GB2185757B - Dendritic surface treatment of copper layers - Google Patents

Dendritic surface treatment of copper layers

Info

Publication number
GB2185757B
GB2185757B GB8601883A GB8601883A GB2185757B GB 2185757 B GB2185757 B GB 2185757B GB 8601883 A GB8601883 A GB 8601883A GB 8601883 A GB8601883 A GB 8601883A GB 2185757 B GB2185757 B GB 2185757B
Authority
GB
United Kingdom
Prior art keywords
surface treatment
copper layers
dendritic surface
dendritic
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8601883A
Other versions
GB2185757A (en
GB8601883D0 (en
Inventor
John Edwin Thorpe
Gursharan Singh Sarang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB8601883A priority Critical patent/GB2185757B/en
Publication of GB8601883D0 publication Critical patent/GB8601883D0/en
Publication of GB2185757A publication Critical patent/GB2185757A/en
Application granted granted Critical
Publication of GB2185757B publication Critical patent/GB2185757B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
GB8601883A 1986-01-27 1986-01-27 Dendritic surface treatment of copper layers Expired GB2185757B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8601883A GB2185757B (en) 1986-01-27 1986-01-27 Dendritic surface treatment of copper layers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8601883A GB2185757B (en) 1986-01-27 1986-01-27 Dendritic surface treatment of copper layers

Publications (3)

Publication Number Publication Date
GB8601883D0 GB8601883D0 (en) 1986-03-05
GB2185757A GB2185757A (en) 1987-07-29
GB2185757B true GB2185757B (en) 1989-11-01

Family

ID=10591985

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8601883A Expired GB2185757B (en) 1986-01-27 1986-01-27 Dendritic surface treatment of copper layers

Country Status (1)

Country Link
GB (1) GB2185757B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2070047A1 (en) * 1991-06-28 1992-12-29 Richard J. Sadey Metal foil with improved peel strength and method for making said foil

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1515361A (en) * 1975-07-09 1978-06-21 Electrofoils Ltd Metal finishing of metallic foils by electrodeposition
GB1567101A (en) * 1977-01-13 1980-05-08 Oxy Metal Industries Corp Production of multiple zinc/containing electro-coatings
GB1593206A (en) * 1977-12-05 1981-07-15 Califoil Inc Plasticsmetal composite and method of making same
GB2086426A (en) * 1980-10-21 1982-05-12 Furukawa Circuit Foil Copper foil for a printed circuit
EP0112635A2 (en) * 1982-12-01 1984-07-04 Electrofoils Technology Limited Treatment of copper foil
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58500149A (en) * 1981-02-26 1983-01-20 エレクトロフオイルス　テクノロジ−　リミテイド How to treat copper foil

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1515361A (en) * 1975-07-09 1978-06-21 Electrofoils Ltd Metal finishing of metallic foils by electrodeposition
GB1567101A (en) * 1977-01-13 1980-05-08 Oxy Metal Industries Corp Production of multiple zinc/containing electro-coatings
GB1593206A (en) * 1977-12-05 1981-07-15 Califoil Inc Plasticsmetal composite and method of making same
GB2086426A (en) * 1980-10-21 1982-05-12 Furukawa Circuit Foil Copper foil for a printed circuit
EP0112635A2 (en) * 1982-12-01 1984-07-04 Electrofoils Technology Limited Treatment of copper foil
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces

Also Published As

Publication number Publication date
GB2185757A (en) 1987-07-29
GB8601883D0 (en) 1986-03-05

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee