GB2094549A - Insulating support for high- voltage semiconductors - Google Patents
Insulating support for high- voltage semiconductors Download PDFInfo
- Publication number
- GB2094549A GB2094549A GB8137779A GB8137779A GB2094549A GB 2094549 A GB2094549 A GB 2094549A GB 8137779 A GB8137779 A GB 8137779A GB 8137779 A GB8137779 A GB 8137779A GB 2094549 A GB2094549 A GB 2094549A
- Authority
- GB
- United Kingdom
- Prior art keywords
- holes
- semiconductor
- mounting
- insulating support
- defining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Insulating Bodies (AREA)
- Thyristors (AREA)
Abstract
An insulating support for a high- voltage semiconductor is shaped to define two mounting holes (2, 2a) corresponding to assembly holes in the casing of the semiconductor and two holes (3) for receiving connecting leads of the semiconductor. The region defining one mounting hole (2a) is connected to the region defining the holes (3) for the connecting leads by means of flexible straps (4) enabling variation of the spacing (A) between the respective holes to compensate for variation in the dimensions of the semiconductor casing. <IMAGE>
Description
SPECIFICATION
Insulating support for high-voltage semiconductors
This invention relates to an insulating support of flexible material, for example of synthetic
material, for the assembly of high-voltage semiconductor components.
When using high-voltage semiconductors,
particularly high-voltage transistors, in
manufacture, the user does not want to depend on
one semiconductor manufacturer only if there are
electrically equivalent components of two or more
semiconductor manufacturers. Unfortunately,
different exterior dimensions occur with
electrically equivalent components, for instance in the pitch of holes or spacings between mounting
holes in the casing flange and the leads extending from the casing. During production, diverse
supplies from different producers, depending on delivery may be utilised and insulating supports with correspondingly different pitches of holes
should then be available. This, however, makes
storage and manufacture more expensive.
Therefore, it is the object of the invention to
provide an insulating support of such construction that only one type of insulating support will be sufficient for the assembly of components of
different dimensions.
To complicate the matter, with high-voltage
transistors high-voltage peaks occur between the
collector and the other leads and the collector
electrically connects to the casing. Thus, it is
necessary to provide the insulating support with cylindrical shrouds die-cast or otherwise formed at the positions of the mounting holes, such shrouds
extending through the round holes into the
semiconductor casing flanges and thus assuring
the required flashover voltage protection.
Therefore, it has not hitherto been possible to overcome the problem simply by the use of a correspondingly dimensioned oval mounting hole with matching shroud because the required flashover voltage safety cannot thereby be
attained.
The present invention provides an insulating support of flexible material, for use in the
mounting of high-voltage semiconductor elements wherein different spacings may occur between connecting leads and a mounting hole in a mounting flange of the semiconductor casing, said support being shaped to define two mounting holes corresponding to assembly holes of a semiconductor casing and two holes for receiving corresponding connecting leads of the semiconductor, having substantially rigid straps extending between a portion thereof defining one of the said mounting holes and portions defining said holes for the two leads of the semiconductor, whereas straps extending between a portion thereof defining the other mounting hole and said portion defining the holes for the two leads of the semiconductor are thinner and elastically deformable, whereby during mounting of the semiconductor element, the support may be shaped by a slight pressure to bring the assembly holes of the semiconductor element and the mounting holes of the insulating support into alignment.
Preferably said insulating support has a cylindrical shroud formed coaxiaily with the respective mounting hole on one side of each of the portions defining said mounting holes, said shrouds being arranged to project into the respective assembly holes in a semiconductor flange and to extend somewhat beyond them.
An insulating support according to the invention can easily be adapted to the spacing requirements during assembly so that the cylindrical shrouds snap into the assembly holes of the semiconductor as desired. Spacing differences of 1 to 1.5 mm between the semiconductors of different manufacturers can be compensated in this way with a single type of insulating support.
The invention is illustrated by way of example in the accompanying drawings, in which:
Figure 1 is a sectional side elevation of an insulating support in accordance with the invention, and
Figure 2 is a plan view corresponding to Figure 1.
Referring to the drawings, there is shown an insulating support 1 with two mounting holes 2 and 2a. Slightly oval holes 3 serve for receiving the electric leads of the semiconductor element to be mounted. Among the semiconductor elements of different manufacturers, there are no different spacings between the mounting hole 2 and the holes 3. Therefore, the straps between them could be made rigid. However, the straps 4 defining the space shown at "A" in Figure 2 are thinner and are formed into a U-shape as shown, so that they are elastically formable. Thus, it is easily possible to compensate the spacing differences by a little pressure during the assembly of the insulating support and the semiconductor element until cylindrical shrouds 5 snap into the assembly holes in the casing of the semiconductor.
Claims (3)
1. An insulating support of flexible material, for use in the mounting of high-voltage semiconductor elements wherein different spacings may occur between connecting leads and a mounting hole ih a mounting flange of the semiconductor casing, said support being shaped to define two mounting holes corresponding to assembly holes of a semiconductor casing and two holes for receiving corresponding connecting leads of the semiconductor, having substantially rigid straps extending between a portion thereof defining one of the said mounting holes and portions defining said holes for the two leads of the semiconductor, whereas straps extending between a portion thereof defining the other mounting hole and said portion defining the holes for the two leads of the semiconductor are thinner and elastically deformable, whereby during mounting of the semiconductor element, the support may be shaped by a slight pressure to bring the assembly holes of the semiconductor element and the mounting holes of the insulating support into alignment.
2. An insulating support according to Claim 1, in which said insulating support has a cylindrical shroud formed coaxially with the respective mounting hole on one side of each of the portions defining said mounting holes, said shrouds being arranged to project into the respective assembly holes in a semiconductor flange and to extend somewhat beyond them.
3. An insulating support for a semiconductor element, substantially as described herein with reference to the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19818104113 DE8104113U1 (en) | 1981-02-14 | 1981-02-14 | Insulating pad for high-voltage semiconductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2094549A true GB2094549A (en) | 1982-09-15 |
| GB2094549B GB2094549B (en) | 1984-09-12 |
Family
ID=6724682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8137779A Expired GB2094549B (en) | 1981-02-14 | 1981-12-15 | Insulating support for high-voltage semiconductors |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE8104113U1 (en) |
| ES (1) | ES270945Y (en) |
| FR (1) | FR2500252A1 (en) |
| GB (1) | GB2094549B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0852397A1 (en) * | 1997-01-02 | 1998-07-08 | Texas Instruments Incorporated | Cantilevered ball connection for integrated circuit chip package |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1102711A (en) * | 1963-09-17 | 1968-02-07 | Ass Elect Ind | Improvements in or relating to mounting devices |
| DE2107225B1 (en) * | 1971-02-16 | 1972-05-25 | Karl Lumberg Kg | Spacer for semiconductor components |
| GB1546566A (en) * | 1975-07-17 | 1979-05-23 | Arrow Hart Europe Ltd | Base for electrical components |
-
1981
- 1981-02-14 DE DE19818104113 patent/DE8104113U1/en not_active Expired
- 1981-12-15 GB GB8137779A patent/GB2094549B/en not_active Expired
- 1981-12-30 ES ES1981270945U patent/ES270945Y/en not_active Expired
-
1982
- 1982-01-25 FR FR8201100A patent/FR2500252A1/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0852397A1 (en) * | 1997-01-02 | 1998-07-08 | Texas Instruments Incorporated | Cantilevered ball connection for integrated circuit chip package |
| US6064576A (en) * | 1997-01-02 | 2000-05-16 | Texas Instruments Incorporated | Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| ES270945Y (en) | 1984-04-01 |
| FR2500252B1 (en) | 1984-11-30 |
| GB2094549B (en) | 1984-09-12 |
| ES270945U (en) | 1983-10-16 |
| FR2500252A1 (en) | 1982-08-20 |
| DE8104113U1 (en) | 1981-07-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |