GB2071550A - Soft solder material for use in the formation of a solder bath - Google Patents

Abstract

Solder baths for use in the electronics industry are formed by converting into a molten condition a soft solder material in the form of an extruded bar of soft solder alloy having one or more cores comprising (I) esters of polyhydric alcohols of molecular weight of at least 300, (II) ester derivatives of rosin or modified rosin, (III) hydrocarbon resins, and/or (IV) polymeric waxes, so that the resulting solder bath is provided with a layer of anti-oxidant material derived from the cores which assists in preventing formation of oxide impurity on the surface of the molten solder bath and which may also act as a solder flux, thereby obviating the conventional necessity of applying a separate anti-oxidant material to the surface of the bath and of using a separate solder flux. The soft solder alloy may be 60/40 or 63/37% tin/lead and may contain up to 7% antimony, up to 3% copper, up to 20% cadmium and up to 10% silver.

Description

SPECIFICATION Soft solder material for use in the formation of a solder bath This invention relates to soft soldering and is concerned with a soft solder material in the form of an extruded bar which can be used in the formation of solder baths such as those used in the electronics industry.

Soldering with a soft solder, i.e. a tin/lead based alloy melting at below about 4000 C, is widely employed in the electronics industry, for example in the production of printed circuit assemblies. For the mass-production of such assemblies, the soldering operation can involve the use of a static or moving solder bath on to the surface of which the fluxed printed circuit assembly can be placed. In an automatic mass-soldering machine, the solder from the solder bath can be applied to the surface of the printed circuit assembly by so-called wave soldering, i.e. by forming a standing wave of molten soft solder against the crest of which the printed circuit assembly is caused to travel.

Such solder baths are normally prepared and maintained from soft solder in the form of an extruded or cast bar or ingot, generally of a 60/40 or 63/37 tin/lead solder alloy. It is essential for the solder bar or ingot to be of high purity solder alloy to ensure efficient operation of the solder bath.

Likewise it is essential to maintain the molten bath as pure as possible, to avoid the formation of dross on the surface of the molten solder bath and to maintain the free-flowing property of the bath. A difficulty which arises in meeting these purity requirements stems from the tendency of both the solid and molten solder alloy to oxidise in air, with the result that a layer of oxide is formed on the surface of the solid or molten solder alloy. This oxide layer acts as an impurity in the molten solder bath and adds to the formation of dross at the surface of the molten bath.With a view to meeting the foregoing difficulty and hence maintaining the high purity of the molten solder bath, it is common practice to maintain on the molten solder bath a surface layer of anti-oxidant material, for example a hydrocarbon oil or low melting resinous solid, to help prevent the formation of oxide impurity on the surface of the molten solder bath.

We have now found, in accordance with the invention, that it is possible to form an extruded bar of soft solder alloy having one or more substantially uninterrupted cores extending longitudinally through the interior of the extruded bar, the or each core comprising an organic substance (as hereinafter specified) which, when the bar is melted to form or replenish a molten solder bath, will form on the surface of the bath a layer of anti-oxidant material derived from said core(s).In this manner, it is possible not only to avoid the trouble of applying a separate anti-oxidant material to the surface of the molten solder bath and of removing used anti-oxidant material from the surface of the solder bath, but also to ensure that the correct ratio of the amount of anti-oxidant material to that of solder is automatically maintained by appropriately sizing the diameter of the core or cores of the material within each extruded solder bar. In a preferred embodiment of the invention, the organic substance of the core(s) will be a substance which can act both as an anti-oxidant and also as a solder flux, since this may assist the soldering operation and may make it possible to dispense with a separate application of flux to a printed circuit assembly prior to the soldering operation.

The organic substance present as one or more cores in the soft solder bar in accordance with the present invention should generally be solid at ambient temperatures but have a melting point such that it will become liquid at normal solder bath temperatures, generally above 2000 C. Substances melting in the range from 70 to 1200C are preferred.

The organic substances which can be used to form the core or cores in an extruded bar of soft solder alloy in accordance with the invention are to be selected from the following classes of organic substances: (I) Esters of polyhydric alcohols having molecular weights of at least 300, preferably a neutral ester derived from a polyhydric alcohol and at least one saturated or unsaturated fatty acid or monocarboxylic mononuclear aromatic acid, the ester advantageously having a molecular weight in the range from 300 to 3000. Particularly suitable esters are those derived from polyhydric alcohols containing from 2 to 8, preferably 3 to 6, hydroxyl groups such as, for example, esters derived from pentaerythritol, preferably pentaerythritol tetrabenzoate.

(íí) Ester derivatives of rosin (principally abietic acid), or of a modified rosin, for example a rosin which has been hydrogenated or reacted with a Diels-Alder type reactant such as maleic anhydride.

Particularly suitable esters are those derived from rosin or modified rosin and a polyhydric alcohol, preferably pentaerythritol or glycerol.

(Ill) Hydrocarbon resins derived from feedstocks of petrochemical origin. These generally have a melting range of from 80 to 1 500C.

(IV) Polymeric waxes such as polyethylene glycols, polyethylene oxides, polyvinyl alcohols and polyacrylic acids.

If desired a mixture of different organic substances selected either from the same class or from two or more of the foregoing classes (I), (11), (III) and (lV) may be employed to improve stability and wetting properties. Thus in a preferred embodiment of the invention, the or each core can be formed from a mixture of an ester of class (I) and an ester derivative of class (II).

When the core comprises an ester of class (1), there is advantageously also incorporated in the core a wetting agent which can enable the ester to act as a flux as well as an anti-oxidant. The wetting agent may be an aliphatic or aromatic mono- or polycarboxylic acid, for example stearic acid, adipic acid, sebacic acid, or linoleic acid, or an amine hydrochloride, for example cyclohexylamine hydrochloride or triethylamine hydrochloride.

The soft solder bar incorporating one or more cores in accordance with the invention may be of any suitable cross-section, for example of circular or generally trapezoidal cross-section. Each cored solder bar may weigh, for example, 1 or 0.5 kg.

The soft solder alloy employed in the manufacture of the core solder bar of the invention will normally be a tin/lead alloy containing at least 1% by weight of tin with the balance being lead. For example, the alloy may be a 60/40 or 63/37 tin/lead alloy. If desired, the alloy may also contain minor proportions of one or more other metals, for example, up to 7% antimony, up to 3% copper, up to 20% cadmium or up to 10% silver, apart from any incidental elements and/or impurities.

The cored solder bar of the invention can be produced by extruding the solder alloy so as to form an elongate bar whilst simultaneously introducing into the extruding alloy one or more, for example three, cores of the desired organic substance and thereafter cropping the resulting cored bar to provide cored solder bars each weighing, for example, about 1 kg. It will be appreciated that for manufacturing a core solder bar by the foregoing method, the organic substance for the core(s) should have a melting point which is lower than that of the soft solder alloy from which the solder bar is to be formed, so that the organic substance can be introduced in a flowable state into the molten solder alloy. The resulting cored solder bars may be packaged in plastics film or sheeting to prevent any tendency for the exterior of the solder bar to oxidise before use.

The following Examples illustrate the invention.

EXAMPLE 1 An anti-oxidant/flux core material was prepared by mixing together at a temperature of 1 200C the following constituents: % by weight Pentaerythritol tetrabenzoate 75 Pentaerythritol ester of maleic modified rosin 15 Dimerised unsaturated C18 fatty acid (EMPOL 1010) 10 A soft solder alloy consisting of 60 weight percent tin and 40 weight percent lead was extruded in the form of an elongate bar of trapezoidal cross-section having three symmetrically positioned cylindrical cavities extending therethrough into which was simultaneously introduced the foregoing anti-oxidant/flux material in a molten state in order to form a three-cored extruded solder bar which was cropped to provide bars each weighing about 1 kg and measuring about 430 mm x 25 mm x 12.7 mm.

The cored solder bars so produced were covered in a polyethylene film.

The cored solder bars obtained in the foregoing manner were subsequently fed, after removal of the polyethylene film, into a molten solder bath so that the anti-oxidant/flux material present as the cores in the solder bars formed a surface layer on the molten solder bath, which layer served both as an anti-oxidant covering layer for the solder bath and as a flux for use in soldering electronic components for printed circuit boards with the solder bath.

EXAMPLE 2 A cored solder bar was produced in the manner described in Example 1 from the following core material: Pentaerythritol tetrabenzoate 40% by wt.

Hydrocarbon resin (HERCUREZ A 150) 55% by wt.

Adipic acid 5% by wt.

EXAMPLE 3 A cored solder bar was produced in the manner described in Example 1 from the following core material: Pentaerythritol tetrabenzoate 60% by wt.

Pentaerythritol ester of hydrogenated rosin (FORAL 105) 35% by wt.

Adipicacid 5% by wt.

EXAMPLE 4 A cored solder bar was produced in the manner described in Example 1 from the following core material: Polyethylene glycol (BREOX PEG 20M) 90% by wt.

Alkylated phenyl acnaphthylamine (ERGONOX LO6-antioxidant) 10% by wt.

Claims (11)

1. A soft solder material in the form of an extruded bar of soft solder alloy having one or more substantially uninterrupted cores extending longitudinally through the interior of the extruded bar, the or each core comprising an organic substance selected from the following classes: (I) esters of polyhydric alcohols having a molecular weight of at least 300; (II) ester derivatives of rosin or of a modified rosin; (III) hydrocarbon resins derived from feedstocks of petrochemical original; and (IV) polymeric waxes such as polyethylene glycols, polyethylene oxides, polyvinyl alcohols and polyacrylic acids, or a mixture of two or more of (I), (II), (III) and (lav).

2. A soft solder material as claimed in Claim 1 , wherein the or each core comprises an ester of class (I) and further comprises a wetting agent.

3. A soft solder material as claimed in Claim 2, wherein the wetting agent is an aliphatic or aromatic mono- or polycarboxylic acid, or an amine hydrochloride.

4. A soft solder material as claimed in Claim 1, 2 or 3, wherein the ester of class (I) is an ester derived from a polyhydric alcohol and at least one saturated or unsaturated fatty acid or monocarboxylic mononuclear aromatic acid, the ester having a molecular weight in the range of from 300 to 3000.

5. A soft solder material as claimed in Claim 4, wherein the ester is derived from a polyhydric alcohol containing from 2 to 8 hydroxyl groups.

6. A soft solder material as claimed in Claim 5, wherein the ester is pentaerythritol tetrabenzoate.

7. A soft solder material as claimed in any preceding claim, wherein the ester derivative of class (li) is an ester derivative of rosin or of a hydrogenated rosin or a maleic modified rosin.

8. A soft solder material as claimed in Claim 7, wherein the ester is derived from pentaerythritol or glycerol.

9. A soft solder material as claimed in any preceding claim, wherein the or each core comprises an ester of class (I) and an ester derivative of class (II).

10. A soft solder material substantially as described in the foregoing Example 1, 2, 3 or 4.

11. A method of forming a solder bath for use in the production of electronics equipment, which comprises converting into a molten condition at least one extruded bar of soft solder material as claimed in any preceding claims to form the required solder bath the surface of which is provided with a layer of anti-oxidant material derived from said core(s).