adapted for surface soldering onto preformed mounting pads on the circuit board in a manner known in the art and described in U.S.
Patent Application Serial No. 644,038 entitled "Fastener for Surface Mounting of Printed Circuit Board Components". In that embodiment, the third member of each of the mounting members are omitted and the second members soldered to the mounting pads on the circuit board to mount the fastener thereto.
Therefore, for the purpose of this application, mounting the fastener on a circuit board encompasses not only soldering a mounting member into a hole in the circuit board, but also surface mounting of the mounting member 60.
An important aspect of the present invention is that mounting member 60 readily accept a solder bond. To that end, at least a portion of downwardly extending third member 66 of each mounting member is clad with a a solderable coating material which promotes the formation of solder bonds such as tin or a tin-lead alloy. The pre-clad material may be applied by conventional pre-tinning or by plating or the like. Such a pre-clad coating is conventionally referred to as "pre-tin" regardless of the composition of the material or the process by which it is applied and the terms "pretinned", "pre-tin", "tin-plated" and "tincoated" are used interchangeably herein to refer to solderable or solder-promoting coatings regardless of the actual composition of the coating or the manner by which the coating is applied.Mounting member 60 may be pretinned after the unitary body is formed as described above or fastener 10 may be formed from pre-tinned blank stock. Fastener 10 may be formed by metal stamping using conventional spring steel and the stamped parts thereafter tin-plated.
As previously discussed, it is sometimes desirable to mount an electronic device package onto a heat sink, rather than directly onto the circuit board. For this purpose, and as shown in Figure 2A, the electronic device package includes a pair of mounting holes 80, which in the T03 device package illustrated are formed at either end of mounting member 18. Holes 82 are formed on the heat sink, aligned with holes 80 in the electronic device package when positioned on the heat sink.
The fastener includes means for securing the electronic device package to the heat sink in conjunction with the aligned mounting holes.
Specifically, a pair of longitudinally spaced apertures 84 are formed in respective enlarged circular sections 86 in the elongate body of the fastener, parallel to the bottom of the heat sink. The apertures are internally threaded so that bolts or screws 88 may be inserted through each of the aligned mounting holes in the electronic device package and the heat sink and threadedly secured in the apertures in the heat sink, as shown in Figure 2A. Although two sets of mounting holes and apertures are illustrated, it is within the spirit and scope of this invention to provide one, or more than two apertures as required to secure the electronic device package to the heat sink.
The mounting members are conveniently formed in pairs on the body adjacent the enlarged circular sections for increased support as the screws engage the apertures. However, the mounting members and apertures may be formed anywhere along the length of the body. Locating the mounting members on the outside edges of the enlarged circular sections also increases the length of the transverse second members thereof, thus improving the lateral stability of the fastener, and of the heat sink when mounted on the circuit board.
The fastener of this invention thus combines the function of mounting a heat sink to a circuit board and of securing an electronic device package to the heat sink. The fastener is economical to manufacture and replaces the multiple discrete standoffs of conventional designs. The fastener is easily attached to or removed from the heat sink without requiring extensive alignment procedures.
Figures 7-10 illustrate an alternate embodiment of the invention in which a separate fastener 100 is provided for each set of mounting holes (not shown) on heat sink 102 and electronic device package 104 shown in Figure 7, and substantially identical to those shown in Figures 1-3. As is shown in detail in
Figures 8-10, each of the fasteners 100 includes unitary body 106 having a circular section 108 that is parallel to the bottom of the heat sink. Upright first member 110 depends downwardly from the circular section and is designed to space the heat sink and the electronic device package above the surface of the circuit board. Second member 112 extends from the first member parallel to the surface of circuit board 114. Finally, third member 116 extends downwardly from the second member and is adapted for insertion and soldering in a preformed hole 118 in the circuit board.The third member 116 of the fastener may include a solder promoting coating such as is discussed herein with respect to the embodiment of Figures 4-6.
Aperture 120 is formed in the circular section and is internally threaded. A pair of fas teners 100 are soldered into preformed holes 118 on the circuit board. A heat sink is positioned over the fasteners and the electronic device package is positioned on top of the heat sink with their respective mounting holes aligned. Screws 122 are inserted through the mounting holes of the heat sink and the electronic device package and each threadedly engaged with one of the apertures of the fasteners as shown in Figure 2A. Alternatively, the fasteners could be attached to the heat sink and electronic device packages by the screws prior to soldering the fasteners on the circuit board. In either alternative, the securing means for mounting the electronic circuit package to the heat sink and the attachment means for attaching the heat sink to the fastener are the same.Further if the electronic device package is mounted directly on the circuit board the screws are used solely for attaching the heat sink to the fastener.
Figures 11-14 illustrate yet another alternate embodiment of the fastener of this invention in which a separate fastener is provided for each set of mounting holes on the heat sink and the electronic device package. As in the embodiment shown in Figures 1-3 and 7, electronic device package 132 is secured to heat sink 134 and both are mounted on circuit board 136 by a pair of fasteners 130. As is shown in detail in Figures 12-14, each of the fasteners includes unitary body 138 formed as body 40 in Figures 1-3 and having generally rectangular section 140 that is parallel to the bottom of the heat sink. Upright first member 142 depends downwardly from the rectangular section and is designed to space the heat sink and the electronic device package above the surface of circuit board 158. Second member 144 extends from the first member parallel to the surface of the circuit board.
Finally, third member 146 extends downwardly from the second member and is adapted for insertion and soldering in preformed hole 148 in the circuit board. Third member 146 may include a solder promoting coating as previously discussed herein with respect to Figures 4-6 and 8-10. However, additional laterally spaced support members 1 50a and 150b are formed on either side of the downwardly depending first member. Each of these support members are of equal length as the second member and are adapted to contact the surface of the circuit board at points spaced laterally and longitudinally from the point at which the second member contacts the circuit board. The combination of the second member and the support elements increases the stability of the fastener in supporting the heat sink and the electronic device package on the circuit board.
Aperture 152 is formed in the first member and is internally threaded. As is shown in Figure 11, a pair of the fasteners are soldered into holes on the circuit board. Heat sink 134 is positioned over the fasteners and electronic device package 132 is positioned on top of the heat sink with their respective mounting holes aligned. Screws 154 are inserted through the mounting holes of the heat sink and the electronic device package and threadedly engaged with each of the apertures of the fasteners as is shown in Figure 2A. Alternatively, the fastener may be soldered to the circuit board and the heat sink and the electronic device package subsequently secured to the fasteners by the screws as described above. Further if the electronic device package is mounted directly on the circuit board the screws are used solely for attaching the heat sink to the fastener.
Although the invention has been disclosed above with regard to particular and preferred embodiments, these are advanced for illustrative purposes only and are not intended to limit the scope of this invention. In applications in which the electronic device package is to be separately mounted on the circuit board, the threaded apertures in the body of the fastener may be omitted and the heat sink attached such as by the attachment clips described herein. Or, the clips may be omitted and the threaded apertures included for use in attaching the heat sink to the fastener with the screws. Although not illustrated, it is sometimes desirable to insert a member (not shown) constructed of an electrically insulating material between the fastener and the heat sink so as to insulate the heat sink from the circuit board. Similarly, a layer of thermally conductive material may be interposed between the heat sink and the electronic device package to ensure effective heat transfer therebetween. These variations remain within the scope of the invention as claimed below.
Claims (15)
1. A fastener for mounting a heat sink and an electronic device package on a circuit board comprising:
a body;
mounting means extending from said body for mounting said body on the circuit board;
attachment means for attaching the heat sink to said body.
2. A fastener as claimed in Claim 1 in which the mounting means and the attachment means extend from the body in opposite directions.
3. A fastener as claimed in Claim 1 or Claim 2 wherein said mounting means comprises at least one mounting member extending from said body, said mounting member having:
a first member perpendicularly disposed to said body for spacing said body from the circuit board; and
a second member supported by said first member spaced from said body and adpated for mounting on the circuit board.
4. A fastener as claimed in Claim 3 wherein said second member includes a third member perpendicularly disposed thereto, said third member being adapted for insertion into, and soldering within, a hole in the circuit board for mounting the fastener thereon and at least a portion of said third member being coated with a solder promoting coating.
5. A fastener as claimed in any preceding claim wherein at least a portion of the mounting means is coated with a solder promoting coating.
6. A fastener as claimed in any preceding claim in which the mounting means comprises at least two laterally spaced support members extending from said body and adapted for contact with the circuit board for supporting the fastener when mounted on the circuit board.
7. A fastener as claimed in any preceding claim wherein said attachment means comprises a pair of longitudinally spaced attachment clips extending from said body opposite said mounting means and adapted to engage opposite sides of the heat sink when the heat sink is adjacent said body.
8. A fastener as claimed in any preceding claim in which the attachment means includes securing means by which the heat sink and the device package can be secured to the body.
9. A fastener as claimed in Claim 8 wherein said securing means comprises:
a surface on said body disposed parallel to the heat sink and electronic device package, and including a threaded aperture formed therein aligned with mounting holes in the heat sink and the electronic device package; and
a screw adapted for insertion in the aligned holes in the heat sink and electronic device package.
10. A fastener for mounting a heat sink and an electronic device package on a circuit board constructed and arranged substantially as herein specifically described with reference to Figures 4 to 6, 8 to 10 or 12 to 14 of the accompanying drawings.
11. An electronic device package and a heat sink mounted on a circuit board by means of a fastener as claimed in any preceding claim.
12. Apparatus for securing a heat sink and an electronic device package to a circuit board, comprising:
a unitary elongate body having at least two longitudinally spaced pairs of integrally formed mounting members extending from said body and adapted for mounting on the circuit board so as to support the fastener thereon,
a pair of longitudinally spaced, integrally formed attachment clips extending from said body opposite said mounting members and adapted to grip the heat sink on opposite sides thereof so as to attach the heat sink to the fastener,
at least one surface formed on said body and disposed parallel to the heat sink and electronic device package, said surface including an internally threaded aperture aligned with mounting holes formed in the heat sink and the electronic device package; and
screw means adapted for extension through the mounting holes in the heat sink and the electronic device package and being in threaded engagement with said apertures in said body so as to secure the heat sink and electronic device package to the circuit board.
13. The combination, comprising:
a circuit board;
a heat sink;
an electronic device package in contact with said heat sink for the rapid dissipation of heat from said electronic device package through said heat sink to the environment; and
at least one fastener, said at least one fastener having a body, and
mounting means extending from said body mounted on said circuit board for supporting said fastener, said heat sink and said electronic device package on said circuit board, including attachment means for attaching said heat sink to said fastener spaced above said circuit board, and securing means for securing said electronic device package to said heat sink and to said fastener for supporting said electronic device package spaced above said circuit board.
14. A fastener for mounting a heat sink to a circuit board, comprising:
a unitary body having a surface disposed parallel to the heat sink, said surface including an internally threaded aperture presented to the heat sink;,
a first member extending from said surface and disposed perpendicular thereto, for spacing said surface above the circuit board;
a second member extending from said first member and disposed generally parallel to said circuit board when the fastener is mounted thereon; and
a third member extending from said second member and disposed perpendicular to the surface of the circuit board when the fastener is mounted thereon, said third member including having a solder promoting coating applied thereto and adapted for soldering into a hole formed in the circuit board.
15. The fastener as claimed in Claim 14 further comprising a pair of laterally spaced support members extending from either side of said first member, said support members being adapted for contact with the circuit board so as to support the fastener when mounted thereon.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US84298886A | 1986-03-24 | 1986-03-24 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8705109D0 GB8705109D0 (en) | 1987-04-08 |
| GB2188483A true GB2188483A (en) | 1987-09-30 |
| GB2188483B GB2188483B (en) | 1989-12-20 |
Family
ID=25288763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8705109A Expired GB2188483B (en) | 1986-03-24 | 1987-03-05 | Heat sink fastener |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS62226647A (en) |
| GB (1) | GB2188483B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU701155B2 (en) * | 1996-03-05 | 1999-01-21 | Calsonic Corporation | Resistor unit and method of producing same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4259685A (en) * | 1978-03-09 | 1981-03-31 | Sgs-Ates Componenti Elettronici S.P.A. | Clamp for securing an encased power frame to a heat sink |
| GB2129629A (en) * | 1982-10-18 | 1984-05-16 | Illinois Tool Works | Printed circuit board fasteners |
| US4460917A (en) * | 1982-06-03 | 1984-07-17 | Motorola, Inc. | Molded-in isolation bushing for semiconductor devices |
| GB2170035A (en) * | 1985-01-17 | 1986-07-23 | Kitagawa Ind Co Ltd | Device for fixing an electronic display |
| US4618915A (en) * | 1984-12-17 | 1986-10-21 | Illinois Tool Works Inc. | Support member for electrical components |
| GB2176661A (en) * | 1985-06-12 | 1986-12-31 | Kitagawa Ind Co Ltd | Fixation device for an electronic display |
-
1986
- 1986-10-28 JP JP25481386A patent/JPS62226647A/en active Pending
-
1987
- 1987-03-05 GB GB8705109A patent/GB2188483B/en not_active Expired
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4259685A (en) * | 1978-03-09 | 1981-03-31 | Sgs-Ates Componenti Elettronici S.P.A. | Clamp for securing an encased power frame to a heat sink |
| US4460917A (en) * | 1982-06-03 | 1984-07-17 | Motorola, Inc. | Molded-in isolation bushing for semiconductor devices |
| GB2129629A (en) * | 1982-10-18 | 1984-05-16 | Illinois Tool Works | Printed circuit board fasteners |
| US4618915A (en) * | 1984-12-17 | 1986-10-21 | Illinois Tool Works Inc. | Support member for electrical components |
| GB2170035A (en) * | 1985-01-17 | 1986-07-23 | Kitagawa Ind Co Ltd | Device for fixing an electronic display |
| GB2176661A (en) * | 1985-06-12 | 1986-12-31 | Kitagawa Ind Co Ltd | Fixation device for an electronic display |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU701155B2 (en) * | 1996-03-05 | 1999-01-21 | Calsonic Corporation | Resistor unit and method of producing same |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8705109D0 (en) | 1987-04-08 |
| JPS62226647A (en) | 1987-10-05 |
| GB2188483B (en) | 1989-12-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |