GB2158998A - Mounting of integrated circuits - Google Patents

Mounting of integrated circuits Download PDF

Info

Publication number
GB2158998A
GB2158998A GB08412602A GB8412602A GB2158998A GB 2158998 A GB2158998 A GB 2158998A GB 08412602 A GB08412602 A GB 08412602A GB 8412602 A GB8412602 A GB 8412602A GB 2158998 A GB2158998 A GB 2158998A
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
saddle
housing
pins
dual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08412602A
Other versions
GB8412602D0 (en
GB2158998B (en
Inventor
David Brian Jones
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Open University
Original Assignee
Open University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Open University filed Critical Open University
Priority to GB08412602A priority Critical patent/GB2158998B/en
Publication of GB8412602D0 publication Critical patent/GB8412602D0/en
Publication of GB2158998A publication Critical patent/GB2158998A/en
Application granted granted Critical
Publication of GB2158998B publication Critical patent/GB2158998B/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)

Abstract

A device to enable a dual-in-line integrated circuit (10) with pins (14) to be inserted into and extracted from a dual-in-line socket comprises a box-like housing (16), open at top and bottom, within which the IC is fitted, preferably captively. A strip (18) of electrically insulating material fitted with a pivotable toggle (20) at each end runs between the rows of pins (14) and below the body (12) of the IC. Operation of the toggles (20) causes the strip (18) to rise and lift the IC evenly from its socket. <IMAGE>

Description

SPECIFICATION Mounting of integrated circuits This invention relates generally to the mounting of integrated circuits. It is conventional for integrated circuits (ICs) to be provided with two rows of pins, such integrated circuits being referred to as dual-inline integrated circuits. When such ICs are mounted, for example on a circuit board, the pins are inserted into a multi-hole socket which is provided with two correspondingly spaced parallel rows of receiving holes.
One of the problems ofthe conventional dual-in-line integrated circuit is that the pins can easily be bent or otherwise damaged when the IC is not mounted in its socket. This can happen for example when an IC is in storage, in transit, in a pocket, or if it is dropped. If a replacement IC isto be sent by post for example then there is a considerable dangerthatthe pins will be damaged in transit unless suitable precautions are taken. Afurther problem associated with the conventional dual-in-line ICs isthatthe pins can be damaged when the integrated circuit is inserted into the socket or is extracted from the socket.Upon insertion it is necessaryto ensure that the pins are correctly aligned with the receiving holes, and on extraction it is desirable to be able to remove the integrated circuit without having to exert undue physical effortwhich could result in damagetothepins.
It is an object ofthe present invention to provide a device adapted to be used with a dual-in-line integrated circuit and which provides a solution to all the aforesaid problems.
Broadly in accordance with the present invention there is provided a deviceforenabling a dual-in-line integrated circuit to be inserted into and extracted from a dual-in-line socket, the device comprising a housing adapted to receive an integrated circuit, and a saddle arranged to extend belowthe body of the integrated circuit and between the rows of pins thereof, the saddle passing up between opposite ends of the housing and the ends of the integrated circuit, and the saddle comprising meanswhich are manually operable to raisethe saddle and hence the integrated circuit seated thereon.
Preferably,the manually operable means comprise toggles one at each end ofthe saddle and pivotable to liftthesaddleand integrated circuit relative to the housing.
Thetogglesarepreferablyarrangedto bear in concave seats one at each end of the housing.
In one preferred embodiment of the invention the housing, the integrated circuit and the saddle are designed to remain fitted together with the IC being captive in the housing. In otherwords, each dual-inline integrated circuit is provided with its own housing and saddle which remain linked to the integrated circuit even when it is inserted into the socket.
In orderthatthe invention may be fully understood, one presently preferred embodiment of device in accordance with the invention will now be described byway of example and with reference to the accompanying drawings, in which: Fig. 1 is a schematic side view, partially cut away, illustrating the construction and manner of operation ofthe device; Fig. 2 shows the saddle ofthe device; and, Fig. 3 shows the housing of the device, the upper part of Fig. 3 being a side view and the lower part of Fig. 3 being a top plan view of the housing.
Fig. is a sectional view through the device in which the dual-in-line integrated circuit lOis shown in each ofthree positions. The dual-in-line integrated circuit comprises a body portion 12 with a plurality of downwardly projecting pins 14 arranged in two spaced parallel rows along the body. Just two pins 14 are shown in Fig. 1 byway of example. The integrated circuit 10 is housed within a box-like housing 16 which is shown in more detail in Fig. 3. The box-like housing 16 is open at the top and bottom and is dimensioned internally so that the integrated circuit 10 is received within it and is able to move vertically within the confines ofthe housing.In the uppermost position of the integrated circuit as shown in broken lines in Fig. 1 the body ofthe IC is positioned atthetop ofthe housing and the pins 14 are within the contour ofthe housing and are therefore protected against damage.
In the lowermost position ofthe IC as shown in solid outline in Fig. 1, the body of the IC is positioned at the bottom of the housing 16 and the pins 14 project from the housing to enable them to be received in the socket (not shown). An intermediate position forthe integrated circuit is also indicated in broken lines at the left-hand side of Fig. 1. In Fig. 1 the majority of the pins 14 and the integrated circuit socket itself have been omitted for clarity.
The box-like housing 16 should be of a relatively rigid material having sufficient strength to force the pinstotherequired dimension,while not being of such a size asto overlap the integrated circuitsocket more than is necessary. Preferably, the housing 16 is made of a clear plastics material, thus enabling the pins 14 and the main body 12 of the integrated circuit to be easily visible.
The dimensions ofthe housing are such thatthere is a clearance between the body 12 of the integrated circuit and the opposite ends 1 6a and 16b of the housing. These clearances at each end of the IC enable a strap 18to pass between the body ofthe IC and the respective ends 1 6a, 1 6b of the housing, the strap 18 extending underthe body 12 ofthe IC, between the two rows of pins, and passing up between the IC and the housing at each end of the integrated circuit In this way the strap 18 acts as a saddle, separate from the integrated circuit but providing a seat for it within the housing. The saddle is shown more clearly in Fig. 2 of the drawings. At each end ofthe strap 18there is provided a toggle 20.These toggles 20 are arranged to sit loosely in concave seats, one at each end 1 6a, 1 6b ofthe housing. When the toggles 20 are rotated in an upward and outward direction they exert leverage, via the strap 18, in an upward direction on the body of the integrated circuit by means of which the IC is lifted straight up in the housing and out of the socket. The fact that the strap 18 extends the full length of the integrated circuit between the rows of pins ensures thatthe lifting force is spread evenly overthe length of the device. When the integrated circuit is inserted fully into the socket then the toggles adopt the position shown atthe right-hand side of Fig. 1 where they are pivoted downwards and inwards, partially orfully into the housing, in order notto be obstructive.The material used forthe saddle hasto be strong in view of thefactthatthe strap 18 must be thin and that it is subject to considerable stress when the IC is extracted from the socket. A suitable plastics material is to be preferred. It is also importantthatthe material which is used for both the housing and forthe saddle should be such thatthey cannot electrically short-circuitthe pins.
Referring again to Fig. 1 ,this shows the toggles 20 in three positions. With the IC fully down, i.e. mounted in thelCsocket,thetogglestakeupthe position shown as "fully inserted". With the IC partially extracted from the socketthetoggles occupy the position shown as "partially extracted". With the IC fu Ily with in the housing the toggles are shown in an outward position indicated as "fully extracted". It should be noted that with the integrated circuit in the latter position, i.e.
fullywithin the housing, the saddle can be relaxed and the toggles released whereupon they can be pivoted inwardly to lie on top of the body of the integrated circuit.
The device is appropriate for use with integrated circuits having any number of pins, with the appropriate dimensioning ofthe component parts. It is importantthatthe housing should be dimensioned so that the integrated circu it fitted into it automatically is aligned with its pins in the correct position for insertion intothesocket. It should also be noted that the integrated circuits may be fixed permanently, temporarily, or not at all in the housing. It is the combination ofthethree components, i.e. integrated circuit, saddle and housing, whether permanently combined onewith another or not, which constitutes the essence of the present invention. The invention also of course extends to the combination of a housing and saddle designed and appropriate to receive an integrated circuit in use.

