GB2066278A - Radiation curable organopolysiloxanes - Google Patents
Radiation curable organopolysiloxanes Download PDFInfo
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- GB2066278A GB2066278A GB8038899A GB8038899A GB2066278A GB 2066278 A GB2066278 A GB 2066278A GB 8038899 A GB8038899 A GB 8038899A GB 8038899 A GB8038899 A GB 8038899A GB 2066278 A GB2066278 A GB 2066278A
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- onium salt
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- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 25
- 230000005855 radiation Effects 0.000 title claims description 9
- 239000000203 mixture Substances 0.000 claims abstract description 43
- -1 alkoxy silanes Chemical class 0.000 claims abstract description 40
- 150000003839 salts Chemical class 0.000 claims abstract description 19
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 230000001235 sensitizing effect Effects 0.000 claims abstract description 5
- 229910000077 silane Inorganic materials 0.000 claims description 7
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 6
- 239000004215 Carbon black (E152) Substances 0.000 claims description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical group CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 4
- 229930195733 hydrocarbon Natural products 0.000 claims description 4
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims description 4
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 claims description 4
- 150000002576 ketones Chemical class 0.000 claims description 2
- 239000012530 fluid Substances 0.000 abstract description 11
- 150000003254 radicals Chemical class 0.000 description 13
- 125000003118 aryl group Chemical group 0.000 description 8
- 150000001768 cations Chemical class 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 239000000975 dye Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 5
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 229910052752 metalloid Inorganic materials 0.000 description 4
- 150000002738 metalloids Chemical class 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000011067 equilibration Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 230000000269 nucleophilic effect Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 150000005840 aryl radicals Chemical class 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000000068 chlorophenyl group Chemical group 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 description 2
- VPUGDVKSAQVFFS-UHFFFAOYSA-N coronene Chemical compound C1=C(C2=C34)C=CC3=CC=C(C=C3)C4=C4C3=CC=C(C=C3)C4=C2C3=C1 VPUGDVKSAQVFFS-UHFFFAOYSA-N 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 235000019645 odor Nutrition 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- VHBMZTUGHSMQAR-UHFFFAOYSA-N phenylsulfanylbenzene triphenylsulfanium Chemical compound S(C1=CC=CC=C1)C1=CC=CC=C1.C1=CC=C(C=C1)[S+](C1=CC=CC=C1)C1=CC=CC=C1 VHBMZTUGHSMQAR-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 125000000547 substituted alkyl group Chemical group 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- VSIKJPJINIDELZ-UHFFFAOYSA-N 2,2,4,4,6,6,8,8-octakis-phenyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound O1[Si](C=2C=CC=CC=2)(C=2C=CC=CC=2)O[Si](C=2C=CC=CC=2)(C=2C=CC=CC=2)O[Si](C=2C=CC=CC=2)(C=2C=CC=CC=2)O[Si]1(C=1C=CC=CC=1)C1=CC=CC=C1 VSIKJPJINIDELZ-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- NZVLXSFYCZSHRF-UHFFFAOYSA-N 9,10-diethylanthracene Chemical compound C1=CC=C2C(CC)=C(C=CC=C3)C3=C(CC)C2=C1 NZVLXSFYCZSHRF-UHFFFAOYSA-N 0.000 description 1
- 101100436100 Caenorhabditis elegans asp-6 gene Proteins 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910052781 Neptunium Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052774 Proactinium Inorganic materials 0.000 description 1
- 239000004651 Radiation Curable Silicone Substances 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- DUMWHCLFZJQIGA-UHFFFAOYSA-N [methoxy(dimethyl)silyl] trimethyl silicate Chemical compound CO[Si](C)(C)O[Si](OC)(OC)OC DUMWHCLFZJQIGA-UHFFFAOYSA-N 0.000 description 1
- DPKHZNPWBDQZCN-UHFFFAOYSA-N acridine orange free base Chemical compound C1=CC(N(C)C)=CC2=NC3=CC(N(C)C)=CC=C3C=C21 DPKHZNPWBDQZCN-UHFFFAOYSA-N 0.000 description 1
- BGLGAKMTYHWWKW-UHFFFAOYSA-N acridine yellow Chemical compound [H+].[Cl-].CC1=C(N)C=C2N=C(C=C(C(C)=C3)N)C3=CC2=C1 BGLGAKMTYHWWKW-UHFFFAOYSA-N 0.000 description 1
- 229910052768 actinide Inorganic materials 0.000 description 1
- 150000001255 actinides Chemical class 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- DZBUGLKDJFMEHC-UHFFFAOYSA-N benzoquinolinylidene Natural products C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 description 1
- YLJJAVFOBDSYAN-UHFFFAOYSA-N dichloro-ethenyl-methylsilane Chemical compound C[Si](Cl)(Cl)C=C YLJJAVFOBDSYAN-UHFFFAOYSA-N 0.000 description 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 1
- 229960004132 diethyl ether Drugs 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229940052303 ethers for general anesthesia Drugs 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000010881 fly ash Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000003701 inert diluent Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000006501 nitrophenyl group Chemical group 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0041—Optical brightening agents, organic pigments
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Abstract
Fluid mixtures of alkoxy silanes and silanol terminated organopolysiloxanes containing onium salts of Group Va, VIa and VIIa elements have been found to cure to the elastomeric state when exposed to radiant energy. In instances where a sensitizing dye is used in the fluid mixtures, visible light cure can also be achieved.
Description
SPECIFICATION
Radiation curable organopolysiloxanes
Prior to the present invention, room temperature vulcanizing organopolysiloxane compositions, such as shown by Bruner Patent 3,070,555, were based on the moisture cure of a mixture of a silanol terminated polydiorganosiloxane and an acyloxy silane. Although these moisture curable organopolysiloxanes have been found to be useful in a variety of applications, acetic acid is liberated during the cure resulting in undesirable odor and reaction of the acid with various substrates. Improved results were achieved when Viventi U.S. Patent 3,816,282, assigned to the same assignee as the present invention, discovered that organopolysiloxanes could be cured by radiation, based on the use of a mercapto polysiloxane and a free radical source. Fox et al,
U.S.Patent 4,101,513 show that onium catalysts of Group Va, Vla and Vlla have been found to be useful for the condensation of hydrolyzable silanes under the influence of ultraviolet light.
The present invention is based on the discovery that radiation curable organopolysiloxane compositions which are free of acetic acid odors and curable under both UV radiation or visible light, can be obtained when utilizing a mixture of a silanol terminated polydiorganosiloxane and an alkoxy silane in combination with an onium salt of a Group Va, Vla or Vlla element. Unlike the compositions of Viventi, the radiation curable organopolysiloxane compositions of the present invention are based on silanol condensation. In instances where a visible light cure is desired, an appropriate sensitizing organic dye can be employed in combination with the aforementioned onium salts.
There is provided by the present invention radiation curable organopolysiloxane compositions comprising
(A) 100 parts of a silanol terminated organopolysiloxane consisting essentially of chemically combined diorganosiloxy units of the formula,
(1) R2SiO,
(B) 2 to 200 parts of an alkoxy silane of the formula,
(2) (RlO)a (R2)bSi, (C) 0.1 to 20 parts of an onium salt of a Group Va, Group Vla, or Group Vlla element and
(D) O to 20 parts of an organic dye sensitizer, where R is a monovalent hydrocarbon radical or halogenated monovalent hydrocarbon radical, R' is a C(, ,2) alkyl radical, R2 is selected from R radicals and C(, 8) glycidyl alkyl radicals, a is an integer having a value of from 2 to 4 inclusive, b is a whole number having a value of from 0 to 2 inclusive and the sum of a and b is equal to 4.
Radicals included by R of formulas (1) and (2) are, for example, monovalent aryl radicals, halogenated monovalent aryl radicals, such as phenyl, xylyl, chlorophenyl, naphthyl; aralkyl radicals such as benzo, phenylethyl, aliphatic and cycloaliphatic, such as alkyl, alkenyl, cycloalkyl; chloralkyl such as methyl, ethyl, propyl, chloropropyl, vinyl, allyl, trifluoropropyl, cyclohexyl, etc. and cyanoethyl, cyanopropyl, cyanobutyl, etc. Radicals included by R' are, for example, methyl, ethyl, propyl, etc.
The onium salts used in the practice of the present invention, are included within the formula,
(3) Y]+LJ]-, where J is a non-nucleophilic counterion defined more particularly below, and Y is a cation selected from the class consisting of an aromatic halonium cation,
(4) [(R3)c (R4)d D],
an aromatic Group Va cation,
(5) [(R3),(R5)9 (R6)h E],
and an aromatic Group Vla cation, 1(R3) (R7)k (RS)m G], where R3 is a monovalent aromatic organic radical, R4 is a divalent aromatic organic radical, R5 and R7 are monovalent organic aliphatic radicals selected from alkyl, cyclo alkyl and substituted alkyl, R6 and R8 are polyvalent organic radicals forming a heterocylic or fused ring structure selected from aliphatic radicals and aromatic radicals with E or G, D is a halogen radical such as
I, E is a Group Va element selected from N, P, As, Sb and Bi, G is a Group Vla element selected from S, Se and Te,
"c" is a whole number equal to O or 2,
"d" is a whole number equal to O or 1 and when c is 0, d is 1 and when d is O c is 2,
"f" is a whole number equal to O to 4 inclusive,
"g" is a whole number equal to O to 2 inclusive,
"h" is a whole number equal to O to 2 inclusive, and the sum of "f" + "g" + "h" has a value equal to 4 or the combining value of E,
"j" is a whole number equal to O to 3 inclusive,
"k" is a whole number equal to O to 2 inclusive, and
"m" is a whole number equal to O or 1, where the sum of "j" + "k" + "m" has a value equal to 3 or the combining value of G.
Radicals included by R3 can be the same or different, aromatic carbocylic or heterocyclic radicals having from 6 to 20 carbon atoms, which can be substituted with from 1 to 4 monovalent radicals selected from C(1 ,2) alkoxy, C(1 12) alkyl, nitro, chloro, etc., R3 is more particularly phenyl, chlorophenyl, nitrophenyl, methoxyphenyl, pyridyl etc.Radicals included by
R4 are divalent radicals, such as
R5 and R7 radicals include C(1 12) alkyl, such as methyl, ethyl, etc., substituted alkyl, such as -C2H40CH3, -CH2COOC2H5, -CH2COCH3, Q' is defined below, etc., R6 and R8 radicals include such structures as
where Q' is selected from -0-, (-CH2-)n, = N-R' and -S-, n is an integer equal to 1-4 inclusive; Z is selected from -0-, -S- and
and R' is selected from hydrogen, C(1 8) alkyl, C(6 13) aryl, etc.
Non-nucleophilic counterions included by J of formula (3) are MQd anions, where M is a metal or metalloid, Q is a halogen radical, and d is an integer such as 4-6 inclusive. In addition, J of formula (3), also can include non-nucleophilic counterions such as perchlorate, CF3SO3- and
C6H4SO3-, etc.; J of formula (3) also can be a halide counterion such as Cl-, Br-, F-, etc., as well as nitrate, phosphate, etc.
Metal or metalloids included by M of the non-nucleophilic counterion, MQd previously defined and included within J of formula (3) are transition metals such as Sb, Fe, Sn, Bi, Al, Ga, In, Ti,
Zr, Sc, V, Cr, Mn, Cs, rare earth elements such as the lanthanides, for example, Cd, Pr, Nd, etc., actinides, such as Th, Pa, U, Np, etc., and metalloids such as B, P, As, etc. Complex anions included by MQd are, for example, BF4-, PF6-, AsF6-, SbF6-, FeCI4-, SnCl6-, SbCI6-, BiCI5=, etc.
Halonium salts included by formula (3) and having formula (4) cations are for, example,
Group Va onium salts included by formula (3) and having formula (5) cations are, for example,
BF4-,
SbF6-,
BF4-,
BF4-,
PF4-,
AsF6-,
PF6-,
BF4-,
BF4-,
BF4-,
BF4-,
BF4-, etc.
Group Vla onium salts included by formula (3) and having formula (6) cations are, for example,
BF4-,
PF6-,
AsF6-,
SbF6-,
FeCl4-,
SnCl6-,
SbCl6-,
BiCl5=,
BF4-,
PF6-, etc.
included by the silanol terminated organopolysiloxanes consisting essentially of chemically combined units of formula (1) are linear diorganopolysiloxanes of the formula,
where R is as defined above and q is an integer having an average value equal to about 5 to 3000 inclusive. This fluid preferably has a viscosity in the range of from about 2,000 to 50,000 centipoises when measured at 25"C. These silanol-terminated fluids can be made by treating a higher molecular weight organopolysiloxane, such as dimethylpolysiloxane with water in the presence of a mineral acid, or base catalyst, to tailor the viscosity of the polymer to the desired range. Methods for making such higher molecular weight organopolysiloxane utilized in the production of silanol-terminated diorganopolysiloxane of formula (7) are well known.For example, hydrolysis of diorganohalosilane such as dimethyldichlorosilane, diphenyldichlorosilane, methylvinyldichlorosilane, etc., or mixtures thereof can provide for the production of low molecular weight hydrolyzate. Equilibration thereafter can provide for higher molecular weight organopolysiloxane. Equilibration of cyclopolysiloxane such as octamethylcyclotetrasiloxane, octaphenylcyclotetrasiloxane, or mixtures thereof, will also provide for higher molecular weight polymers. Preferably, such polymers are decatalyzed of equilibration catalyst by standard procedures prior to use, such as shown by Boot Patent 3,1 53,007, assigned to the same assignee as the present invention.
Silanol-terminated organopolysiloxanes having viscosities below 1 200 centipoises can be made by treating organopolysiloxanes consisting essentially of chemically combined units of formula (1) with steam under pressure. Other methods that can be employed to make silanolterminated organopolysiloxanes are more particularly described in Patent 2,607,792, Warrick and U.K. Patent 835,790.
Alkoxy silanes of formula (2) include, for example, methyl trimethoxysilane, dimethyldimethoxysilane, methyl orthosilicate, ethyl orthosilicate, n-butyl trimethoxysilane, trimethyl methoxysilane, methyl triethoxysilane, phenyl trimethoxysilane, diphenyldiethoxysilane, and higher condensates such as dimethyl tetramethoxydisiloxane, 2-glycidyl trimethoxysilane.
Organic dyes which can be employed in the practice of the invention are, for example; acridine orange, acridine yellow, phosphine R, benzoflavin haematoporphrin, 9,10-diethylanthracene, Mitchler's ketone, Setflavin T, perylene, coronene, etc.
In the practice of the invention the various ingredients of the mixture, such as the silanol fluid, the alkoxy silane, and onium salt can be mixed together. In the event that the onium salt and the silanol terminated polydiorganosiloxane or "silanol fluid" does not form a solution, the onium salt can first be dissolved in a liquid diluent which is inert to the components of the mixture. Suitable inert diluents include alcohols, such as ethanol, ethyl acetate, ethers, acetonitrile, etc. The alkoxy silane can be added prior to, or along with the onium salt to the silanol fluid.
In instances where a visible light cure is desired, the organic dye can be added to the ingredients under total or limited darkness to minimize the premature activation of the onium salt.
Various fillers and pigments can be incorporated into the radiation curable composition such as, for example, silica, talc, mica, titanium dioxide, gypsum, iron oxide, alumina, wood flour, glass fibers, graphite, carbon black, fly ash, etc. The amount of filler which can be used can be varied within wide limits. However, the choice of filler and amount can influence the effectiveness of the cure of the mixture and therefore the amount can vary widely depending upon the requirements of the application and the length of cure which can be tolerated. A typical mixture, for example, can be from 1 to 30 parts of filler per 100 parts of silanol fluid.
Compositions of the present invention can be employed as construction sealants, caulking compounds, etc. The compositions of the present invention can be stored for an indefinite period of time. In the event a sensitizing organic dye is utilized in the mixture, however, the curable organopolysiloxane compositions must be protected from daylight to minimize activation of the onium salt.
In order that those skilled in the art will be better able to practice of the invention, the following examples are given by way of illustration and not be way of limitation. All parts are by weight.
Example 1
A mixture of 10 parts of a silanol terminated polydimethylsiloxane fluid having a viscosity of 35,000 centipoises and an OH content of 0.09%, 1 part of ethylorthosilicate, and 0.3 part of di(4-n-butylphenyl)iodonium hexafluoroarsenate was spread as a 3 mil film onto a glass plate and irradiated using a GE H3T7 medium pressure mercury arc lamp at a distance of 7 inches.
After an irradiation time of 20 seconds, there was obtained a rubbery film.
A copper wire is immersed into the above UV curable organopolysiloxane and the coated wire is exposed to ultra-violet light as previously described. There is obtained an adherent elastomeric silicone rubber coating on the wire after 10 seconds of exposure which is useful as an insulating coating.
Example 2
The procedure of Example 1 was repeated, except that methyltriethoxy silane was substituted for ethylorthosilicate. The curable silicone formulation was spread as a one mil film onto a glass plate and irradiated at a distance of 7 inches following the same procedure of Example 1. There was obtained a rubbery crosslinked film after 10 seconds of irradiation. When the same curable silicone formulation was spread onto craft paper as a 0.1 mil film and cured as described above.
Papers coated with pressure resistant adhesives could not be made to permanently bond to the craft paper. The coating was nonsmearing and could not be rubbed off.
Example 3
A solution comprising 0.2g di(4-n-heptylphenyl) iodonium hexafluoroarsenate, 10g difunctional hydroxyl terminated polydimethylsiloxane fluid having a viscosity of 35,000 cp, and 1 g methylorthosilicate. The above mixture was coated as a 1 ml film onto an aluminum plate and exposed at a distance of 3 inches from a GE H3T7 lamp. Fifteen seconds irradiation was sufficient to give a tack-free rubbery coating.
Example 4
A polymerizable mixture was prepared using 1 part of a 47,000 cp hydroxyl terminated polydimethylsiloxane fluid, 5 parts 2-glycidyltrimethoxysilane and 0.1 part of a phenyl sulfide triphenylsulfonium salt of the formula,
AsP6
When the above mixture was irradiated for 1.0 minute, as a 1 mil film on a glass plate, a transparent hard film was obtained. Irradiation was carried out using a GE H3T7 medium pressure mercury arc lamp.
The above phenyl sulfide triphenylsulfonium salt was prepared as follows:
A mixture of 1 9.6 parts of 86% potassium hydroxide, 33 parts of thiophenol and about 1 20 parts of dimethylacetamide was heated at a temperature of 120"C with stirring to effect the removal of water. After about 6.5 parts of water was collected, there was added to the resulting mixture 26.3 parts of para-dibromobenzene and the mixture was heated to reflux. After 6 hours at reflux the reaction mixture was allowed to cool and 300 parts of water was added. There was obtained a tan colored solid which was filtered and washed with water several times. The product was then dried. There was obtained 34.7 parts of 1 ,4-dithiphenoxybenzene based on method of preparation.
A mixture of 7.35 parts of the above disulfide, 11.75 parts of diphenyliodonium hexafluoroarsenate and 0.2 part of copper benzoate was heated for 3 hours at 120"C. The resulting reaction mixture was washed several times with about 50 part portions of diethylether and the remaining solid was recrystalized from 95% ethanol. There was obtained a 45% yield of a very light tan crystalline product having a melting point of 69-75" and the following elemental analysis:
Calculated %C, 51.3; %H, 3.50; %S, 11.43. Found %C, 51.21; %H 3.59; %S, 11.37. Based on method of preparation there was obtained a triarylsulfonium salt having the formula,
AsF6- .
Example 5
To the reaction mixture of Example 4, there was added 0.02 part of perylene as a sensitizer.
The mixture was then coated onto a glass plate and another glass plate placed over the first to make a glass-to-glass joint. After irradiating the mixture through the glass using a GE EBR 375W photoflood visible light lamp for 1.5 minutes, a permanent joint was produced.
Example 6
To 4 parts ethyltrimethoxy silane there was added 1 part of a 47,000 centipoises hydroxyl terminated polydimethylsiloxane and 0.1 part didodecylphenyliodonium hexafluoroantimonate.
The solution was coated as a 2 mil film on an aluminum panel and irradiated at a distance of 6 inches from a GE H3T7 medium pressure mercury arc lamp. The film was cured to a hard transparent film after 1 minute of continuous irradiation.
Example 7
To the solution of Example 6, there was added 0.01 part of perylene and the film coated as before on an aluminum panel. The panel was irradiated with visible light using a GE EBR 374W photoflood lamp. A transparent, hard film was produced after 1 minute irradiation employing the above lamp mounted at a distance of 4 inches.
Example 8
Example 6 was repeated, except the photoinitiator was replaced with
SbF6
A cure time of 1.5 minutes was required to obtain a hard tack-free coating.
Although the above examples are directed to only a few of. the very many radiation curable silicone formulations included within the scope of the present invention, it should be understood that the present invention is directed to a much broader variety of silicone formulations based on the use of silanol-terminated polydiorgansiloxanes having formula (1) units, alkoxy silanes of formula (2), aromatic onium salts as set forth in the previous description and optionally a sensitizing organic dye.
Claims (1)
1. A radiation curable organopolysiloxane composition comprising
(A) 100 parts of a silanol-terminated organopolysiloxane consisting essentially of diorganosiloxy units of the formula, R2SiO, (B) 2 to 200 parts of an alkoxy silane of the formula, (RlO)a(R2)bSi, (C) 0.1 to 20 parts of an onium salt selected from a Group Va, Vla, or Groups Vlla element and
(D) O to 20 parts of ano organic sensitizing dye, where R is selected from monovalent hydrocarbon radicals and halogenated monovalent hydrocarbon radicals, R' is selected from C(t ,2) alkyl radicals, R2 is selected from R radicals and C(, 8) glycidyl alkyl radicals, a is an integer equal to X to 4 inclusive, b is a whole number equal to O to 2 inclusive, and the sum of a + b is equal to 4.
2. A composition as claimed in claim 1, where the silanol terminated polydiorganosiloxane is a silanol terminated polydimethylsiloxane.
3. A composition as claimed in claim 1 or claim 2, where the alkoxy silane is ethylorthosilicate.
4. A composition as claimed in any one of the preceding claims, wherein the onium salt is di(4-n-butylphenyl)iodoniumhexafluoroarsenate.
5. A compositioon as claimed in any one of claims 1 to 3, where the onium salt is
PF66. A composition as claimed in any one of claims 1 to 3, where the onium salt is
SbF67. A composition as claimed in any one of claims 1 to 3, where the onium slat is
SbF6
8. A composition as claimed in any one of the preceding claims, where the dye is perylene.
9. A composition as claimed in any one of claims 1 to 7, where the dye is Micheis ketone.
10. A composition as claimed in claim 1, substantially as hereinbefore described with reference to any one of the examples.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10739979A | 1979-12-26 | 1979-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2066278A true GB2066278A (en) | 1981-07-08 |
GB2066278B GB2066278B (en) | 1984-10-24 |
Family
ID=22316460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8038899A Expired GB2066278B (en) | 1979-12-26 | 1980-12-04 | Radiation curable organopolysiloxanes |
Country Status (6)
Country | Link |
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JP (1) | JPS56106958A (en) |
AU (1) | AU6583880A (en) |
DE (1) | DE3048636A1 (en) |
FR (1) | FR2472592B1 (en) |
GB (1) | GB2066278B (en) |
ZA (1) | ZA807425B (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2598149A1 (en) * | 1986-04-30 | 1987-11-06 | Gen Electric | COMPOSITIONS OF POLYMERIC SEQUENCES. |
EP0259757A3 (en) * | 1986-09-02 | 1990-06-27 | Wacker-Chemie Gmbh | Pigmented compositions cross-linkable into organic polysiloxane elastomers |
US5086087A (en) * | 1988-03-25 | 1992-02-04 | Stamicarbon B.V. | Composition containing uv curable unsaturated monomers and/or oligomers, a photoinitiator and colloidal silica with an oragnosilane compound, and the application of this composition in coatings |
US5342658A (en) * | 1991-12-30 | 1994-08-30 | Lucky Limited | Abrasion resistant silicone coating composition |
CN110770289A (en) * | 2017-06-29 | 2020-02-07 | 陶氏环球技术有限责任公司 | Polyolefin compositions |
WO2021064534A2 (en) | 2019-10-03 | 2021-04-08 | 3M Innovative Properties Company | Silicone elastomers by free radical mediated cure |
US11693318B2 (en) * | 2018-07-17 | 2023-07-04 | Shin-Etsu Chemical Co., Ltd. | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and black matrix |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU546017B2 (en) * | 1980-03-11 | 1985-08-08 | General Electric Company | Ultraviolet light, cationic curable hard coating compositionsof polysiloxanes |
JPS6037549A (en) * | 1983-08-10 | 1985-02-26 | Fuji Photo Film Co Ltd | Photosolubilizable composition |
JPS60186570A (en) * | 1984-03-07 | 1985-09-24 | Nippon Soda Co Ltd | Composition for coating |
DE4024661C1 (en) * | 1990-08-03 | 1992-04-02 | Th. Goldschmidt Ag, 4300 Essen, De | Tris:tri:fluoromethane:sulphonated complexes - prepd. by mixing boron tri:fluoro:methanesulphonate with onium salt in organic solvent |
AU6461998A (en) * | 1997-03-14 | 1998-09-29 | Minnesota Mining And Manufacturing Company | Cure-on-demand, moisture-curable compositions having reactive silane functionality |
JP5590374B2 (en) * | 2009-09-15 | 2014-09-17 | 三菱レイヨン株式会社 | Active energy ray-curable composition, cured film forming method and laminate |
CN109486004B (en) * | 2018-11-06 | 2021-06-29 | 万华化学(宁波)有限公司 | High-dielectric polypropylene three-phase composite material and preparation method and application thereof |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4101513A (en) * | 1977-02-02 | 1978-07-18 | Minnesota Mining And Manufacturing Company | Catalyst for condensation of hydrolyzable silanes and storage stable compositions thereof |
GB2013208B (en) * | 1977-12-16 | 1982-11-24 | Gen Electric | Heat curable compositions |
-
1980
- 1980-11-27 ZA ZA00807425A patent/ZA807425B/en unknown
- 1980-12-04 GB GB8038899A patent/GB2066278B/en not_active Expired
- 1980-12-23 DE DE19803048636 patent/DE3048636A1/en active Granted
- 1980-12-24 FR FR8027500A patent/FR2472592B1/en not_active Expired
- 1980-12-24 JP JP18216180A patent/JPS56106958A/en active Granted
- 1980-12-24 AU AU65838/80A patent/AU6583880A/en not_active Abandoned
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2598149A1 (en) * | 1986-04-30 | 1987-11-06 | Gen Electric | COMPOSITIONS OF POLYMERIC SEQUENCES. |
BE1001638A4 (en) * | 1986-04-30 | 1990-01-09 | Gen Electric | Sequence polymer compositions. |
EP0259757A3 (en) * | 1986-09-02 | 1990-06-27 | Wacker-Chemie Gmbh | Pigmented compositions cross-linkable into organic polysiloxane elastomers |
US5086087A (en) * | 1988-03-25 | 1992-02-04 | Stamicarbon B.V. | Composition containing uv curable unsaturated monomers and/or oligomers, a photoinitiator and colloidal silica with an oragnosilane compound, and the application of this composition in coatings |
US5342658A (en) * | 1991-12-30 | 1994-08-30 | Lucky Limited | Abrasion resistant silicone coating composition |
CN110770289A (en) * | 2017-06-29 | 2020-02-07 | 陶氏环球技术有限责任公司 | Polyolefin compositions |
CN110770289B (en) * | 2017-06-29 | 2022-09-02 | 陶氏环球技术有限责任公司 | Polyolefin compositions |
US11693318B2 (en) * | 2018-07-17 | 2023-07-04 | Shin-Etsu Chemical Co., Ltd. | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and black matrix |
WO2021064534A2 (en) | 2019-10-03 | 2021-04-08 | 3M Innovative Properties Company | Silicone elastomers by free radical mediated cure |
US20220332898A1 (en) * | 2019-10-03 | 2022-10-20 | 3M Innovative Properties Company | Silicone elastomers by free radical mediated cure |
US12234389B2 (en) * | 2019-10-03 | 2025-02-25 | 3M Innovative Properties Company | Silicone elastomers by free radical mediated cure |
Also Published As
Publication number | Publication date |
---|---|
JPS56106958A (en) | 1981-08-25 |
JPS6359423B2 (en) | 1988-11-18 |
DE3048636C2 (en) | 1989-04-20 |
FR2472592B1 (en) | 1985-11-22 |
AU6583880A (en) | 1981-07-02 |
DE3048636A1 (en) | 1981-09-17 |
FR2472592A1 (en) | 1981-07-03 |
GB2066278B (en) | 1984-10-24 |
ZA807425B (en) | 1982-02-24 |
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