GB2046990B - Mounting arrangements for high power electronic components - Google Patents

Mounting arrangements for high power electronic components

Info

Publication number
GB2046990B
GB2046990B GB7913274A GB7913274A GB2046990B GB 2046990 B GB2046990 B GB 2046990B GB 7913274 A GB7913274 A GB 7913274A GB 7913274 A GB7913274 A GB 7913274A GB 2046990 B GB2046990 B GB 2046990B
Authority
GB
United Kingdom
Prior art keywords
electronic components
high power
power electronic
mounting arrangements
arrangements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7913274A
Other versions
GB2046990A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AEI Semiconductors Ltd
Original Assignee
AEI Semiconductors Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AEI Semiconductors Ltd filed Critical AEI Semiconductors Ltd
Priority to GB7913274A priority Critical patent/GB2046990B/en
Publication of GB2046990A publication Critical patent/GB2046990A/en
Application granted granted Critical
Publication of GB2046990B publication Critical patent/GB2046990B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB7913274A 1979-04-17 1979-04-17 Mounting arrangements for high power electronic components Expired GB2046990B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB7913274A GB2046990B (en) 1979-04-17 1979-04-17 Mounting arrangements for high power electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7913274A GB2046990B (en) 1979-04-17 1979-04-17 Mounting arrangements for high power electronic components

Publications (2)

Publication Number Publication Date
GB2046990A GB2046990A (en) 1980-11-19
GB2046990B true GB2046990B (en) 1983-05-18

Family

ID=10504584

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7913274A Expired GB2046990B (en) 1979-04-17 1979-04-17 Mounting arrangements for high power electronic components

Country Status (1)

Country Link
GB (1) GB2046990B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5940273A (en) * 1998-06-08 1999-08-17 Inductotherm Corp. Semiconductor clamping device
US6081427A (en) * 1999-09-30 2000-06-27 Rockwell Technologies, Llc Retainer for press-pack semi-conductor device
CN108766944B (en) * 2018-05-30 2024-02-09 江阴市赛英电子股份有限公司 Thyristor radiator for soft start and surface processing method thereof
US11488927B2 (en) 2021-02-18 2022-11-01 Abb Schweiz Ag Press-pack semiconductor fixtures

Also Published As

Publication number Publication date
GB2046990A (en) 1980-11-19

Similar Documents

Publication Publication Date Title
DE3062916D1 (en) Electronic parts mounting apparatus
JPS55118698A (en) Device for mounting electronic part
HK73286A (en) Power circuit for an electronic timepiece
JPS55138291A (en) Substrate for mounting electric parts
JPS5694365A (en) Device for mounting electrical parts
GB2064225B (en) Mounting assembly for electrical devices
JPS55125037A (en) Electronic device power supply circuit for vehicle
JPS5643716A (en) Solid*layerrbuilt electronic circuit parts
GB2046990B (en) Mounting arrangements for high power electronic components
JPS5630799A (en) Housing for electronic equipment
JPS566422A (en) Electronic circuit
JPS55121229A (en) Electronic part mounting substrate
JPS5638892A (en) Apparatus for mounting electronic part
GB2051474B (en) Mounting arrangements for electrical components
GB2044528B (en) Mounting arrangements for high power electronic components
GB2100067B (en) Mounting arrangements for electrical power circuits
JPS5618500A (en) Module for electronic equipment
GB2047473B (en) Mounting assemblies for electrical components
JPS5558591A (en) Structure for mounting electronic watch circuit
JPS56103381A (en) Alarmmattached electronic clock circuit
JPS5645576A (en) Electronic circuit parts
JPS566421A (en) Electronic circuit
GB2130439B (en) Enclosure for electrical components
JPS5596699A (en) Structure for cooling electronic part
JPS5661191A (en) Electric part mounting board

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee