GB2109166A - Printed circuit boards - Google Patents
Printed circuit boards Download PDFInfo
- Publication number
- GB2109166A GB2109166A GB08133595A GB8133595A GB2109166A GB 2109166 A GB2109166 A GB 2109166A GB 08133595 A GB08133595 A GB 08133595A GB 8133595 A GB8133595 A GB 8133595A GB 2109166 A GB2109166 A GB 2109166A
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- substrate
- sheet
- circuit boards
- fibres
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000011230 binding agent Substances 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000003855 Adhesive Lamination Methods 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
Sheet material comprising fibres and an elastomeric binder is used as the substrate for printed circuits. The fibres are preferably vitreous fibres present in an amount from 20 to 70 wt % of the sheet.
Description
SPECIFICATION
Improvements in or relating to printed circuit boards
This invention relates to metal clad laminates of the kind useful for making printed circuit boards. Such laminates comprise an insulating substrate sheet clad on one or both major faces with metal foil, (normally copper). The latter is subsequently partly removed to create the outline of an electrical circuit, to which the necessary components and/or connections can be added.
The substrate is usually relatively inflexible. Various combinations of resin and fibrous reinforcement are well-known, ranging from paper reinforced phenolics to glass fibre reinforced fluorocarbon polymers. The latter are very expensive, although they are less brittle than other more commonly used materials.
For some applications, there is a need for a greater than usual degree of flexibility coupled with high impact resistance. For example, copper clad polyester films are available for the production of printed circuits occupying more than one plane. However, their cost renders them unattractive for high volume, single plane applications and also they are too flexible for some purposes.
Our co-pending UK Patent Application No.
8107802 discloses a sheet material comprising from 10 to 35 wt% of a cured elastomeric binder and from 20 to 70% wt% of vitreous fibres and made by an "it" calendering process. Broadly similar sheet materials containing asbestos fibres have been made for many years, of course. Both kinds of sheets are useful for the manufactur of gaskets and will be referred to in this specification as being "sheets of the aforesaid kind".
According to the present invention, a sheet of the aforesaid kind constitutes the substrate for a printed circuit board. It preferably has at least one of its two major faces at least partly clad with copper foil, although the substrate may be sold as a product in its own right.
It has been found that sheet materials of the aforesaid kind make a surprisingly good substrate for printed circuit board. Their composition confers excellent impact strength coupled with good flexibility and their electrical properties are perfectly adequate for most high volume applications. Indeed, their physical properties are such that the printed circuit boards can be incorporated directly into compression moulded products such as automotive instru
ment panels, thereby simplifying assembly.
Cladding with copper foil may be carried out by conventional adhesive lamination.
Processing into a finished circuit board for a
particular end use may be carried out by all those
methods commonly used, for example by applying a resist to those portions of the copper which are to
remain, followed by etching away the untreated
portions with ferric chloride.
Claims (4)
1. A substrate for a printed circuit board, said substrate comprising a sheet of cured elastomeric binder and reinforcing fibres.
2. A substrate according to claim 1 wherein the elastomer component is present in an amount of from 10 to 35 wt% and the reinforcing fibres are vitreous fibres present in an amount of from 20 to 70 wt% of the sheet.
3. A substrate according to claim 1 or claim 2 wherein the sheet is made by a caldendering process.
4. A printed circuit board comprising the substrate of any preceding claim clad on at least one major face with metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08133595A GB2109166A (en) | 1981-11-06 | 1981-11-06 | Printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08133595A GB2109166A (en) | 1981-11-06 | 1981-11-06 | Printed circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB2109166A true GB2109166A (en) | 1983-05-25 |
Family
ID=10525702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08133595A Withdrawn GB2109166A (en) | 1981-11-06 | 1981-11-06 | Printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2109166A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2137425A (en) * | 1983-03-31 | 1984-10-03 | Rogers Corp | Shape retaining flexible electric circuit board and method of manufacture thereof |
| WO2003026371A1 (en) * | 2001-09-14 | 2003-03-27 | Tonoga Inc. | Low signal loss bonding ply for multilayer circuit boards |
| US6783841B2 (en) | 2001-09-14 | 2004-08-31 | Tonoga, Inc. | Low signal loss bonding ply for multilayer circuit boards |
| US7601419B2 (en) * | 2005-12-19 | 2009-10-13 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
| US7794820B2 (en) | 2006-06-20 | 2010-09-14 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and fabricating method of the same |
| US8659908B2 (en) | 2009-10-14 | 2014-02-25 | Lockheed Martin Corporation | Protective circuit board cover |
| US8947889B2 (en) | 2010-10-14 | 2015-02-03 | Lockheed Martin Corporation | Conformal electromagnetic (EM) detector |
-
1981
- 1981-11-06 GB GB08133595A patent/GB2109166A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2137425A (en) * | 1983-03-31 | 1984-10-03 | Rogers Corp | Shape retaining flexible electric circuit board and method of manufacture thereof |
| WO2003026371A1 (en) * | 2001-09-14 | 2003-03-27 | Tonoga Inc. | Low signal loss bonding ply for multilayer circuit boards |
| US6783841B2 (en) | 2001-09-14 | 2004-08-31 | Tonoga, Inc. | Low signal loss bonding ply for multilayer circuit boards |
| US6861092B2 (en) | 2001-09-14 | 2005-03-01 | Tonoga, Inc. | Low signal loss bonding ply for multilayer circuit boards |
| US7601419B2 (en) * | 2005-12-19 | 2009-10-13 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
| US7794820B2 (en) | 2006-06-20 | 2010-09-14 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and fabricating method of the same |
| US8065798B2 (en) | 2006-06-20 | 2011-11-29 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing printed circuit board |
| US8659908B2 (en) | 2009-10-14 | 2014-02-25 | Lockheed Martin Corporation | Protective circuit board cover |
| US8716606B2 (en) | 2009-10-14 | 2014-05-06 | Lockheed Martin Corporation | Serviceable conformal EM shield |
| US8947889B2 (en) | 2010-10-14 | 2015-02-03 | Lockheed Martin Corporation | Conformal electromagnetic (EM) detector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |