GB2144273A - Housing for electrical or electronic equipment - Google Patents

Housing for electrical or electronic equipment Download PDF

Info

Publication number
GB2144273A
GB2144273A GB08417823A GB8417823A GB2144273A GB 2144273 A GB2144273 A GB 2144273A GB 08417823 A GB08417823 A GB 08417823A GB 8417823 A GB8417823 A GB 8417823A GB 2144273 A GB2144273 A GB 2144273A
Authority
GB
United Kingdom
Prior art keywords
housing
housing according
resin
composition
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08417823A
Other versions
GB8417823D0 (en
GB2144273B (en
Inventor
Alan William Atkinson
David Rushworth Hurst
Kenneth Trevor Somerfield
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
T&N Materials Research Ltd
Original Assignee
T&N Materials Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB838320607A external-priority patent/GB8320607D0/en
Application filed by T&N Materials Research Ltd filed Critical T&N Materials Research Ltd
Priority to GB08417823A priority Critical patent/GB2144273B/en
Publication of GB8417823D0 publication Critical patent/GB8417823D0/en
Publication of GB2144273A publication Critical patent/GB2144273A/en
Application granted granted Critical
Publication of GB2144273B publication Critical patent/GB2144273B/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0047Casings being rigid plastic containers having conductive particles, fibres or mesh embedded therein

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A housing for electrical equipment is made by moulding under heat a composition comprising an organic thermosetting resin which includes exfoliated graphite in an amount which is enough to impart to the moulded article an electrical resistivity not greater than 10 ohm-cm. The housing has an excellent capacity to reduce the level of electromagnetic radiation emitted by equipment within it and to shield electronic equipment from external electromagnetic radiation. <IMAGE>

Description

SPECIFICATION Housing for electrical or electronic equipment This invention relates to a housing for electrical or electronic equipment.
Housings for electrical or electronic equipment are often made of metal, but manufacturers are now preferring to use plastics materials (eg polycarbon ates),forthese havetheadvantageoflowerfabrica- tion costs, reduced weight and more flexibility in design. They have, however, the disadvantage that they are virtually transparent to electromagnetic radiation. As the number of radiation sources (such as citizens band radios) grows, and as electronic equipment (microprocessors for example) becomes more complex and so more sensitive to external electromagnetic fields, so it becomes more important to cut down radiation emitted from the one and to shield the other from that electromagnetic radiation which does reach it.
The present invention provides a housing for electrical or electronic equipment which is suitable for the purpose just outlined. The housing is hotmoulded from an organicthermosetting resin moulding composition in which there is included an amount ofthe material known as exfoliated graphite (sometimes called expanded graphite) which is enough to imparttothe moulded article an electrical conductivityequivalentto a resistivity notgreaterthan 10 ohm-centimetre. Because of the structure of exfoliated graphite, as little as 0.5% by weight of it can provide a continuous, electrically conductive network in the moulded article. Preferably, however, the content of exfoliated graphite in the moulding composition is in the range 2.5 - 20% byweig ht and a content of 5-20% by weight is particularly preferred.
Exfoliated graphite is a well known material used in the manufacture of gaskets, packings and sealing materials, and is made from natural flake graphite or well ordered synthetic graphite by a process whose first step involves treatment of graphite with a strong oxidising agent. Thus when graphite is treated with sulphuric acid under strong oxidising conditions it swells slightly owing to the interposition, between the layers or hexagonally arranged carbon atoms constituting the graphite lattice, of bisulphate ions HSO4- and neutral (unionised) sulphuric acid molecules H2SO4. If the slightly swollen material is washed with a large volume of water, the intercalated neutral sulphuric acid molecules become replaced bywater molecules, but the HSO4- ions are largely unaffected.
When this compound is freed from adherent wash water and heated for a few seconds at temperatures of the orderof 1 ,000 C, the interstitial water suddenly vapourises and causes a great expansion ofthe compound in the direction (ie perpendicular to the plane of the carbon atom layers), so that the final c dimension may be 100 times or even more its initial value. Owing to the suddenness of expansion, particles ofthe expanded substantially sulphate-free product do not possess the highly ordered structure of particles of the original graphite; they are of an irregularform which is usually described as vermiform (worm-like), and are extremely porous. They are also distinctfrom particles of the oxidised graphite material known as 'graphitic oxide' or 'graphitic acid'.
In spite of their high porosity, particles of exfoliated graphite are not particularly fragile; they are indeed much less fragile than the hollow carbon microspheres whose inclusion in electromagnetic radiation absorption material is described in British patent specification 1 411731. Such microspheres are expensiveto make, andtheirspherical structure requires them to be used in considerably higher proportion in a non-conductive matrix in orderto obtain a composite with an electrical conductivity equal tothat imparted bya given content or exfoliated graphite.Thermosetting resin composi tionswhich include hollow carbon micro-spheres in a proportion adequate to give electrical conductivity suitable for our purposes are in fact very difficultto mould because of their low plasticity.
Thethermosetting resins preferably used are phenolic resins, particularly phenol formaldehyde resins, and unsaturated polyester resins, but epoxy resins, urea formaldehyde resins and melamine formaldehyde resins can be used if desired. Ordinari ly, the organicthermosetting resin will form at least 20% by weight of the moulding composition, but not more than 95% byweightthereof. The balance of the moulding composition is essentially non-conductive moulding additive such as reinforcing fibre and non-fibrous filler. There may be up to 60% by weight of reinforcing fibre, and up to 60% by weight of filler.
Other moulding additives such as catalyst, inhibitor and mould release agent may be employed in an amountnotgreaterthan about 10% by weight.
The invention is further illustrated by Examples 1 to 3 later, which utilise as starting material an exfoliated graphite which is conveniently prepared asfollows: Preparation of Exfoliated Graphite Natural flake graphite (10 gms; 99% carbon; 80% retained on a sieve of aperture 300,am diameter) was gently stirred for 112 hourwith a mixture (90 gms; added at room temperature) of sulphuric acid, nitric acid and water, in weight proportion such thatH2SO4: HNO3: H2O=74:15:11.
The reaction mixture was filtered off and the graphite compound formed by reaction (probably C24+ . HSOJ. .nH2SO4), was washed until substantial- lyfree from the molecular species H2SO4 by running water at room temperature (20 C) for one hour. The fully washed material was drained from adherent water and dried at 80 C for 3 hours, and then conventionallyflame exfoliated (temperature 1200 C) to volatilise the bound water content. The exfoliated product had a density ofabout4kgim3 (0.004gm/ cm3).
To avoid the difficulties of handling very large volumes of such low-density material, it may be convenientto compactthe product, to a density not greaterthan75-100kglm3.
EXAMPLE 1 Exfoliated graphite (409) was gently compacted into a slab of density 18kg/m3 and the slab was laid in a pool (20409) of alcoholic solution of phenolic resole resin (viscosity 60 centistokes at ambient temperature) containing 25% by weightsolids. When the slab had absorbed all the liquid it was broken down in a mixerto form crumbs of 2-1 Omm maximum dimen sion,andchoppedglassfibre(6mm long; 240g) having a dressing compatible with the phenolic resin was blended in. After 15 minutes the mixture was transferred to an oven and held at 1050for 100 minutes to evaporate the solvent and part-cure the resin.
The solvent-free part-cured mixture was then transferred to a heated mould and press-cured at 170 Cforone hourtoform a housing with walls 3.5mm thick, of density 7 500kg/m3 and resistivity 0.18 ohmcm The capacity of the material of the housing to reduce transmission of electromagnetic radiation at various frequencies was investigated as follows ~~ A panel of the material was mounted over a square aperture of size 25cm cut in the side of a wall of a room otherwise well shielded. A range of signal generators with appropriate transmitter antennae was placed outside the room, facing the aperture, and matched receivers were mounted insidethe room, facing the aperture.Transmitter, receiver and antennae combinations were selected to permit measurements over frequencies in the range of 50-1000 MHz.
By measuring received signal levels at selected frequencies, with and without the test panel in place overthe aperture, the attenuation characteristics of the panel were determined overthe stated frequency range. The measured attenuation was 32-64dB, as set out below. (Attenuationof20AOdBisregardedas satisfactoryfor most domestic and commercial equipment.) Frequency (MHz) Attenuation IdBJ 960 64 700 64 450 64 200 56 100 52 50 32 Mechanical properties ofthe moulded material forming the housing were:~ Tensile strength (Mpa) 13 Tensile modulus (Gpa) 8 Flexural Strength (MPa) 46 Flexural Modulus (GPa) 7 Izod impact strength (Notched edgewise) (Jim) 80 EXAMPLE2 The following ingredients were tumble mixed for 10 minutes::~ A B Exfoliated graphite (compacted to bulkdensity 11 kg/m3) 509 1009 Chopped Glass fibre (3mm long) 5509 5009 * Powdered phenolic resin 400g 4009 Calcium stearate (mould release agenl) 159 15g * Novolac resin admixed with 12% by weight of hexamine; meltviscosity = 82 kpoise min. at 136 C Each of mixtures A and B was press-cured (moulding pressure 4-16 MN/m2) for onehour at 1700C in a heated mould to give a housing of wall thickness 3.5mm and density about 1750 kgim3.Other properties of the press-cured materials were:~ Electromagnetic radiation shield capacities: Attenuation (dB) Frequency(MHz) A B 10000 120 140 960 72 100 700 70 100 450 64 110 200 58 90 100 44 85 50 32 55 Tensile strength (MPa) 45 39 Tensile modulus (GPa) 14.3 12 Flexural strength (MPa) 108 73 Resistivity (ohm-cm) 0.35 0.07 EXAMPLE3 The following ingredients were mixed in a Z-blade mixer: Exfoliated graphite (compacted to bulk density 11 keg/ m3) 100g Polyester resin solution in styrene (2 parts by weight of polyester derived from propylene glycol, maleic acid and phthalic anhydride; 1 part by weight of styrene) 700g followed by Polyvinyiacetate solution in styrene (1:1) (low profile additive) 200g Conventional catalyst and inhibitor mixture 10g Followed by Chalk (filler; average particle size 3,am) 770g Calcium stearate (mould release agent) 30g followed by Glass fibre (6mm long; with polyester-compatible dressing 200g After a total of 20 minutes mixing, the material was transferred to a heated mould and pressured at 1 300Cfor 1.1/2 minutes to form a housing of wall thickness 4mm and density 1590 kg/m3. Its resistivity was 0.5 ohm-cm.
Its capacity to reduce transmission of electromagnetic radiation at various frequencies was:~ Frequency (MHz) Attenuation (dB) 10000 106 960 50 700 50 450 54 200 48 100 32 50 26 Mechanical properties of the material of the hous ing were:~ Tensile strength (MPa) 18 Tensile Modulus (GPa) 8 Flexuralstrength (MPa) 50 Flexural modulus (GPa) 8 Izod impact strength 166 (notched) (Jim)

Claims (11)

1. A housing for electrical or electronic equipment made by moulding under heat a composition com prising an organicthermosetting resin which con tails an amount of exfoliated graphite which is enough to impart to the moulded article an electrical resistivity not greaterthan 10 ohm-cm.
2. A housing according to claim 1, in which the amount of exfoliated graphite forms 0.5to 20% by weight of the composition.
3. A housing according to claim 2, in which the amount of exfoliated graphite forms 2.5to 20% by weight ofthe composition.
4. A housing according to claim 3, in which the amount of exfoliated graphite forms 5 to 20% by weightofthe composition.
5. A housing according to any one of claims 1 to4, in which the organicthermosetting resin forms 20-95% byweight of the composition.
6. A housing according to claim 5, in which the composition contains upto 60% byweightof reinforcing fibre.
7. A housing according to claim 5 or 6, in which the composition contains upto 60% byweightof non-fibrousfiller.
8. A housing according to any one of claims 1 to 7, in which thethermosetting resin is a phenolic resin.
9. A housing according to any one of claims 1 to 7 in which thethermosetting resin is an unsaturated polyester resin.
10. A housing for electrical or elctronic equipment made substantially as described herein with refer enceto Example 1 or2.
11. Ahousingforelectrical orelectronicequipment made substantially as described herein with reference to Example 3.
GB08417823A 1983-07-30 1984-07-12 Housing for electrical or electronic equipment Expired GB2144273B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08417823A GB2144273B (en) 1983-07-30 1984-07-12 Housing for electrical or electronic equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB838320607A GB8320607D0 (en) 1983-07-30 1983-07-30 Housing for electrical/electronic equipment
GB08417823A GB2144273B (en) 1983-07-30 1984-07-12 Housing for electrical or electronic equipment

Publications (3)

Publication Number Publication Date
GB8417823D0 GB8417823D0 (en) 1984-08-15
GB2144273A true GB2144273A (en) 1985-02-27
GB2144273B GB2144273B (en) 1986-07-09

Family

ID=26286719

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08417823A Expired GB2144273B (en) 1983-07-30 1984-07-12 Housing for electrical or electronic equipment

Country Status (1)

Country Link
GB (1) GB2144273B (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1429576A (en) * 1973-09-27 1976-03-24 Siemens Ag Housings for plug-in modules

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1429576A (en) * 1973-09-27 1976-03-24 Siemens Ag Housings for plug-in modules

Also Published As

Publication number Publication date
GB8417823D0 (en) 1984-08-15
GB2144273B (en) 1986-07-09

Similar Documents

Publication Publication Date Title
US4530949A (en) Housing for electrical or electronic equipment
Das et al. Electromagnetic interference shielding effectiveness of conductive carbon black and carbon fiber‐filled composites based on rubber and rubber blends
Bigg et al. Plastic composites for electromagnetic interference shielding applications
US4474685A (en) High performance molding compounds for shielding electromagnetic interference
US4783279A (en) Plastic mixture with electromagnetic shielding characteristics
US5310784A (en) Electromagnetic wave shielding material
JP2595396B2 (en) Manufacturing method of conductive composite
JPS5919480B2 (en) radio wave shielding material
JPH0473460B2 (en)
US6709745B2 (en) Electromagnetic absorber material, method for the production thereof and method for the production of shielding devices thereof
JPS63286468A (en) Carbon fiber composite resin composition
GB2144273A (en) Housing for electrical or electronic equipment
JP2000269680A (en) Electromagnetic wave absorbing board
KR20050067185A (en) A conductive cushion material and a method for manufacturing the same
CN111961305A (en) Microcellular foamed HIPS electromagnetic shielding material and preparation method and application thereof
JPH10215097A (en) Radio wave absorption building material
RU2243980C1 (en) Composite material for shielding electromagnetic emission and a method for manufacture thereof
JPH0992996A (en) Wave absorber
CN109081638B (en) Electromagnetic wave loss composite material and preparation method and application thereof
GB2144138A (en) Electrically conductive layer
JP4462750B2 (en) Radio wave absorber
JPS6248974B2 (en)
JPH04207000A (en) Magnetic shield material
KR100258789B1 (en) Board for absorbing electron wave
JP2006307185A (en) Thermosetting resin molding material and molded article using it

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee