GB202310273D0 - A wedge shaped cleaver for side entry - Google Patents

A wedge shaped cleaver for side entry

Info

Publication number
GB202310273D0
GB202310273D0 GBGB2310273.4A GB202310273A GB202310273D0 GB 202310273 D0 GB202310273 D0 GB 202310273D0 GB 202310273 A GB202310273 A GB 202310273A GB 202310273 D0 GB202310273 D0 GB 202310273D0
Authority
GB
United Kingdom
Prior art keywords
wedge shaped
side entry
cleaver
shaped cleaver
entry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB2310273.4A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Haizhiyi Semiconductor Tools Co Ltd
Original Assignee
Shenzhen Haizhiyi Semiconductor Tools Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Haizhiyi Semiconductor Tools Co Ltd filed Critical Shenzhen Haizhiyi Semiconductor Tools Co Ltd
Publication of GB202310273D0 publication Critical patent/GB202310273D0/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/02—Carriages for supporting the welding or cutting element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78315—Shape of the pressing surface, e.g. tip or head

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
GBGB2310273.4A 2022-12-26 2023-07-05 A wedge shaped cleaver for side entry Ceased GB202310273D0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211682634.0A CN116053151B (en) 2022-12-26 2022-12-26 Wedge-shaped riving knife with side incoming line

Publications (1)

Publication Number Publication Date
GB202310273D0 true GB202310273D0 (en) 2023-08-16

Family

ID=86121104

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB2310273.4A Ceased GB202310273D0 (en) 2022-12-26 2023-07-05 A wedge shaped cleaver for side entry

Country Status (2)

Country Link
CN (1) CN116053151B (en)
GB (1) GB202310273D0 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179214A (en) * 2002-11-25 2004-06-24 Sony Corp Cutting method of bonding wire and bonding capillary
CN214978683U (en) * 2021-01-04 2021-12-03 无锡精蓉创材料科技有限公司 Micro-electronic micro-connection deep cavity welding cleaver with smooth wire feeding oblique angle structure
CN214588746U (en) * 2021-01-28 2021-11-02 厦门虹鹭钨钼工业有限公司 Wedge-shaped cleaver suitable for superfine-spacing wire bonding process
CN113787250B (en) * 2021-07-27 2023-01-10 中国电子科技集团公司第二十九研究所 Promote wedge riving knife structure of lead bonding precision
CN215919404U (en) * 2021-10-22 2022-03-01 常州市润祥电子科技有限公司 Multi-wire-groove riving knife capable of improving riving knife bonding efficiency

Also Published As

Publication number Publication date
CN116053151B (en) 2024-04-09
CN116053151A (en) 2023-05-02

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)