GB2098809A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- GB2098809A GB2098809A GB8213932A GB8213932A GB2098809A GB 2098809 A GB2098809 A GB 2098809A GB 8213932 A GB8213932 A GB 8213932A GB 8213932 A GB8213932 A GB 8213932A GB 2098809 A GB2098809 A GB 2098809A
- Authority
- GB
- United Kingdom
- Prior art keywords
- board
- printed circuit
- components
- circuit board
- conductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005452 bending Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/057—Shape retainable
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Telephone Set Structure (AREA)
- Structure Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
SPECIFICATION
Printed circuit board
The present invention relates to a printed circuit wiring board on which electronic components are mounted and which is intended for assembly in apparatus with limited available space.
The firm Kabelwerke Reinshagen have produced a brochure "Flexible gedruckte Schaltungen" (flexible printed circuit boards) which describes flexible printed circuits on a sheet base.
The printed conductors are disposed on a sheet (which has a thickness of 0.3mm) which is formed from a speciai material which may be bent and may thus be matched to the respective position required in the use thereof.
It can be used as a substitute for wiring harnesses.
It is a drawback of this form of printed circuit board that electronic components cannot be mounted on the sheet.
It is known to provide two rigid wiring boards upon which components can be mounted which are joined by flexible printed circuit.
It is a drawback of this arrangement that no electronic components may be assembled and soldered to the conductors on the flexible printed circuit.
The object of the invention is to provide a printed circuit board in a simple and convenient form.
According to the invention a printed circuit board for use in apparatus where there is limited space comprises a base formed from material which can be bent to a desired contour, components mounted on said board, the axes of said components being disposed substantially parallel to the axis about which the board is to be bent, and conductors carried by said board, said conductors being coated with a solder resist except in the areas of zones where the connections to the components are made.
In the accompanying drawings: Figure 1 shows a printed circuit board according to the invention located within a telephone handset; and
Figure 2 shows a plan view of the board with circuit components mounted thereon.
With reference to Fig. 1 of the drawings, there is indicated at 6 the wall of the portion of a handset of a telephone between the housings for the earphone and microphone. A printed circuit board constructed as will be described, is located at one end in a holder 4 secured to the wall 6 and adjacent its other end it is secured to a projection 5 which in turn is secured to or is formed integrally with the wall. The board can be secured to the projection by means of a screw or screws. It will be noted that the longitudinal axis of the handset is curved and that the board is also curved.
As shown in Fig. 2 the end 1A of the board is provided with a projection or lug 1 B which locates within a transverse slot in the holder 4. The board also mounts circuit components 2 which are interconnected by printed circuit conductors (not shown). The conductors prior to the soldering of the components to the conductors which process can be carried out using a solder bath, are coated with a solder resist, the resist being of course absent from the portions of the conductors to which the components are connected.
The components are disposed on the board so that preferably their axes lie substantially parallel to the so-called bending axis 3, this being the axis about which in use the board is bent to enable it to be mounted in the handset.
The board is formed from flexible material but apart from the need to flex without cracking no special material is required. The fact that the conductors are not coated with solder other than in the areas or zones where the electrical connections are made, means that the board can be bent and the risk of cracking the conductors is minimised.
The fact that the axes of the components lie substantially parallel to the bending axis means that the components themselves add little if any to the stiffness of the board.
It is possible using boards constructed as described, to utilize printed circuit boards in situations where normal planar boards could be not be used.
Claims (3)
1. A printed circuit board for use in apparatus where there is limited space comprising a base formed from material which can be bent to a desired contour, components mounted on said board, the axes of said components being disposed substantially parallel to the axis about which the board is to be bent, and conductors carried by said board, said conductors being coated with a solder resist except in the areas or zones where the connections to the components are made.
2. A board according to claim 1, in which the board is provided with a projection or lug to facilitate the mounting of the board on a holder.
3. A printed circuit board comprising the combinationpnd arrangement of parts substantially as hereinbefore described with reference to the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19813119952 DE3119952A1 (en) | 1981-05-20 | 1981-05-20 | BENT-FRIENDLY PCB WITH COMPONENT ALIGNMENT |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2098809A true GB2098809A (en) | 1982-11-24 |
| GB2098809B GB2098809B (en) | 1984-08-15 |
Family
ID=6132717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8213932A Expired GB2098809B (en) | 1981-05-20 | 1982-05-13 | Printed circuit board |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0065154A3 (en) |
| AU (1) | AU552487B2 (en) |
| DE (1) | DE3119952A1 (en) |
| GB (1) | GB2098809B (en) |
| SG (1) | SG66384G (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3514617A1 (en) * | 1985-04-23 | 1986-10-23 | Bodenseewerk Gerätetechnik GmbH, 7770 Überlingen | CARRIER PLATE ARRANGEMENT FOR HIGH ACCELERATIONS |
| AUPO301796A0 (en) | 1996-10-16 | 1996-11-07 | Resmed Limited | A vent valve apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3499220A (en) * | 1967-02-28 | 1970-03-10 | Amerace Esna Corp | Method of and apparatus for making a flexible,printed electrical circuit |
| US4136225A (en) * | 1977-07-08 | 1979-01-23 | Bell Telephone Laboratories, Incorporated | Cover coatings for printed circuits |
| GB1545531A (en) * | 1977-09-07 | 1979-05-10 | Gould Advance Ltd | Electronic assemblies |
-
1981
- 1981-05-20 DE DE19813119952 patent/DE3119952A1/en not_active Withdrawn
-
1982
- 1982-04-29 EP EP82103672A patent/EP0065154A3/en not_active Withdrawn
- 1982-05-03 AU AU83223/82A patent/AU552487B2/en not_active Ceased
- 1982-05-13 GB GB8213932A patent/GB2098809B/en not_active Expired
-
1984
- 1984-09-18 SG SG66384A patent/SG66384G/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB2098809B (en) | 1984-08-15 |
| AU552487B2 (en) | 1986-06-05 |
| AU8322382A (en) | 1982-11-25 |
| EP0065154A3 (en) | 1984-03-28 |
| DE3119952A1 (en) | 1982-12-09 |
| SG66384G (en) | 1985-03-15 |
| EP0065154A2 (en) | 1982-11-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |