Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB2106180.9A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sporomex Ltd
Original Assignee
Sporomex Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sporomex LtdfiledCriticalSporomex Ltd
Priority to GBGB2106180.9ApriorityCriticalpatent/GB202106180D0/en
Publication of GB202106180D0publicationCriticalpatent/GB202106180D0/en
Priority to PCT/GB2022/050516prioritypatent/WO2022200762A1/en
Priority to EP22714231.2Aprioritypatent/EP4312996A1/en
Microelectromechanical system (mems) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3d ic) integration (3d ic)(mems)