Claims (10)

1. A device to enable a dual-in-line integrated circuitto be inserted into and extracted from a dual-in-line socket, the device comprising a housing adapted to receive an integrated circuit, and a saddle arranged to extend below the body of the integrated circuit and between the rows of pins thereof, the saddle comprising meanswhich are manuallyoperable to raise the saddle and hence the integrated circuit seated thereon.
2. A device as claimed in claim 1, in which the manually operable means comprise toggles one at each end ofthe saddle and pivotable to lift the saddle and integrated circuit relative to the housing.
3. A device as claimed in claim 2, in which the toggles bear in concave seats one at each end ofthe housing.
4. A device as claimed in any preceding claim, in which the saddle is arranged to pass between respective opposite ends ofthe housing and the adjacent ends ofthe integrated circuit.
5. A device as claimed in any preceding claim, in which the integrated circuit is captive in the housing.
6. A device as claimed in any preceding claim, in which the saddle comprises a strip of plastics material.
7. In combination with a dual-in-line integrated circuit having a double row of pins for engagement in a dual-in-line socket, a housing forthe integrated circuit, and a saddle extending belowthe body of the integrated circuit and between the rows of pins thereof, the saddle comprising manually operable means to raise the saddle and the integrated circuit seated thereon.
8. A device as claimed in claim 7, in which the saddle comprises a strip of electrically insulating material which passes between respective opposite ends of the housing and the adjacent ends of the integrated circuit.
9. A device as claimed in any preceding claim, in which the housing comprises a box-like structure open attop and bottom, and with a depth dimension such that when the integrated circuit is fully raised the pins thereof lie within the contour ofthe housing.
10. A device substantially as hereinbefore described with reference to the accompanying drawings.
GB08412602A 1984-05-17 1984-05-17 Mounting of integrated circuits Expired GB2158998B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08412602A GB2158998B (en) 1984-05-17 1984-05-17 Mounting of integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08412602A GB2158998B (en) 1984-05-17 1984-05-17 Mounting of integrated circuits

Publications (3)

Publication Number Publication Date
GB8412602D0 GB8412602D0 (en) 1984-06-20
GB2158998A true GB2158998A (en) 1985-11-20
GB2158998B GB2158998B (en) 1987-11-04

Family

ID=10561096

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08412602A Expired GB2158998B (en) 1984-05-17 1984-05-17 Mounting of integrated circuits

Country Status (1)

Country Link
GB (1) GB2158998B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4190310A (en) * 1978-04-03 1980-02-26 Amp Incorporated Ejection device for a electronic package connector
US4193656A (en) * 1978-12-20 1980-03-18 Amp Incorporated Extraction device for extracting a DIP from a DIP header
US4209216A (en) * 1978-10-04 1980-06-24 Convey, Inc. Socket insertion guide

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4190310A (en) * 1978-04-03 1980-02-26 Amp Incorporated Ejection device for a electronic package connector
US4209216A (en) * 1978-10-04 1980-06-24 Convey, Inc. Socket insertion guide
US4193656A (en) * 1978-12-20 1980-03-18 Amp Incorporated Extraction device for extracting a DIP from a DIP header

Also Published As

Publication number Publication date
GB8412602D0 (en) 1984-06-20
GB2158998B (en) 1987-11-04

Similar Documents

Publication Publication Date Title
US4536955A (en) Devices for and methods of mounting integrated circuit packages on a printed circuit board
US5477426A (en) IC card with board positioning means
US4789345A (en) Socket device for fine pitch lead and leadless integrated circuit package
US4250536A (en) Interconnection arrangement for circuit boards
CA1240747A (en) Electrical connector
KR860000408B1 (en) Integrated circuit mounting apparatus
JPH0883658A (en) Test of bare die and temporary package for burn-in
US3522485A (en) Modular circuit construction
WO2005119770A1 (en) Integrated circuit socket corner relief
EP0784358A3 (en) Shroud latch for electrical connectors
US5756937A (en) Removable cover for wire wrap connectors
EP0138325A2 (en) Chip carrier connector
GB2158998A (en) Mounting of integrated circuits
JPS6092639A (en) Device for fixing cooler to integrated module
US6648204B2 (en) Alignment weight for floating pin field design
US5177671A (en) Chip carrier socket
US5055972A (en) Chip carrier socket
EP0788726A1 (en) Current supply module for mounting on a component-carrying printed circuit board
US5161092A (en) Circuit card assembly conduction converter
US3663921A (en) Receptacle for connecting semiconductors to a circuit board
US4869674A (en) Cradle for electronic device package
US5842876A (en) Power clip for printed circuit
JP4372600B2 (en) Socket for electrical parts
US20020022386A1 (en) Socket for BGA package
WO2004027836A3 (en) Die carrier

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee