GB202306059D0 - Dielectricity and thermal conductivity enhanced bio-based high-temperature-resistant epoxy resin, preparation method therefor, and application thereof - Google Patents

Dielectricity and thermal conductivity enhanced bio-based high-temperature-resistant epoxy resin, preparation method therefor, and application thereof

Info

Publication number
GB202306059D0
GB202306059D0 GBGB2306059.3A GB202306059A GB202306059D0 GB 202306059 D0 GB202306059 D0 GB 202306059D0 GB 202306059 A GB202306059 A GB 202306059A GB 202306059 D0 GB202306059 D0 GB 202306059D0
Authority
GB
United Kingdom
Prior art keywords
dielectricity
preparation
epoxy resin
temperature
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GBGB2306059.3A
Other versions
GB2616136A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Tech University
Original Assignee
Nanjing Tech University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Tech University filed Critical Nanjing Tech University
Publication of GB202306059D0 publication Critical patent/GB202306059D0/en
Publication of GB2616136A publication Critical patent/GB2616136A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
GB2306059.3A 2020-09-27 2021-04-14 Dielectricity and thermal conductivity enhanced bio-based high-temperature-resistant epoxy resin, preparation method therefor, and application thereof Pending GB2616136A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011030506.9A CN112142953A (en) 2020-09-27 2020-09-27 Dielectric and heat conduction enhanced bio-based high-temperature-resistant epoxy resin and preparation method and application thereof
PCT/CN2021/087179 WO2022062370A1 (en) 2020-09-27 2021-04-14 Dielectricity and thermal conductivity enhanced bio-based high-temperature-resistant epoxy resin, preparation method therefor, and application thereof

Publications (2)

Publication Number Publication Date
GB202306059D0 true GB202306059D0 (en) 2023-06-07
GB2616136A GB2616136A (en) 2023-08-30

Family

ID=73895505

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2306059.3A Pending GB2616136A (en) 2020-09-27 2021-04-14 Dielectricity and thermal conductivity enhanced bio-based high-temperature-resistant epoxy resin, preparation method therefor, and application thereof

Country Status (3)

Country Link
CN (1) CN112142953A (en)
GB (1) GB2616136A (en)
WO (1) WO2022062370A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112142953A (en) * 2020-09-27 2020-12-29 南京工业大学 Dielectric and heat conduction enhanced bio-based high-temperature-resistant epoxy resin and preparation method and application thereof
CN113896694B (en) * 2021-11-16 2022-12-06 韦尔通(厦门)科技股份有限公司 Polyfunctional group hybrid epoxy compound and photo-thermal dual-curing resin composition as well as preparation method and application thereof
CN114315814B (en) * 2021-12-29 2022-10-21 南京工业大学 Honokiol/glycosyl furan biobased epoxy resin monomer and preparation method and application thereof
CN114395110B (en) * 2022-01-30 2023-04-07 南京工业大学 All-bio-based cyano epoxy resin and green preparation method thereof
CN116178356A (en) * 2022-11-02 2023-05-30 南京工业大学 Magnolol/glycosyl furan bis-bio-based epoxy resin monomer, and preparation method and application thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107603412B (en) * 2017-10-16 2019-09-17 长春顺风新材料有限公司 A kind of antimicrobial coating material and preparation method thereof
FR3073223B1 (en) * 2017-11-07 2019-11-15 Arianegroup Sas PLURIEPOXIDE BIPHENYL COMPOUNDS, PREPARATION AND USES
CN109467677A (en) * 2018-09-30 2019-03-15 江苏和和新材料股份有限公司 A kind of biobased epoxy resin composition and its preparing the application in epoxy resin glue film
CN109734684B (en) * 2018-12-20 2020-08-11 中国科学院宁波材料技术与工程研究所 Bio-based flame-retardant epoxy resin precursor based on natural phenolic monomers, and preparation method and application thereof
CN110408003B (en) * 2019-07-02 2022-03-29 大连理工大学 Preparation method of bio-based epoxy resin based on natural magnolia bark derivatives
CN110607077B (en) * 2019-09-27 2021-08-31 西南石油大学 Bio-based thermosetting resin composite material and preparation method thereof
CN111286009A (en) * 2020-02-19 2020-06-16 中科院广州化学有限公司 Self-repairable epoxy resin material and preparation method and application thereof
CN112142953A (en) * 2020-09-27 2020-12-29 南京工业大学 Dielectric and heat conduction enhanced bio-based high-temperature-resistant epoxy resin and preparation method and application thereof

Also Published As

Publication number Publication date
GB2616136A (en) 2023-08-30
WO2022062370A1 (en) 2022-03-31
CN112142953A (en) 2020-12-29

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